CM6200

CM6200 Advance Information EMI Filters with ESD Protection for Microphone Interface http://onsemi.com Description ON Semiconductor’s CM6200 is a 3x3, 8−bump EMI filter with ESD protection device for microphone interface applications in a CSP form factor, 0.4 mm pitch. The CM6200 is fully compliant with IEC 61000−4−2 and is also RoHS II compliant. WLCSP−8 PLASTIC CASE 567CF Features • This Device is Pb−Free, Halogen Free/BFR Free and is RoHS Compliant PACKAGE PINOUT 3 2 1 A A3 A2 B B3 B2 B1 C C3 C2 C1 A1 A1 Corner Indicator (Bottom View) Figure 1. Electrical Schematic MARKING DIAGRAM Orientation Marking 62 WWY 62 WWY = CM6200 = Date Code ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. This document contains information on a new product. Specifications and information herein are subject to change without notice. © Semiconductor Components Industries, LLC, 2010 October, 2010 − Rev. P5 1 Publication Order Number: CM6200/D CM6200 Pin Information Table 1. PIN DESCRIPTIONS Pin Description Pin Description A2 ECI B3 ASICp (Internal) A3 Mic_Bias C1 Mic2n (External) B1 Mic2p (External) C2 GND B2 GND C3 ASICn (Internal) Electrical Specifications and Conditions Table 2. PARAMETERS AND OPERATING CONDITIONS Parameter Rating Units Storage Temperature Range −55 to +150 °C Operating Temperature Range −40 to +85 °C Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Parameter Conditions Min Typ Max Units R11 Bias Resistance 1.9 2.0 2.1 kW R12 Resistance 0.8 1.0 1.2 kW R21 Resistance 1.76 2.20 2.64 kW R22 Resistance 1.76 2.20 2.64 kW R31 Resistance 20 25 30 W C11, C12 Pin Capacitance At 1 MHz, VIN = 0 V 0.67 0.83 1.0 nF C21, C22 Pin Capacitance At 1 MHz, VIN = 0 V 1.0 1.25 ILEAK_B Leakage Current from Pins B1 to B2 VIN = 5 V; B3, A2 and A3 floating. C1, C2, and C3 grounded. 1.0 ILEAK_C Diode Leakage Current from Filter C VIN = 5 V; (Note 3) 1.0 Breakdown Voltage (Positive) If = +1 mA (Filter B only); (Note 3) Breakdown Voltage (Negative) If = −1 mA (Filter B only); (Note 3) ESD Protection Peak Discharge Voltage at B1 and C1 pins a) Contact discharge per IEC 61000−4−2 standard and b) Air discharge per IEC 61000−4−2 standard (Note 2) ESD Protection Peak Discharge Voltage at A2, A3, B3, and C3 pins a) Contact discharge per IEC 61000−4−2 standard and b) Air discharge per IEC 61000−4−2 standard (Note 2) VB VESD nF 100 nA nA 13 V −13 V kV ±15 ±15 kV ±2 ±2 1. All parameters specified at TA = 25°C unless otherwise noted. 2. Standard IEC 61000−4−2 with CDischarge = 150 pF, RDischarge = 330 W. 3. Filter C parameters are guaranteed by similarity to Filter B. http://onsemi.com 2 CM6200 Performance Information Simulation Figure 2. Typical Insertion Loss (Bias = 0 V, TA = 25°C; 50 W Environment) RF Characteristics Figure 3. Typical Insertion Loss for Filter B (Bias = 0 V, TA = 25°C; 50 W Environment); Pins A2 and A3 Floating http://onsemi.com 3 CM6200 RF Characteristics Figure 4. Typical Insertion Loss for Filter C (Bias = 0 V, TA = 25°C; 50 W Environment) Vertical Structure Specification* VERTICAL STRUCTURE DIMENSIONS (nominal) Ref. Figure 5. Sectional View Parameter Dimension a Die Thickness Silicon 396 mm h Repassivation Polyimide 10 mm d UBM−(Ti/Cu) Plated Cu 7.0 mm Sputtered Cu 0.4 mm Sputtered Ti 0.1 mm e UBM Wetting Area Diameter 240 mm b Bump Standoff 194 mm f Solder Bump Diameter after Bump Reflow 270 mm c Metal Pad Height g Metal Pad Diameter D1 *Daisy Chain CM6000 http://onsemi.com AlSiCu 1.5 mm 310 mm 0.406 mm D2 4 Material Finished Thickness 0.600 mm CM6200 Table 4. CSP TAPE AND REEL SPECIFICATIONS † Part Number Chip Size (mm) Pocket Size (mm) B0 X A0 X K0 Tape Width W Reel Dia. Qty Per Reel P0 P1 CM6200 1.20 X 1.20 X 0.60 1.346 X 1.346 X 0.729 8 mm 178 mm (7″) 5000 4 mm 4 mm †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Î ÎÎ Î ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ + + + Figure 6. Tape and Reel Mechanical Data http://onsemi.com 5 CM6200 PACKAGE DIMENSIONS WLCSP8, 1.2x1.2 CASE 567CF−01 ISSUE O ÈÈ ÈÈ D PIN A1 REFERENCE 2X 0.05 C 2X 0.05 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. A B E DIM A A1 A2 b D E e TOP VIEW A2 0.05 C RECOMMENDED SOLDERING FOOTPRINT* A 0.05 C NOTE 3 8X A1 0.03 C A1 SEATING PLANE PACKAGE OUTLINE 8X e b 0.05 C A B C SIDE VIEW MILLIMETERS MIN MAX 0.63 0.57 0.17 0.24 0.41 REF 0.24 0.29 1.20 BSC 1.20 BSC 0.40 BSC e 0.40 PITCH C 0.25 0.40 PITCH B A DIMENSIONS: MILLIMETERS 1 2 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. BOTTOM VIEW Ordering Information Table 5. PART NUMBERING INFORMATION Bumps Package Ordering Part Number (Note 4) Part Marking 8 CSP−SAC105 CM6200 62 4. Parts are shipped in Tape and Reel form unless otherwise specified. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 6 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative CM6200/D