CM6205

CM6205 EMI Filters with ESD Protection for Audio Description The CM6205 is a 3x2, 5−bump EMI filter with ESD protection device for an audio interface in a CSP form factor, 0.4 mm pitch. The CM6205 is fully compliant with IEC 61000−4−2 and is also RoHS II compliant. http://onsemi.com Features • This Device is Pb−Free, Halogen Free/BFR Free and is RoHS Compliant WLCSP−5 CASE 567CC PACKAGE PINOUT A1 Corner Indicator 1 2 A1 A2 A B2 B C2 C A1 C1 Figure 1. Electrical Schematic (Bottom View) MARKING DIAGRAM Orientation Marking 5 yw 5yw = CM6205 = Date Code ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2011 February, 2011 − Rev. 0 1 Publication Order Number: CM6205/D CM6205 Pin Information Table 1. PIN DESCRIPTIONS Pin Description Pin Description A1 Channel 1 Internal A2 Channel 1 External B2 GND C1 Channel 2 Internal C2 Channel 2 External Electrical Specifications and Conditions Table 2. PARAMETERS AND OPERATING CONDITIONS Parameter Rating Units Storage Temperature Range −55 to +150 °C Operating Temperature Range −40 to +85 °C Power Dissipation per Channel 100 mW Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Parameter Conditions R1, R2 Resistance C1, C2 Pin Capacitance At 1 MHz, VIN = 0 V ILEAK Leakage Current per Channel VIN = 5 V, other pins floating VBR Breakdown Voltage (Positive) IR = +1 mA Breakdown Voltage (Negative) IR = −1 mA ESD Protection Peak Discharge Voltage at A2 and C2 pins a) Contact discharge per IEC 61000−4−2 standard b) Air discharge per IEC 61000−4−2 standard (Note 2) ESD Protection Peak Discharge Voltage at A1 and C1 pins a) Contact discharge per IEC 61000−4−2 standard b) Air discharge per IEC 61000−4−2 standard (Note 2) VESD Min Typ Max Units 13.5 15 16.5 W 4 5 6 nF 1.0 100 nA 14 V −14 V kV ±15 ±15 kV ±2 ±2 1. All parameters specified at TA = 25°C unless otherwise noted. 2. Standard IEC 61000−4−2 with CDischarge = 150 pF, RDischarge = 330 W. http://onsemi.com 2 CM6205 Performance Information Figure 2. Typical Insertion Loss (Bias = 0 V, TA = 25°C; 50 W Environment) http://onsemi.com 3 CM6205 Vertical Structure Specification* VERTICAL STRUCTURE DIMENSIONS (nominal) Ref. Figure 3. Sectional View Parameter Material Dimension a Die Thickness Silicon 396 mm h Repassivation Polyimide 10 mm d UBM−(Ti/Cu) Plated Cu 7.0 mm Sputtered Cu 0.4 mm Sputtered Ti 0.1 mm e UBM Wetting Area Diameter 240 mm b Bump Standoff 194 mm f Solder Bump Diameter after Bump Reflow 270 mm c Metal Pad Height g Metal Pad Diameter AlSiCu 1.5 mm 284 mm 0.406 mm D2 Finished Thickness D1 0.600 mm *Daisy Chain CM6004 Table 4. CSP TAPE AND REEL SPECIFICATIONS † Part Number Chip Size (mm) Pocket Size (mm) B0 X A0 X K0 Tape Width W Reel Dia. Qty Per Reel P0 P1 CM6205 1.20 X 0.80 X 0.60 1.35 X 0.95 X 0.70 8 mm 178 mm (7″) 5000 4 mm 4 mm †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Î Î Î Î ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ + + + Figure 4. Tape and Reel Mechanical Data http://onsemi.com 4 CM6205 PACKAGE DIMENSIONS WLCSP5, 0.80x1.20 CASE 567CC−01 ISSUE O 2X D 0.05 C 2X 0.05 C A È È PIN A1 REFERENCE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B E DIM A A1 A2 b D E e TOP VIEW A2 MILLIMETERS MIN MAX 0.57 0.63 0.17 0.24 0.41 REF 0.24 0.29 0.80 BSC 1.20 BSC 0.40 BSC 0.05 C RECOMMENDED SOLDERING FOOTPRINT* A 0.05 C NOTE 3 5X A1 b 0.05 C A B 0.03 C SIDE VIEW C PACKAGE OUTLINE 0.40 PITCH SEATING PLANE e e A A1 B 0.40 PITCH C 1 2 5X 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. BOTTOM VIEW Ordering Information Table 5. PART NUMBERING INFORMATION Bumps Package Ordering Part Number (Note 3) Part Marking (Date Code) 5 CSP−SAC105 CM6205 5yw 3. Parts are shipped in Tape and Reel form unless otherwise specified. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 5 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative CM6205/D