CM6300

CM6300 EMI Filters with ESD Protection for SIM Card Applications Product Description http://onsemi.com The CM6300 is a 3 x 3, 8−bump EMI filter with ESD protection device for SIM card applications in 0.5 mm pitch CSP form factor. It is fully compliant with IEC 61000−4−2. The CM6300 is RoHS II compliant. Table 1. PIN DESCRIPTIONS WLCSP8 CASE 567CD 8−bump CSP Package Pin Description A2 Channel 1 External A3 Channel 1 Internal B1 Channel 2 External B2 GND B3 Channel 2 Internal C1 Channel 3 External C2 V External C3 Channel 3 Internal MARKING DIAGRAM + 632 WWYY 632 = CM6300 WWYY = Date Code ORDERING INFORMATION PACKAGE / PINOUT DIAGRAMS Top View (Bumps Down View) Orientation Marking 1 A 2 3 + 632 B Bottom View (Bumps Up View) C 3 2 A A3 A2 B B3 B2 B1 C C3 C2 C1 Device Package Shipping† CM6300 CSP−8 (Pb−Free) 5000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 1 A1 Orientation Marking ELECTRICAL SCHEMATIC R1 R2 R3 O1 (A3) O2 (B3) O3 (C3) I1 (A2) I2 (B1) I3 (C1) External Internal V (C2) {External} GND (B2) © Semiconductor Components Industries, LLC, 2011 April, 2011 − Rev. 7 1 Publication Order Number: CM6300/D CM6300 ELECTRICAL SPECIFICATIONS AND CONDITIONS Table 2. PARAMETERS AND OPERATING CONDITIONS Rating Units Storage Temperature Range Parameter –55 to +150 °C Operating Temperature Range –40 to +85 °C Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Parameter Conditions Min Typ Max Units R1 Resistance 80 100 120 W R2 Resistance 37.6 47 56.4 W R3 Resistance 80 100 120 W C Capacitance on filter channels 1, 2 and 3 At 1 MHz, VIN = 0 V 13.4 16.7 20 pF Capacitance on clamp channel (pin C2) At 1 MHz, VIN = 0 V 8.2 10.3 12.4 pF Breakdown Voltage (Positive) IF = 8 mA 6 6.8 20 V ESD Protection Peak Discharge Voltage at A2, B1 and C1 pins a) Contact Discharge per IEC 61000−4−2 standard b) Air Discharge per IEC 61000−4−2 standard (Note 2) ESD Protection Peak Discharge Voltage at C2 pin a) Contact Discharge per IEC 61000−4−2 standard b) Air Discharge per IEC 61000−4−2 standard (Note 2) ESD Protection Peak Discharge Voltage at A3, B3 and C3 pins a) Contact Discharge per IEC 61000−4−2 standard b) Air Discharge per IEC 61000−4−2 standard (Note 2) VB VESD ±15 ±15 ±15 ±15 ±4 ±4 1. All parameters specified at TA = 25°C unless otherwise noted. 2. Standard IEC 61000−4−2 with CDischarge = 150 pF, RDischarge = 330 W. MECHANICAL SPECIFICATION Vertical Structure Specification* Table 4. VERTICAL STRUCTURE DIMENSIONS (nominal) Ref. Parameter Material Dimension Silicon 396 mm a Die Thickness h Repassivation Polyimide 10 mm UBM−(Ti/Cu) Plated Cu 5.0 mm Sputtered Cu 0.4 mm Sputtered Ti 0.1 mm d e UBM Wetting Area Diameter 280 mm b Bump Standoff 240 mm f Solder Bump Diameter after Bump Reflow 320 mm c Metal Pad Height g Metal Pad Diameter 60 mm D1 Finished Thickness 0.650 mm D2 AlSiCu 1.5 mm 0.406 mm Figure 1. Sectional View * Daisy Chain CM6020 http://onsemi.com 2 kV kV kV CM6300 RF CHARACTERISTICS Figure 2. Insertion Loss, Filter 1 (pins A2, A3) and Filter 3 (pins C1, C3) (Bias = 0 V, TA = 255C) Figure 3. Insertion Loss, Filter 2 (pins B1, B3) (Bias = 0 V, TA = 255C) http://onsemi.com 3 CM6300 PACKAGE DIMENSIONS WLCSP8, 1.6x1.6 CASE 567CD−01 ISSUE O ÈÈ PIN A1 REFERENCE 2X D A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. E DIM A A1 A2 b D E e 0.05 C 2X 0.05 C TOP VIEW A2 MILLIMETERS MIN MAX 0.69 0.61 0.21 0.27 0.41 REF 0.29 0.34 1.60 BSC 1.60 BSC 0.50 BSC 0.05 C RECOMMENDED SOLDERING FOOTPRINT* A 0.05 C NOTE 3 8X A1 0.03 C A1 SEATING PLANE PACKAGE OUTLINE e b 0.05 C A B C SIDE VIEW e 8X C 0.50 PITCH B A 1 2 0.25 0.50 PITCH DIMENSIONS: MILLIMETERS 3 BOTTOM VIEW *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 4 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative CM6300/D