CS5201-3GDPR3G

CS5201−3 1.0 A, 3.3 V Fixed Linear Regulator The CS5201−3 linear regulator provides 1.0 A @ 3.3 V reference at 1.0 A with an output voltage accuracy of ±1.5%. This regulator is intended for use as a post regulator and microprocessor supply. The fast loop response and low dropout voltage make this regulator ideal for applications where low voltage operation and good transient response are important. The circuit is designed to operate with dropout voltages less than 1.2 V at 1.0 A output current. The maximum quiescent current is only 10 mA at full load. Device protection includes overcurrent and thermal shutdown. The CS5201−3 is pin compatible with the LT1086 family of linear regulators. The regulator is available in TO−220−3, surface mount D2, and SOT−223 packages. Features http://onsemi.com TO−220−3 T SUFFIX CASE 221A 1 2 3 D2PAK−3 DP SUFFIX CASE 418AB Tab = VOUT Pin 1. GND 2. VOUT 3. VIN • • • • • • Pb−Free Package is Available Output Current to 1.0 A Output Accuracy to ±1.5% Overtemperature Dropout Voltage (typical) 1.0 V @ 1.0 A Fast Transient Response Fault Protection ♦ Current Limit ♦ Thermal Shutdown 12 3 SOT−223 ST SUFFIX CASE 318E 1 23 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. VIN VOUT DEVICE MARKING INFORMATION 3.3 V @ 1.0 A See general marking information in the device marking section on page 6 of this data sheet. CS5201−3 GND 10 mF 5.0 V 22 mF 5.0 V Figure 1. Applications Diagram © Semiconductor Components Industries, LLC, 2006 September, 2006 − Rev. 8 1 Publication Order Number: CS5201−3/D CS5201−3 MAXIMUM RATINGS Parameter Supply Voltage, VIN Operating Temperature Range Junction Temperature Storage Temperature Range Lead Temperature Soldering: ESD Damage Threshold (Human Body Model) Wave Solder (through hole styles only) (Note 1) Reflow (SMD styles only) (Note 2) Value 7.0 −40 to +70 150 −60 to +150 260 Peak 230 Peak 2.0 Unit V °C °C °C °C °C kV Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. 10 second maximum. 2. 60 second maximum above 183°C. ELECTRICAL CHARACTERISTICS (CIN = 10 mF, COUT = 22 mF Tantalum, VOUT + VDROPOUT < VIN < 7.0 V, 0°C ≤ TA ≤ 70°C, TJ ≤ +150°C, unless otherwise specified, Ifull load = 1.0 A) Characteristic Fixed Output Voltage Reference Voltage (Notes 3 and 4) Line Regulation Load Regulation (Notes 3 and 4) Dropout Voltage (Note 5) Current Limit Quiescent Current Thermal Regulation (Note 6) Ripple Rejection (Note 6) Thermal Shutdown (Note 7) Thermal Shutdown Hysteresis (Note 7) VIN − VOUT = 1.5 V; 0 ≤ IOUT ≤ 1.0 A 2.0 V ≤ VIN − VOUT ≤ 3.7 V; IOUT = 10 mA VIN − VOUT = 2.0 V; 10 mA ≤ IOUT ≤ 1.0 A IOUT = 1.0 A VIN − VOUT = 3.0 V IOUT = 10 mA 30 ms Pulse, TA = 25°C f = 120 Hz; IOUT = 1.0 A; VIN − VOUT = 3.0 V; VRIPPLE = 1.0 VPP − − 3.250 (−1.5%) − − − 1.0 − − − 150 − 3.300 0.02 0.04 1.0 3.1 5.0 0.002 80 180 25 3.350 (+1.5%) 0.20 0.4 1.2 − 10 0.020 − 210 − V % % V A mA %/W dB °C °C Test Conditions Min Typ Max Unit 3. Load regulation and output voltage are measured at a constant junction temperature by low duty cycle pulse testing. Changes in output voltage due to temperature changes must be taken into account separately. 4. Specifications apply for an external Kelvin sense connection at a point on the output pin 1/4” from the bottom of the package. 5. Dropout voltage is a measurement of the minimum input/output differential at full load. 6. Guaranteed by design, not 100% tested in production. 7. Thermal shutdown is 100% functionally tested in production. PACKAGE PIN DESCRIPTION Package Pin Number TO−220−3 1 2 3 D2PAK−3 1 2 3 SOT−223 1 2 3 Pin Symbol GND VOUT VIN Ground connection. Regulated output voltage (case). Input voltage. Function http://onsemi.com 2 CS5201−3 VIN VOUT Output Current Limit Thermal Shutdown Bandgap Reference GND −+ Error Amplifier Figure 2. Block Diagram TYPICAL PERFORMANCE CHARACTERISTICS 1.00 Output Voltage Deviation (%) 800 1000 0.10 TCASE = 0°C TCASE = 25°C 0.08 0.06 0.04 0.02 0.00 −0.02 −0.04 −0.06 −0.08 −0.10 −0.12 0.95 VDROPOUT (V) 0.90 0.85 0.80 0.75 TCASE = 125°C 0 200 400 600 0 10 20 30 40 50 60 70 80 90 100 110 120 130 IOUT (mA) TJ (°C) Figure 3. Dropout Voltage vs. Output Current 0.100 Output Voltage Deviation (%) 85 75 Ripple Rejection (dB) 0.075 65 55 45 35 25 TCASE = 0°C 0 1 2 Figure 4. Reference Voltage vs. Temperature 0.050 TCASE = 25°C TCASE = 25°C 0.025 TCASE = 125°C IOUT = 1.0 A (VIN − VOUT) = 3.0 V VRIPPLE = 1.0 VPP 0.000 15 101 102 103 104 105 106 Output Current (A) Frequency (Hz) Figure 5. Load Regulation vs. Output Current Figure 6. Ripple Rejection vs. Frequency http://onsemi.com 3 CS5201−3 Voltage Deviation (mV) 300 200 100 0 ISC (A) 0 1 2 3 4 5 6 7 8 9 10 3.5 3.3 3.1 2.9 2.7 2.5 2.3 2.1 1.9 1.7 1.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 −100 −200 1000 500 0 Load Step (mA) Time (mS) COUT = CIN = 22 mF Tantalum VIN − VOUT (V) Figure 7. Transient Response Figure 8. Short Circuit Current vs. VIN − VOUT APPLICATIONS INFORMATION The CS5201−3 linear regulator provides a fixed 3.3 V output voltage at currents up to 1.0 A. The regulator is protected against overcurrent conditions and includes thermal shutdown. The CS5201−3 has a composite PNP−NPN output transistor and requires an output capacitor for stability. A detailed procedure for selecting this capacitor is included in the Stability Considerations section. Stability Considerations ceramic capacitors in parallel. This reduces the overall ESR and reduces the instantaneous output voltage drop under transient load conditions. The output capacitor network should be as close to the load as possible for the best results. Protection Diodes The output compensation capacitor helps determine three main characteristics of a linear regulator: startup delay, load transient response, and loop stability. The capacitor value and type is based on cost, availability, size and temperature constraints. A tantalum or aluminum electrolytic capacitor is best, since a film or ceramic capacitor with almost zero ESR can cause instability. The aluminum electrolytic capacitor is the least expensive solution. However, when the circuit operates at low temperatures, both the value and ESR of the capacitor will vary considerably. The capacitor manufacturer’s data sheet provides this information. A 22 mF tantalum capacitor will work for most applications, but with high current regulators such as the CS5201−3 the transient response and stability improve with higher values of capacitance. The majority of applications for this regulator involve large changes in load current so the output capacitor must supply the instantaneous load current. The ESR of the output capacitor causes an immediate drop in output voltage given by: DV + DI ESR When large external capacitors are used with a linear regulator it is sometimes necessary to add protection diodes. If the input voltage of the regulator gets shorted, the output capacitor will discharge into the output of the regulator. The discharge current depends on the value of the capacitor, the output voltage and the rate at which VIN drops. In the CS5201−3 linear regulator, the discharge path is through a large junction and protection diodes are not usually needed. If the regulator is used with large values of output capacitance and the input voltage is instantaneously shorted to ground, damage can occur. In this case, a diode connected as shown in Figure 9 is recommended. IN4002 (Optional) VIN C1 VOUT VIN VOUT CS5201−3 GND C2 Figure 9. Protection Diode Scheme for Large Output Capacitors For microprocessor applications it is customary to use an output capacitor network consisting of several tantalum and http://onsemi.com 4 CS5201−3 Output Voltage Sensing Since the CS5201−3 is a three terminal regulator, it is not possible to provide true remote load sensing. Load regulation is limited by the resistance of the conductors connecting the regulator to the load. For best results the regulator should be connected as shown in Figure 10. RC Conductor Parasitic Resistance The maximum power dissipation for a regulator is: PD(max) + {VIN(max) * VOUT(min)}IOUT(max) ) VIN(max)IQ (2) VIN VIN VOUT CS5201−3 RLOAD where: VIN(max) is the maximum input voltage, VOUT(min) is the minimum output voltage, IOUT(max) is the maximum output current, for the application IQ is the maximum quiescent current at IOUT(max). A heatsink effectively increases the surface area of the package to improve the flow of heat away from the IC and into the surrounding air. Each material in the heat flow path between the IC and the outside environment has a thermal resistance. Like series electrical resistances, these resistances are summed to determine RqJA, the total thermal resistance between the junction and the surrounding air. 1. Thermal Resistance of the junction−to−case, RqJC (°C/W) 2. Thermal Resistance of the case to heatsink, RqCS (°C/W) 3. Thermal Resistance of the heatsink to the ambient air, RqSA (°C/W) These are connected by the equation: RqJA + RqJC ) RqCS ) RqSA (3) Figure 10. Conductor Parasitic Resistance Effects Can Be Minimized With the Above Grounding Scheme For Fixed Output Regulators Calculating Power Dissipation and Heatsink Requirements The CS5201−3 linear regulator includes thermal shutdown and current limit circuitry to protect the device. High power regulators such as these usually operate at high junction temperatures so it is important to calculate the power dissipation and junction temperatures accurately to ensure that an adequate heatsink is used. The case is connected to VOUT on the CS5201−3, electrical isolation may be required for some applications. Thermal compound should always be used with high current regulators such as these. The thermal characteristics of an IC depend on the following four factors: 1. 2. 3. 4. Maximum Ambient Temperature TA (°C) Power dissipation PD (Watts) Maximum junction temperature TJ (°C) Thermal resistance junction to ambient RqJA (°C/W) These four are related by the equation TJ + TA ) P D RqJA (1) The maximum ambient temperature and the power dissipation are determined by the design while the maximum junction temperature and the thermal resistance depend on the manufacturer and the package type. The value for RqJA is calculated using equation (3) and the result can be substituted in equation (1). The value for RqJC is 3.5°C/W for a given package type based on an average die size. For a high current regulator such as the CS5201−3 the majority of the heat is generated in the power transistor section. The value for RqSA depends on the heatsink type, while RqCS depends on factors such as package type, heatsink interface (is an insulator and thermal grease used?), and the contact area between the heatsink and the package. Once these calculations are complete, the maximum permissible value of RqJA can be calculated and the proper heatsink selected. For further discussion on heatsink selection, see application note “Thermal Management,” document number AND8036/D, available through the Literature Distribution Center or via our website at http://onsemi.com. http://onsemi.com 5 CS5201−3 ORDERING INFORMATION Device CS5201−3GT3 CS5201−3GDP3 CS5201−3GDPR3 CS5201−3GDPR3G CS5201−3GST3 CS5201−3GSTR3 Type* 1.0 A, 3.3 V Output 1.0 A, 3.3 V Output 1.0 A, 3.3 V Output 1.0 A, 3.3 V Output 1.0 A, 3.3 V Output 1.0 A, 3.3 V Output Package TO−220−3, STRAIGHT D2PAK−3 D2PAK−3 D2PAK−3 (Pb−Free) SOT−223 SOT−223 Shipping † 50 Units / Rail 50 Units / Rail 750 / Tape & Reel 750 / Tape & Reel 80 Units / Rail 2500 / Tape & Reel *Consult your local sales representative for other fixed output voltage versions. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MARKING DIAGRAMS D2PAK−3 DP SUFFIX CASE 418AB CS CS 5201−3 AWLYWW TO−220−3 T SUFFIX CASE 221A SOT−223 ST SUFFIX CASE 318E ALYW 201−3 1 5201−3 AWLYWW 1 1 A WL, L YY, Y WW, W = Assembly Location = Wafer Lot = Year = Work Week PACKAGE THERMAL DATA Parameter RqJC RqJA Typical Typical TO−220 THREE LEAD 3.5 50 D2PAK 3−PIN 3.5 10−50* SOT−223 15 156 Unit °C/W °C/W * Depending on thermal properties of substrate. RqJA = RqJC + RqCA http://onsemi.com 6 CS5201−3 PACKAGE DIMENSIONS TO−220 THREE LEAD T SUFFIX CASE 221A−08 ISSUE AA −T− − B− F T C S SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N Q R S T U V INCHES MIN MAX 0.560 0.625 0.380 0.420 0.140 0.190 0.025 0.035 0.139 0.155 0.100 BSC −−− 0.280 0.012 0.045 0.500 0.580 0.045 0.060 0.200 BSC 0.100 0.135 0.080 0.115 0.020 0.055 0.235 0.255 0.000 0.050 0.045 −−− MILLIMETERS MIN MAX 14.23 15.87 9.66 10.66 3.56 4.82 0.64 0.89 3.53 3.93 2.54 BSC −−− 7.11 0.31 1.14 12.70 14.73 1.15 1.52 5.08 BSC 2.54 3.42 2.04 2.92 0.51 1.39 5.97 6.47 0.00 1.27 1.15 −−− Q H 4 123 A U K −Y− L V G D 3 PL 0.25 (0.010) M R J B M N Y D2PAK−3 DP SUFFIX CASE 418AB−01 ISSUE O For D2PAK Outline and Dimensions − Contact Factory http://onsemi.com 7 CS5201−3 PACKAGE DIMENSIONS SOT−223 ST SUFFIX CASE 318E−04 ISSUE K A F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES DIM MIN MAX A 0.249 0.263 B 0.130 0.145 C 0.060 0.068 D 0.024 0.035 F 0.115 0.126 G 0.087 0.094 H 0.0008 0.0040 J 0.009 0.014 K 0.060 0.078 L 0.033 0.041 M 0_ 10 _ S 0.264 0.287 MILLIMETERS MIN MAX 6.30 6.70 3.30 3.70 1.50 1.75 0.60 0.89 2.90 3.20 2.20 2.40 0.020 0.100 0.24 0.35 1.50 2.00 0.85 1.05 0_ 10 _ 6.70 7.30 4 S 1 2 3 B L D G C J M 0.08 (0003) H K SOLDERING FOOTPRINT* 3.8 0.15 2.0 0.079 2.3 0.091 2.3 0.091 6.3 0.248 2.0 0.079 mm 1.5 SCALE 6:1 inches 0.059 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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