CS5203-1GDP3

CS5203−1 3.0 A Adjustable Linear Regulator The CS5203−1 linear regulator provides 3.0 A at adjustable output voltages with an accuracy of ±1.5 %. The device uses two external resistors to set the output voltage within a 1.25 V to 5.5 V range. The regulator is intended for use as a post regulator and microprocessor supply. The fast loop response and low dropout voltage make this regulator ideal for applications where low voltage operation and good transient response are important. The circuit is designed to operate with dropout voltages less than 1.4 V at 3.0 A output current. Device protection includes overcurrent and thermal shutdown. The CS5203−1 is pin compatible with the LT1085 family of linear regulators but has lower dropout voltage. The regulator is available in TO−220−3 and surface mount D2PAK−3 packages. Features • Output Current to 3.0 A • Output Accuracy to ±1.5% Over Temperature • Dropout Voltage (typical) 1.2 V @ 3.0 A • Fast Transient Response • Fault Protection − Current Limit − Thermal Shutdown 5.0 V VIN VOUT http://onsemi.com TO−220−3 T SUFFIX CASE 221A 1 Tab = VOUT Pin 1. Adj 2. VOUT 3. VIN 2 3 D2PAK−3 DP SUFFIX CASE 418AB 12 3 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet. DEVICE MARKING INFORMATION 3.3 V @ 3.0 A 124 W 1.0% 22 mF 5.0 V See general marking information in the device marking section on page 8 of this data sheet. CS5203−1 Adj 10 mF 5.0 V 0.1 mF 5.0 V 200 W 1.0% Figure 1. Applications Diagram © Semiconductor Components Industries, LLC, 2006 September, 2006 − Rev. 8 1 Publication Order Number: CS5203−1/D CS5203−1 MAXIMUM RATINGS* Parameter Supply Voltage, VIN Operating Temperature Range Junction Temperature Storage Temperature Range ESD Damage Threshold Lead Temperature Soldering: 1. 10 second maximum. 2. 60 second maximum above 183°C *The maximum package power dissipation must be observed. Wave Solder (through hole styles only) Note 1 Reflow (SMD styles only) Note 2 Value 7.0 −40 to +70 150 −60 to +150 2.0 260 Peak 230 Peak Unit V °C °C °C kV °C °C ELECTRICAL CHARACTERISTICS (CIN = 10 mF, COUT = 22 mF Tantalum, VOUT + VDROPOUT < VIN < 7.0 V, 0°C ≤ TA ≤ 70°C, TJ ≤ +150°C, unless otherwise specified, Ifull load = 3.0 A) Characteristic Adjustable Output Voltage Reference Voltage (Notes 3 and 4) Line Regulation Load Regulation (Notes 3 and 4) Dropout Voltage (Note 5) Current Limit Minimum Load Current (Note 6) Adjust Pin Current Thermal Regulation (Note 7) Ripple Rejection (Note 7) Thermal Shutdown (Note 8) Thermal Shutdown Hysteresis (Note 8) VIN − VOUT = 1.5 V; VAdj = 0 V 10 mA ≤ IOUT ≤ 3.0 A 2.0 V ≤ VIN − VOUT ≤ 5.75 V; IOUT = 10 mA VIN − VOUT = 2.0 V; 10 mA ≤ IOUT ≤ 3.0 A IOUT = 3.0 A VIN − VOUT = 3.0 V; TJ ≥ 25°C VIN = 7.0 V, VAdj = 0 V VIN − VOUT = 3.0 V; IOUT = 10 mA 30 ms Pulse, TA = 25°C f = 120 Hz; IOUT = 3.0 A; VIN − VOUT = 3.0 V; VRIPPLE = 1.0 VPP − − 1.235 (−1.5%) − − − 3.1 − − − − 150 − 1.254 0.02 0.04 1.15 4.6 0.6 50 0.002 80 180 − 1.273 (+1.5%) 0.20 0.4 1.40 − 2.0 100 0.020 − 210 25 V % % V A mA mA %/W dB °C °C Test Conditions Min Typ Max Unit 3. Load regulation and output voltage are measured at a constant junction temperature by low duty cycle pulse testing. Changes in output voltage due to temperature changes must be taken into account separately. 4. Specifications apply for an external Kelvin sense connection at a point on the output pin 1/4” from the bottom of the package. 5. Dropout voltage is a measurement of the minimum input/output differential at full load. 6. Minimum load current is defined as the minimum output current required to maintain regulation. The reference resistor in the output divider is usually sized to fulfill the minimum load current requirement. 7. Guaranteed by design, not 100% functionally tested in production. 8. Guaranteed by design, not 100% parametrically tested in production. However, every part is subject to functional testing for thermal shutdown. PACKAGE PIN DESCRIPTION Package Pin Number TO−220−3 1 2 3 D2PAK−3 1 2 3 Pin Symbol Adj VOUT VIN Function Adjust pin (low side of the internal reference). Regulated output voltage (case). Input voltage. http://onsemi.com 2 CS5203−1 VIN VOUT Output Current Limit Thermal Shutdown Bandgap Reference −+ Error Amplifier Adj Figure 2. Block Diagram TYPICAL PERFORMANCE CHARACTERISTICS 1.20 Reference Voltage Deviation (%) 1.15 Dropout Voltage (V) 1.10 1.05 1.00 0.95 0.90 0.85 0.80 0.75 0 0.30 0.60 0.90 1.20 1.50 1.80 2.10 2.40 2.70 3.00 TCASE = 25°C TCASE = 125°C TCASE = 0°C +0.3 +0.2 +0.1 0 −0.1 −0.2 −0.3 0 30 60 90 120 Output Current (A) TJ (°C) Figure 3. Dropout Voltage vs. Output Current 90 Minimum Load Current (mA) 80 Ripple Rejection (dB) 70 60 50 40 30 20 10 101 102 103 104 105 106 Figure 4. Bandgap Reference Voltage Deviation vs. Temperature 0.65 0.60 0.55 0.50 0.45 0.40 TCASE = 25°C TCASE = 125°C TCASE = 0°C 1 2 3 4 5 6 7 8 Frequency (Hz) VIN − VOUT (V) Figure 5. Ripple Rejection vs. Frequency Figure 6. Minimum Load Current vs. VIN − VOUT http://onsemi.com 3 CS5203−1 75 Adjust Pin Current, IAdj (mA) 68 66 Adjust Pin Current (mA) 65 64 62 60 58 56 45 0 30 60 90 120 TCASE = 0°C 1 2 3 4 5 6 7 8 TCASE = 25°C TCASE = 125°C 55 54 TA (°C) VIN − VOUT (V) Figure 7. Adjust Pin Current vs. Temperature 70.00 DVOUT (mV) 68.50 Adjust Pin Current (mA) 67.00 65.50 64.00 62.50 61.00 I (A) 59.50 58.00 56.50 55.00 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 Figure 8. Adjust Pin Current vs. VIN − VOUT +200 0 −200 VOUT = 3.3 V CIN = 100 mF COUT = 10 mF Tantalum VIN = 5.0 V 3 2 1 0 0 5 10 IOUT (A) Time (ms) Figure 9. Adjust Pin Current vs. Output Current 6 5 4 ISC (A) 3 2 1 0 Figure 10. Transient Response 1 2 3 4 5 6 7 VIN − VOUT (V) Figure 11. Short Circuit Current vs. VIN − VOUT http://onsemi.com 4 CS5203−1 APPLICATIONS INFORMATION The CS5203−1 linear regulator provides adjustable voltages at currents up to 3.0 A. The regulator is protected against overcurrent conditions and includes thermal shutdown. The CS5203−1 has a composite PNP−NPN output transistor and requires an output capacitor for stability. A detailed procedure for selecting this capacitor is included in the Stability Considerations section. Adjustable Operation The CS5203−1 has an output voltage range of 1.25 V to 5.5 V. An external resistor divider sets the output voltage as shown in Figure 12. The regulator maintains a fixed 1.25V (typical) reference between the output pin and the adjust pin. A resistor divider network R1 and R2 causes a fixed current to flow to ground. This current creates a voltage across R2 that adds to the 1.25 V across R1 and sets the overall output voltage. The adjust pin current (typically 50 mA) also flows through R2 and adds a small error that should be taken into account if precise adjustment of VOUT is necessary. The output voltage is set according to the formula: VOUT + VREF R1 ) R2 ) IAdj R1 R2 The term IAdj × R2 represents the error added by the adjust pin current. R1 is chosen so that the minimum load current is at least 2.0 mA. R1 and R2 should be the same type, e.g. metal film for best tracking over temperature. While not required, a bypass capacitor from the adjust pin to ground will improve ripple rejection and transient response. A 0.1 mF tantalum capacitor is recommended for “first cut” design. Type and value may be varied to obtain optimum performance vs. price. VIN VIN C1 VOUT VREF VOUT In most applications, ramp−up of the power supply to VIN is fairly slow, typically on the order of several tens of milliseconds, while the regulator responds in less than one microsecond. In this case, the linear regulator begins charging the load as soon as the VIN to VOUT differential is large enough that the pass transistor conducts current. The load at this point is essentially at ground, and the supply voltage is on the order of several hundred millivolts, with the result that the pass transistor is in dropout. As the supply to VIN increases, the pass transistor will remain in dropout, and current is passed to the load until VOUT reaches the point at which the IC is in regulation. Further increase in the supply voltage brings the pass transistor out of dropout. The result is that the output voltage follows the power supply ramp−up, staying in dropout until the regulation point is reached. In this manner, any output voltage may be regulated. There is no theoretical limit to the regulated voltage as long as the VIN to VOUT differential of 7.0 V is not exceeded. However, the possibility of destroying the IC in a short circuit condition is very real for this type of design. Short circuit conditions will result in the immediate operation of the pass transistor outside of its safe operating area. Over−voltage stresses will then cause destruction of the pass transistor before overcurrent or thermal shutdown circuitry can become active. Additional circuitry may be required to clamp the VIN to VOUT differential to less than 7.0 V if fail−safe operation is required. One possible clamp circuit is illustrated in Figure 13; however, the design of clamp circuitry must be done on an application by application basis. Care must be taken to ensure the clamp actually protects the design. Components used in the clamp design must be able to withstand the short circuit condition indefinitely while protecting the IC. EXTERNAL SUPPLY CS5203−1 Adj R1 C2 IAdj CAdj R2 VIN VOUT VAdj Figure 12. Resistor Divider Scheme The CS5201−1 linear regulator has an absolute maximum specification of 7.0 V for the voltage difference between VIN and VOUT. However, the IC may be used to regulate voltages in excess of 7.0 V. The main considerations in such a design are power−up and short circuit capability. VOUT Figure 13. Short Circuit Protection Circuit for High Voltage Application. http://onsemi.com 5 CS5203−1 Stability Considerations The output or compensation capacitor helps determine three main characteristics of a linear regulator: start−up delay, load transient response, and loop stability. The capacitor value and type is based on cost, availability, size and temperature constraints. A tantalum or aluminum electrolytic capacitor is best, since a film or ceramic capacitor with almost zero ESR can cause instability. The aluminum electrolytic capacitor is the least expensive solution. However, when the circuit operates at low temperatures, both the value and ESR of the capacitor will vary considerably. The capacitor manufacturer’s data sheet provides this information. A 22 mF tantalum capacitor will work for most applications, but with high current regulators such as the CS5203−1 the transient response and stability improve with higher values of capacitor. The majority of applications for this regulator involve large changes in load current so the output capacitor must supply the instantaneous load current. The ESR of the output capacitor causes an immediate drop in output voltage given by: DV + DI ESR VIN IN4002 (Optional) VIN C1 VOUT VOUT CS5203−1 Adj R1 C2 CAdj R2 Figure 14. Protection Diode Scheme for Large Output Capacitors Output Voltage Sensing For microprocessor applications it is customary to use an output capacitor network consisting of several tantalum and ceramic capacitors in parallel. This reduces the overall ESR and reduces the instantaneous output voltage drop under transient load conditions. The output capacitor network should be as close to the load as possible for the best results. Protection Diodes Since the CS5203−1 is a three terminal regulator, it is not possible to provide true remote load sensing. Load regulation is limited by the resistance of the conductors connecting the regulator to the load. For the adjustable regulator, the best load regulation occurs when R1 is connected directly to the output pin of the regulator as shown in Figure 15. If R1 is connected to the load, RC is multiplied by the divider ratio and the effective resistance between the regulator and the load becomes. RC R1 ) R2 R1 where RC = conductor parasitic resistance. RC Conductor Parasitic Resistance When large external capacitors are used with a linear regulator it is sometimes necessary to add protection diodes. If the input voltage of the regulator gets shorted, the output capacitor will discharge into the output of the regulator. The discharge current depends on the value of the capacitor, the output voltage and the rate at which VIN drops. In the CS5203−1 linear regulator, the discharge path is through a large junction and protection diodes are not usually needed. If the regulator is used with large values of output capacitance and the input voltage is instantaneously shorted to ground, damage can occur. In this case, a diode connected as shown in Figure 14 is recommended. VIN VIN VOUT CS5203−1 Adj R2 R1 RLOAD Figure 15. Grounding Scheme for Adjustable Output Regulator to Minimize Parasitic Resistance Effects http://onsemi.com 6 CS5203−1 Calculating Power Dissipation and Heat Sink Requirements The CS5203−1 linear regulator includes thermal shutdown and current limit circuitry to protect the device. High power regulators such as these usually operate at high junction temperatures so it is important to calculate the power dissipation and junction temperatures accurately to ensure that an adequate heat sink is used. The case is connected to VOUT on the CS5203−1, electrical isolation may be required for some applications. Thermal compound should always be used with high current regulators such as these. The thermal characteristics of an IC depend on the following four factors: 1. 2. 3. 4. Maximum Ambient Temperature TA (°C) Power dissipation PD (Watts) Maximum junction temperature TJ (°C) Thermal resistance junction to ambient RqJA (°C/W) These four are related by the equation TJ + TA ) PD RQJA (1) A heat sink effectively increases the surface area of the package to improve the flow of heat away from the IC and into the surrounding air. Each material in the heat flow path between the IC and the outside environment has a thermal resistance. Like series electrical resistances, these resistances are summed to determine RqJA, the total thermal resistance between the junction and the surrounding air. 1. Thermal Resistance of the junction to case, RqJC (°C/W) 2. Thermal Resistance of the case to Heat Sink, RqCS (°C/W) 3. Thermal Resistance of the Heat Sink to the ambient air, RqSA (°C/W) These are connected by the equation: RQJA + RQJC ) RQCS ) RQSA (3) The maximum ambient temperature and the power dissipation are determined by the design while the maximum junction temperature and the thermal resistance depend on the manufacturer and the package type. The maximum power dissipation for a regulator is: PD(max) + {VIN(max) * VOUT(min)}IOUT(max) ) VIN(max)IQ (2) where: VIN(max) is the maximum input voltage, VOUT(min) is the minimum output voltage, IOUT(max) is the maximum output current, for the application IQ is the maximum quiescent current at IOUT(max). The value for RqJA is calculated using equation (3) and the result can be substituted in equation (1). The value for RqJC is 3.5°C/W for a given package type based on an average die size. For a high current regulator such as the CS5203−1 the majority of the heat is generated in the power transistor section. The value for RqSA depends on the heat sink type, while RqCS depends on factors such as package type, heat sink interface (is an insulator and thermal grease used?), and the contact area between the heat sink and the package. Once these calculations are complete, the maximum permissible value of RqJA can be calculated and the proper heat sink selected. For further discussion on heat sink selection, see application note “Thermal Management,” document number AND8036/D, available through the Literature Distribution Center or via our website at http://onsemi.com. http://onsemi.com 7 CS5203−1 ORDERING INFORMATION Orderable Part Number CS5203−1GT3 CS5203−1GDP3 CS5203−1GDPR3 Type* 3.0 A, Adj. Output 3.0 A, Adj. Output 3.0 A, Adj. Output Package TO−220−3, STRAIGHT D2PAK−3 D2PAK−3 Shipping† 50 Units / Rail 50 Units / Rail 750 / Tape & Reel *Consult your local sales representative for fixed output voltage versions. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MARKING DIAGRAMS TO−220−3 T SUFFIX CASE 221A D2PAK−3 DP SUFFIX CASE 418AB CS5203−1 AWLYWW CS5203−1 AWLYWW 1 1 A WL, L YY, Y WW, W = Assembly Location = Wafer Lot = Year = Work Week http://onsemi.com 8 CS5203−1 PACKAGE DIMENSIONS TO−220−3 T SUFFIX CASE 221A−08 ISSUE AA −T− − B− F T C SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N Q R S T U V INCHES MIN MAX 0.560 0.625 0.380 0.420 0.140 0.190 0.025 0.035 0.139 0.155 0.100 BSC −−− 0.280 0.012 0.045 0.500 0.580 0.045 0.060 0.200 BSC 0.100 0.135 0.080 0.115 0.020 0.055 0.235 0.255 0.000 0.050 0.045 −−− MILLIMETERS MIN MAX 14.23 15.87 9.66 10.66 3.56 4.82 0.64 0.89 3.53 3.93 2.54 BSC −−− 7.11 0.31 1.14 12.70 14.73 1.15 1.52 5.08 BSC 2.54 3.42 2.04 2.92 0.51 1.39 5.97 6.47 0.00 1.27 1.15 −−− S Q H 4 123 A U K −Y− L V G D 3 PL 0.25 (0.010) M R J B M N Y D2PAK−3 DP SUFFIX CASE 418AB−01 ISSUE O For D2PAK Outline and Dimensions − Contact Factory PACKAGE THERMAL DATA Parameter RqJC RqJA Typical Typical TO−220−3 3.5 50 D2PAK−3 3.5 10−50* Unit °C/W °C/W * Depending on thermal properties of substrate. RqJA = RqJC + RqCA http://onsemi.com 9 CS5203−1 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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