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regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/
or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application
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CS5203A−1, CS5203A−2,
CS5203A−3, CS5203A−5
3.0 A Adjustable, and
Fixed 1.5 V, 3.3 V and 5.0 V
Linear Regulators
The CS5203A series of linear regulators provides 3.0 A at
adjustable and fixed voltages with an accuracy of ±1.0% and ±2.0%
respectively. The adjustable version uses two external resistors to set
the output voltage within a 1.25 V to 13 V range.
The regulators are intended for use as post regulators and
microprocessor supplies. The fast loop response and low dropout
voltage make these regulators ideal for applications where low voltage
operation and good transient response are important.
The circuit is designed to operate with dropout voltages as low as
1.0 V depending on the output current level. The maximum quiescent
current is only 10 mA at full load.
The regulators are fully protected against overload conditions with
protection circuitry for Safe Operating Area (SOA), overcurrent and
thermal shutdown.
The CS5203A is pin compatible with the LT1085 family of linear
regulators but has lower dropout voltage.
The regulators are available in TO−220−3 and surface mount
D2PAK−3 packages.
TO−220
THREE LEAD
T SUFFIX
CASE 221A
1
Pb−Free Package is Available
Output Current to 3.0 A
Output Trimmed to ±1.0%
Dropout Voltage 1.05 V @ 3.0 A
Fast Transient Response
Fault Protection Circuitry
♦ Thermal Shutdown
♦ Overcurrent Protection
♦ Safe Area Protection
2
3
D2PAK−3
DP SUFFIX
CASE 418AB
12
12
Features
•
•
•
•
•
•
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3
3
D2PAK−3
(Short Lead)
DPS SUFFIX
CASE 418F
Adjustable
Output
Tab = VOUT
Pin 1. Adj
2. VOUT
3. VIN
Fixed
Output
Tab = VOUT
Pin 1. GND
2. VOUT
3. VIN
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 8 of this data sheet.
VOUT
VIN
Output
Current
Limit
Thermal
Shutdown
− +
Error
Amplifier
Adj
Bandgap
Figure 1. Block Diagram − CS5203A−1
Semiconductor Components Industries, LLC, 2004
June, 2004 − Rev. 7
1
Publication Order Number:
CS5203A/D
CS5203A−1, CS5203A−2, CS5203A−3, CS5203A−5
VOUT
VIN
Output
Current
Limit
Thermal
Shutdown
− + Error
Amplifier
Bandgap
GND
Figure 2. Block Diagram − CS5203A−2, −3, −5
MAXIMUM RATINGS
Parameter
Supply Voltage, VCC
Operating Temperature Range
Junction Temperature
Storage Temperature Range
Lead Temperature Soldering:
Wave Solder (through hole styles only) (Note 1)
Reflow (SMD styles only) (Note 2)
Value
Unit
17
V
−40 to +70
°C
150
°C
−60 to +150
°C
260 Peak
230 Peak
°C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. 10 second maximum.
2. 60 second maximum above 183°C.
ELECTRICAL CHARACTERISTICS (CIN = 10 F, COUT = 22 F Tantalum, VIN − VOUT = 3.0 V, VIN ≤ 15 V,
0°C ≤ TA ≤ 70°C, TJ ≤ +150°C, unless otherwise specified, Ifull load = 3.0 A.)
Test Conditions
Characteristic
Min
Typ
Max
Unit
1.241
(−1%)
1.254
1.266
(+1%)
V
Adjustable Output Voltage (CS5203A−1)
Reference Voltage (Notes 3 and 4)
VIN − VOUT = 1.5 V; VAdj = 0 V,
10 mA ≤ IOUT ≤ 3.0 A
Line Regulation
1.5 V ≤ VIN − VOUT ≤ 6.0 V; IOUT = 10 mA
−
0.04
0.20
%
Load Regulation (Notes 3 and 4)
VIN − VOUT = 1.5 V; 10 mA ≤ IOUT ≤ 3.0 A
−
0.03
0.4
%
Dropout Voltage (Note 5)
IOUT = 3.0 A
−
1.05
1.15
V
Current Limit
VIN − VOUT = 3.0 V; TJ ≥ 25°C
VIN − VOUT = 15 V
3.2
−
5.5
2.5
−
−
A
A
Minimum Load Current
VIN − VOUT = 7.0 V
−
1.2
6.0
mA
−
50
100
A
Adjust Pin Current
−
Adjust Pin Current Change
1.5 V ≤ VIN − VOUT ≤ 4.0 V;
10 mA ≤ IOUT ≤ 3.0 A
−
0.2
5.0
A
Thermal Regulation
30 ms pulse; TA = 25°C
−
0.003
−
%/W
3. Load regulation and output voltage are measured at a constant junction temperature by low duty cycle pulse testing. Changes in output
voltage due to thermal gradients or temperature changes must be taken into account separately.
4. Specifications apply for an external Kelvin sense connection at a point on the output pin 1/4” from the bottom of the package.
5. Dropout voltage is a measurement of the minimum input/output differential at full load.
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2
CS5203A−1, CS5203A−2, CS5203A−3, CS5203A−5
ELECTRICAL CHARACTERISTICS (continued) (CIN = 10 F, COUT = 22 F Tantalum, VIN − VOUT = 3.0 V, VIN ≤ 15 V,
0°C ≤ TA ≤ 70°C, TJ ≤ +150°C, unless otherwise specified, Ifull load = 3.0 A.)
Test Conditions
Characteristic
Min
Typ
Max
Unit
−
85
−
dB
−
0.5
−
%
−
0.003
−
%VOUT
Adjustable Output Voltage (CS5203A−1) (continued)
f = 120 Hz; CAdj = 25 F; IOUT = 3.0 A
Ripple Rejection
Temperature Stability
−
10 Hz ≤ f ≤ 10 kHz; TA = 25°C
RMS Output Noise
Thermal Shutdown
−
150
180
−
°C
Thermal Shutdown Hysteresis
−
−
25
−
°C
ELECTRICAL CHARACTERISTICS (CIN = 10 F, COUT = 22 F Tantalum, VIN − VOUT = 3.0 V, VIN ≤ 15 V,
0°C ≤ TA ≤ 70°C, TJ ≤ +150°C, unless otherwise specified, Ifull load = 3.0 A.)
Test Conditions
Characteristic
Min
Typ
Max
Unit
4.9 (−2%)
3.234 (−2%)
1.47 (−2%)
5.0
3.3
1.5
5.1 (+2%)
3.366 (+2%)
1.53 (+2%)
V
V
V
Fixed Output Voltage (CS5203A−2, CS5203A−3, CS5203A−5)
Reference Voltage (Notes 6 and 7)
CS5203A−5
CS5203A−3
CS5203A−2
VIN − VOUT = 1.5 V; 0 ≤ IOUT ≤ 3.0A
VIN − VOUT = 1.5 V; 0 ≤ IOUT ≤ 3.0A
VIN − VOUT = 1.5 V; 0 ≤ IOUT ≤ 3.0A
Line Regulation
1.5 V ≤ VIN − VOUT ≤ 6.0 V; IOUT = 10 mA
−
0.04
0.20
%
Load Regulation (Notes 6 and 7)
VIN − VOUT = 1.5 V; 10 mA ≤ IOUT ≤ 3.0 A
−
0.03
0.4
%
Dropout Voltage (Note 8)
IOUT = 3.0 A
−
1.05
1.15
V
Current Limit
VIN − VOUT = 3.0 V; TJ ≥ 25°C
VIN − VOUT = 15 V
3.2
−
5.5
2.5
−
−
A
A
Quiescent Current
VIN ≤ 9.0 V; IOUT = 10 mA
−
5.0
10
mA
Thermal Regulation
30 ms pulse; TA = 25°C
−
0.003
−
%/W
Ripple Rejection
f = 120 Hz; IOUT = 3.0 A
−
78
−
dB
−
0.5
−
%
−
0.003
−
%VOUT
Temperature Stability
−
RMS Output Noise (%VOUT)
10 Hz ≤ f ≤ 10 kHz
Thermal Shutdown
−
150
180
−
°C
Thermal Shutdown Hysteresis
−
−
25
−
°C
6. Load regulation and output voltage are measured at a constant junction temperature by low duty cycle pulse testing. Changes in output
voltage due to thermal gradients or temperature changes must be taken into account separately.
7. Specifications apply for an external Kelvin sense connection at a point on the output pin 1/4” from the bottom of the package.
8. Dropout voltage is a measurement of the minimum input/output differential at full load.
PACKAGE PIN DESCRIPTION
Package Pin Number
CS5203A−1
CS5203A−2, −3, −5
D2PAK−3
TO−220−3
D2PAK−3
TO−220−3
Pin Symbol
Function
1
1
N/A
N/A
Adj
Adjust pin (low side of the internal reference).
2
2
2
2
VOUT
3
3
3
3
VIN
N/A
N/A
1
1
GND
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3
Regulated output voltage (case).
Input voltage.
Ground connection.
CS5203A−1, CS5203A−2, CS5203A−3, CS5203A−5
1.15
0.10
1.10
0.08
1.05
Output Voltage Deviation (%)
Dropout Voltage (V)
TYPICAL PERFORMANCE CHARACTERISTICS
TCASE = 0°C
1.00
0.95
0.90
TCASE = 25°C
0.85
TCASE = 125°C
0.80
0.75
0.70
0.06
0.04
0.02
0.00
−0.02
−0.04
−0.06
−0.08
−0.10
−0.12
0
1
2
3
0
Output Current (A)
TJ (°C)
Figure 3. Dropout Voltage vs. Output
Current
Figure 4. Reference Voltage vs.
Temperature
2.500
Minimum Load Current (mA)
0.100
Output Voltage Deviation (%)
10 20 30 40 50 60 70 80 90 100 110 120 130
0.075
0.050
TCASE = 125°C
TCASE = 25°C
0.025
2.175
TCASE = 0°C
1.850
1.525
TCASE = 25°C
1.200
0.875
TCASE = 125°C
TCASE = 0°C
0.550
0.000
0
1
2
3
1
3
4
5
6
7
Output Current (A)
VIN − VOUT (V)
Figure 5. Load Regulation vs. Output
Current
Figure 6. Minimum Load Current
8
9
100
70
IO = 10 mA
90
65
80
Ripple Rejection (dB)
Adjust Pin Current (A)
2
60
55
50
70
60
50
40
30
20
45
TCASE = 25°C
IOUT = 3.0 A
(VIN − VOUT) = 3.0 V
VRIPPLE = 1.6 VPP
10
40
0
0
101
10 20 30 40 50 60 70 80 90 100 110 120 130
102
103
104
Temperature (°C)
Frequency (Hz)
Figure 7. Adjust Pin Current vs.
Temperature
Figure 8. Ripple Rejection vs. Frequency
(Fixed Versions)
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4
105
CS5203A−1, CS5203A−2, CS5203A−3, CS5203A−5
100
90
Ripple Rejection (dB)
80
70
60
50
40
30
20
10
0
101
TCASE = 25°C
IOUT = 3.0 A
(VIN − VOUT) = 3.0 V
VRIPPLE = 1.6 VPP
CAdj = 25 F
102
103
104
105
Frequency (Hz)
Figure 9. Ripple Rejection vs. Frequency
(Adjustable Versions)
APPLICATIONS INFORMATION
The CS5203A family of linear regulators provides fixed
or adjustable voltages at currents up to 3.0 A. The regulators
are protected against short circuit, and include thermal
shutdown and safe area protection (SOA) circuitry. The
SOA protection circuitry decreases the maximum available
output current as the input−output differential voltage
increases.
The CS5203A has a composite PNP−NPN output
transistor and requires an output capacitor for stability. A
detailed procedure for selecting this capacitor is included in
the Stability Considerations section.
VIN
C1
VOUT
CS5203A−1
VREF
Adj
R1
C2
IAdj
CAdj
Adjustable Operation
R2
Figure 10. Resistor Divider Scheme for the
Adjustable Version
The adjustable regulator (CS5203A−1) has an output
voltage range of 1.25 V to 13 V. An external resistor divider
sets the output voltage as shown in Figure 10. The regulator
maintains a fixed 1.25 V (typical) reference between the
output pin and the adjust pin.
A resistor divider network R1 and R2 causes a fixed
current to flow to ground. This current creates a voltage
across R2 that adds to the 1.25 V across R1 and sets the
overall output voltage. The adjust pin current (typically
50 A) also flows through R2 and adds a small error that
should be taken into account if precise adjustment of VOUT
is necessary.
The output voltage is set according to the formula:
VOUT
VIN
Stability Considerations
The output or compensation capacitor helps determine
three main characteristics of a linear regulator: satrtup delay,
load transient response and loop stability.
The capacitor value and type is based on cost, availability,
size and temperature constraints. A tantalum or aluminum
electrolytic capacitor is best, since a film or ceramic
capacitor with almost zero ESR, can cause instability. The
aluminum electrolytic capacitor is the least expensive
solution. However, when the circuit operates at low
temperatures, both the value and ESR of the capacitor will
vary considerably. The capacitor manufacturers data sheet
provides this information.
A 22 F tantalum capacitor will work for most
applications, but with high current regulators such as the
CS5203A the transient response and stability improve with
higher values of capacitor. The majority of applications for
this regulator involve large changes in load current so the
output capacitor must supply the instantaneous load current.
VOUT VREF R1 R2 IAdj R2
R1
The term IAdj × R2 represents the error added by the adjust
pin current.
R1 is chosen so that the minimum load current is at least
10 mA. R1 and R2 should be the same type, e.g. metal film
for best tracking over temperature. The adjust pin is
bypassed to improve the transient response and ripple
rejection of the regulator.
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5
CS5203A−1, CS5203A−2, CS5203A−3, CS5203A−5
Output Voltage Sensing
The ESR of the output capacitor causes an immediate drop
in output voltage given by:
Since the CS5203A is a three terminal regulator, it is not
possible to provide true remote load sensing. Load
regulation is limited by the resistance of the conductors
connecting the regulator to the load. For best results the
fixed regulators should be connected as shown in Figure 13.
V I ESR
For microprocessor applications it is customary to use an
output capacitor network consisting of several tantalum and
ceramic capacitors in parallel. This reduces the overall ESR
and reduces the instantaneous output voltage drop under
load transient conditions. The output capacitor network
should be as close as possible to the load for the best results.
Conductor Parasitic
Resistance
VIN
VIN
VOUT
RC
CS5203A−X
RLOAD
Protection Diodes
When large external capacitors are used with a linear
regulator it is sometimes necessary to add protection diodes.
If the input voltage of the regulator gets shorted, the output
capacitor will discharge into the output of the regulator. The
discharge current depends on the value of the capacitor, the
output voltage and the rate at which VIN drops. In the
CS5203A−X family of linear regulators, the discharge path
is through a large junction and protection diodes are not
usually needed. If the regulator is used with large values of
output capacitance and the input voltage is instantaneously
shorted to ground, damage can occur. In this case, a diode
connected as shown in Figures 11 and 12 is recommended.
GND
Figure 13. Conductor Parasitic Resistance can be
Minimized with the Above Grounding Scheme for
Fixed Output Regulators
For the adjustable regulator, the best load regulation
occurs when R1 is connected directly to the output pin of the
regulator as shown in Figure 14. If R1 is connected to the
load, RC is multiplied by the divider ratio and the effective
resistance between the regulator and the load becomes
IN4002 (optional)
VIN
VIN
C1
VOUT
CS5203A−1
RC R1 R2
R1
VOUT
where RC = conductor parasitic resistance.
Adj
R1
CAdj
C2
VIN
R2
VIN
RC
VOUT
Conductor Parasitic
Resistance
CS5203A−1
R1
Adj
RLOAD
Figure 11. Protection Diode Scheme for Adjustable
Output Regulator
R2
IN4002 (optional)
VIN
VOUT
VIN
VOUT
CS5203A−X
C1
GND
Figure 14. Grounding Scheme for Adjustable Output
Regulator to Minimize Parasitics
C2
Figure 12. Protection Diode Scheme for Fixed Output
Regulators
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6
CS5203A−1, CS5203A−2, CS5203A−3, CS5203A−5
Calculating Power Dissipation and Heatsink
Requirements
A Heatsink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and the
outside environment has a thermal resistance. Like series
electrical resistances, these resistances are summed to
determine RJA, the total thermal resistance between the
junction and the surrounding air.
1. Thermal Resistance of the junction−to−case, RJC
(°C/W)
2. Thermal Resistance of the case to Heatsink, RCS
(°C/W)
3. Thermal Resistance of the Heatsink to the ambient
air, RSA (°C/W)
These are connected by the equation:
The CS5203A series of linear regulators includes thermal
shutdown and current limit circuitry to protect the device.
High power regulators such as these usually operate at high
junction temperatures so it is important to calculate the
power dissipation and junction temperatures accurately to
ensure that an adequate Heatsink is used.
The case is connected to VOUT on the CS5203A, electrical
isolation may be required for some applications. Thermal
compound should always be used with high current
regulators such as these.
The thermal characteristics of an IC depend on the
following four factors:
1.
2.
3.
4.
Maximum Ambient Temperature TA (°C)
Power dissipation PD (Watts)
Maximum junction temperature TJ (°C)
Thermal resistance junction to ambient RJA (°C/W)
RJA RJC RCS RSA
The value for RJA is calculated using equation (3) and the
result can be substituted in equation (1).
The value for RJC is normally quoted as a single figure
for a given package type based on an average die size. For
a high current regulator such as the CS5203A the majority
of the heat is generated in the power transistor section. The
value for RSA depends on the Heatsink type, while RCS
depends on factors such as package type, Heatsink interface
(is an insulator and thermal grease used?), and the contact
area between the Heatsink and the package. Once these
calculations are complete, the maximum permissible value
of RJA can be calculated and the proper Heatsink selected.
For further discussion on Heatsink selection, see application
note “Thermal Management,” document number
AND8036/D, available through the Literature Distribution
Center or via our website at http://onsemi.com.
These four are related by the equation
TJ TA PD RJA
(3)
(1)
The maximum ambient temperature and the power
dissipation are determined by the design while the
maximum junction temperature and the thermal resistance
depend on the manufacturer and the package type.
The maximum power dissipation for a regulator is:
PD(max) {VIN(max) VOUT(min)}IOUT(max) VIN(max)IQ
(2)
where:
VIN(max) is the maximum input voltage,
VOUT(min) is the minimum output voltage,
IOUT(max) is the maximum output current, for the
application
IQ is the maximum quiescent current at IOUT(max).
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7
CS5203A−1, CS5203A−2, CS5203A−3, CS5203A−5
ORDERING INFORMATION
Type
Package
Shipping†
3.0 A, Adj. Output
TO−220−3, STRAIGHT
50 Units / Rail
CS5203A−1GDP3
3.0 A, Adj. Output
D2PAK−3
50 Units / Rail
CS5203A−1GDPR3
3.0 A, Adj. Output
D2PAK−3
750 / Tape & Reel
CS5203A−2GT3
3.0 A, 1.5 V Output
TO−220−3, STRAIGHT
50 Units / Rail
CS5203A−2GDP3
3.0 A, 1.5 V Output
D2PAK−3
50 Units / Rail
3.0 A, 1.5 V Output
D2PAK−3
750 / Tape & Reel
3.0 A, 1.5 V Output
D2PAK−3
750 / Tape & Reel
Device
CS5203A−1GT3
CS5203A−2GDPR3
CS5203A−2GDPR3G
(Pb−Free)
CS5203A−2GDPSR3
3.0 A, 1.5 V Output
D2PAK−3
750 / Tape & Reel
CS5203A−3GT3
3.0 A, 3.3 V Output
TO−220−3, STRAIGHT
50 Units / Rail
3.0 A, 3.3 V Output
D2PAK−3
50 Units / Rail
3.0 A, 3.3 V Output
D2PAK−3
750 / Tape & Reel
CS5203A−3GDPSR3
3.0 A, 3.3 V Output
D2PAK−3
750 / Tape & Reel
CS5203A−5GT3
3.0 A, 5.0 V Output
TO−220−3, STRAIGHT
50 Units / Rail
CS5203A−3GDP3
CS5203A−3GDPR3
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MARKING DIAGRAMS
D2PAK−3
DP SUFFIX
CASE 418AB
TO−220−3
T SUFFIX
CASE 221A
CS
5203A−x
AWLYWW
CS
5203A−x
AWLYWW
D2PAK−3
DPS SUFFIX
CASE 418F
CS
5203A−x
AWLYYWW
1
1
1
x
A
WL, L
YY, Y
WW, W
= 1, 2, 3, or 5
= Assembly Location
= Wafer Lot
= Year
= Work Week
PACKAGE THERMAL DATA
Parameter
TO−220−3
D2PAK−3
Unit
RJC
Typical
1.6
1.6
°C/W
RJA
Typical
50
10−50*
°C/W
*Depending on thermal properties of substrate. RJA = RJC + RCA.
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8
CS5203A−1, CS5203A−2, CS5203A−3, CS5203A−5
PACKAGE DIMENSIONS
TO−220−3
T SUFFIX
CASE 221A−08
ISSUE AA
−T−
F
−B−
SEATING
PLANE
C
T
S
4
Q
A
1 2 3
U
H
−Y−
K
L
R
V
G
J
D 3 PL
0.25 (0.010)
M
B
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
F
G
H
J
K
L
N
Q
R
S
T
U
V
INCHES
MIN
MAX
0.560
0.625
0.380
0.420
0.140
0.190
0.025
0.035
0.139
0.155
0.100 BSC
−−−
0.280
0.012
0.045
0.500
0.580
0.045
0.060
0.200 BSC
0.100
0.135
0.080
0.115
0.020
0.055
0.235
0.255
0.000
0.050
0.045
−−−
MILLIMETERS
MIN
MAX
14.23
15.87
9.66
10.66
3.56
4.82
0.64
0.89
3.53
3.93
2.54 BSC
−−−
7.11
0.31
1.14
12.70
14.73
1.15
1.52
5.08 BSC
2.54
3.42
2.04
2.92
0.51
1.39
5.97
6.47
0.00
1.27
1.15
−−−
Y
N
D2PAK−3
DP SUFFIX
CASE 418AB−01
ISSUE O
For D2PAK Outline and
Dimensions − Contact Factory
http://onsemi.com
9
CS5203A−1, CS5203A−2, CS5203A−3, CS5203A−5
PACKAGE DIMENSIONS
D2PAK−3
DPS SUFFIX
CASE 418F−01
ISSUE O
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
−T− SEATING
PLANE
B
C
M
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
E
4
A
1
2
3
F
INCHES
MIN
MAX
0.326
0.336
0.396
0.406
0.170
0.180
0.026
0.036
0.045
0.055
0.058
0.078
0.100 BSC
0.098
0.108
0.018
0.025
0.163
0.173
0.045
0.055
0.055
0.066
0.000
0.004
MILLIMETERS
MIN
MAX
8.28
8.53
10.05
10.31
4.31
4.57
0.66
0.91
1.14
1.40
1.47
1.98
2.54 BSC
2.49
2.74
0.46
0.64
4.14
4.39
1.14
1.40
1.40
1.68
0.00
0.10
K
H
G
D
0.13 (0.005)
M
3 PL
T B
M
J
L
N
SOLDERING FOOTPRINT*
8.38
0.33
1.016
0.04
10.66
0.42
5.08
0.20
3.05
0.12
17.02
0.67
SCALE 3:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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CS5203A/D