CS5204-2GDP3

CS5204−2 4.0 A, 1.5 V Fixed Linear Regulator The CS5204−2 linear regulator provides 4.0 A @ 1.5 V with an accuracy of ±2.0%. The fast loop response and low dropout voltage make this regulator ideal for GTL bus termination where low voltage operation and good transient response are important. The circuit is designed to operate with dropout voltages as low as 1.0 V depending on the output current level. The maximum quiescent current is only 10 mA at full load. The regulator is fully protected against overload conditions with protection circuitry for Safe Operating Area (SOA), overcurrent and thermal shutdown. The regulator is available in TO−220−3 and surface mount D2PAK−3 packages. http://onsemi.com TO−220−3 T SUFFIX CASE 221A 1 2 3 D2PAK−3 D2T SUFFIX CASE 418AB Tab = VOUT Pin 1. GND 2. VOUT 3. VIN • • • • • Features Output Current to 4.0 A Output Voltage Trimmed to ±2.0% Dropout Voltage (typical) 1.10 V @ 4.0 A Fast Transient Response Fault Protection Circuitry − Thermal Shutdown − Overcurrent Protection − Safe Area Protection 12 3 MARKING DIAGRAMS TO−220−3 D2PAK−3 CS5204−2 AWLYWW CS5204−2 AWLYWW VIN VOUT 1 Output Current Limit Thermal Shutdown − + Error Amplifier A WL, L YY, Y WW, W 1 = Assembly Location = Wafer Lot = Year = Work Week ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. Bandgap GND Figure 1. Block Diagram © Semiconductor Components Industries, LLC, 2006 September, 2006 − Rev. 10 1 Publication Order Number: CS5204−2/D CS5204−2 MAXIMUM RATINGS* Parameter Supply Voltage, VCC Operating Temperature Range Junction Temperature Storage Temperature Range Lead Temperature Soldering: 1. 10 second maximum. 2. 60 second maximum above 183°C *The maximum package power dissipation must be observed. Wave Solder (through hole styles only) Note 1 Reflow (SMD styles only) Note 2 Value 17 −40 to +70 150 −60 to +150 260 Peak 230 Peak Unit V °C °C °C °C °C ELECTRICAL CHARACTERISTICS (CIN = 10 mF, COUT = 22 mF Tantalum, VIN − VOUT = 3.0 V, VIN ≤ 10 V, 0°C ≤ TA ≤ 70°C, TJ ≤ +150°C, unless otherwise specified, Ifull load = 4.0 A) Characteristic CS5204−2 Output Voltage (Notes 3 and 4) Line Regulation Load Regulation (Notes 3 and 4) Dropout Voltage (Note 5) Current Limit Quiescent Current Thermal Regulation Ripple Rejection Temperature Stability RMS Output Noise (%VOUT) Thermal Shutdown Thermal Shutdown Hysteresis 10 Hz ≤ f ≤ 10 kHz − − VIN − VOUT = 1.5 V; 0 ≤ IOUT ≤ 4.0 A 1.5 V ≤ VIN − VOUT ≤ 6.0 V; IOUT = 10 mA VIN − VOUT = 1.5 V; 10 mA ≤ IOUT ≤ 4.0 A IOUT = 4.0 A VIN − VOUT = 3.0 V; TJ ≥ 25°C VIN − VOUT = 15 V VIN ≤ 9.0 V; IOUT = 10 mA 30 ms Pulse, TA = 25°C f = 120 Hz; IOUT = 4.0 A − 1.47 (−2.0%) − − − 4.5 − − − − − − 150 − 1.50 0.04 0.05 1.1 8.5 2.5 5.0 0.003 75 0.5 0.003 180 25 1.53 (+2.0%) 0.20 0.4 1.2 − − 10 − − − − − − V % % V A A mA %/W dB % %/VOUT °C °C Test Conditions Min Typ Max Unit 3. Load regulation and output voltage are measured at a constant junction temperature by low duty cycle pulse testing. Changes in output voltage due to thermal gradients or temperature changes must be taken into account separately. 4. Specifications apply for an external Kelvin sense connection at a point on the output pin 1/4” from the bottom of the package. 5. Dropout voltage is a measurement of the minimum input/output differential at full load. PACKAGE PIN DESCRIPTION Package Pin Number TO−220−3 1 2 3 D2PAK−3 1 2 3 Pin Symbol GND VOUT VIN Ground connection. Regulated output voltage (case). Input voltage. Function http://onsemi.com 2 CS5204−2 TYPICAL PERFORMANCE CHARACTERISTICS 1.20 1.15 Output Voltage Deviation (%) 1.10 Dropout Voltage (V) 1.05 1.00 0.95 0.90 0.85 0.80 0.75 0.70 0 1 2 3 4 TCASE = 25°C TCASE = 125°C TCASE = 0°C 0.10 0.08 0.06 0.04 0.02 0.00 −0.02 −0.04 −0.06 −0.08 −0.10 −0.12 0 10 20 30 40 50 60 70 80 90 100 110 120 130 Output Current (A) TJ (°C) Figure 2. Dropout Voltage vs. Output Current 0.200 Output Voltage Deviation (%) Minimum Load Current (mA) 0.175 0.150 0.125 0.100 0.075 0.050 0.025 0.000 0 TCASE = 125°C TCASE = 0°C 1 2 3 4 TCASE = 25°C Figure 3. Reference Voltage vs. Temperature 2.500 2.175 TCASE = 0°C 1.850 1.525 TCASE = 25°C 1.200 0.875 0.550 TCASE = 125°C 1 2 3 4 5 6 7 8 9 Output Current (A) VIN − VOUT (V) Figure 4. Load Regulation vs. Output Current 100 90 80 Ripple Rejection (dB) 70 60 50 40 30 20 10 0 101 102 103 TCASE = 25°C Figure 5. Minimum Load Current IOUT = 4.0 A (VIN − VOUT) = 3.0 V VRIPPLE = 1.6 VPP 104 105 Frequency (Hz) Figure 6. Ripple Rejection vs. Frequency http://onsemi.com 3 CS5204−2 APPLICATIONS INFORMATION The CS5204−2 linear regulator provides fixed 1.5 V voltage at currents up to 4.0 A. The regulator is protected against short circuit, and includes thermal shutdown and safe area protection (SOA) circuitry. The SOA protection circuitry decreases the maximum available output current as the input−output differential voltage increase. The CS5204−2 has a composite PNP−NPN output transistor and requires an output capacitor for stability. A detailed procedure for selecting this capacitor is included in the Stability Considerations section. Stability Considerations Protection Diodes The output compensation capacitor helps determine three main characteristics of a linear regulator: start−up delay, load transient response, and loop stability. The capacitor value and type is based on cost, availability, size and temperature constraints. A tantalum or aluminum electrolytic capacitor is best, since a film or ceramic capacitor with almost zero ESR can cause instability. The aluminum electrolytic capacitor is the least expensive solution. However, when the circuit operates at low temperatures, both the value and ESR of the capacitor will vary considerably. The capacitor manufacturer’s data sheet provides this information. A 22 mF tantalum capacitor will work for most applications, but with high current regulators such as the CS5204−2 the transient response and stability improve with higher values of capacitance. The majority of applications for this regulator involve large changes in load current so the output capacitor must supply the instantaneous load current. The ESR of the output capacitor causes an immediate drop in output voltage given by: DV + DI ESR When large external capacitors are used with a linear regulator it is sometimes necessary to add protection diodes. If the input voltage of the regulator gets shorted, the output capacitor will discharge into the output of the regulator. The discharge current depends on the value of the capacitor, the output voltage and the rate at which VIN drops. In the CS5204−2 linear regulator, the discharge path is through a large junction and protection diodes are not usually needed. If the regulator is used with large values of output capacitance and the input voltage is instantaneously shorted to ground, damage can occur. In this case, a diode connected as shown in Figure 7 is recommended. IN4002 (Optional) VIN C1 VOUT VIN VOUT CS5204−2 GND C2 Figure 7. Protection Diode Scheme Output Voltage Sensing Since the CS5204−2 is a three terminal regulator, it is not possible to provide true remote load sensing. Load regulation is limited by the resistance of the conductors connecting the regulator to the load. For best results the regulator should be connected as shown in Figure 8. Conductor Parasitic Resistance For microprocessor applications it is customary to use an output capacitor network consisting of several tantalum and ceramic capacitors in parallel. This reduces the overall ESR and reduces the instantaneous output voltage drop under transient load conditions. The output capacitor network should be as close to the load as possible for the best results. VIN VIN VOUT CS5204−2 GND RC RLOAD Figure 8. Conductor Parasitic Resistance Effects Can Be Minimized With the Above Grounding Scheme http://onsemi.com 4 CS5204−2 Calculating Power Dissipation and Heat Sink Requirements The CS5204−2 linear regulator includes thermal shutdown and safe operating area circuitry to protect the device. High power regulators such as these usually operate at high junction temperatures so it is important to calculate the power dissipation and junction temperatures accurately to ensure that an adequate heat sink is used. The case is connected to VOUT on the CS5204−2, electrical isolation may be required for some applications. Thermal compound should always be used with high current regulators such as these. The thermal characteristics of an IC depend on the following four factors: 1. 2. 3. 4. Maximum Ambient Temperature TA (°C) Power dissipation PD (Watts) Maximum junction temperature TJ (°C) Thermal resistance junction to ambient RqJA (°C/W) These four are related by the equation TJ + TA ) PD RQJA (1) A heat sink effectively increases the surface area of the package to improve the flow of heat away from the IC and into the surrounding air. Each material in the heat flow path between the IC and the outside environment has a thermal resistance. Like series electrical resistances, these resistances are summed to determine RqJA, the total thermal resistance between the junction and the surrounding air. 1. Thermal Resistance of the junction to case, RqJC (°C/W) 2. Thermal Resistance of the case to Heat Sink, RqCS (°C/W) 3. Thermal Resistance of the Heat Sink to the ambient air, RqSA (°C/W) These are connected by the equation: RQJA + RQJC ) RQCS ) RQSA (3) The maximum ambient temperature and the power dissipation are determined by the design while the maximum junction temperature and the thermal resistance depend on the manufacturer and the package type. The maximum power dissipation for a regulator is: PD(max) + {VIN(max) * VOUT(min)}IOUT(max) ) VIN(max)IQ (2) where: VIN(max) is the maximum input voltage, VOUT(min) is the minimum output voltage, IOUT(max) is the maximum output current, for the application IQ is the maximum quiescent current at IOUT(max). The value for RqJA is calculated using equation (3) and the result can be substituted in equation (1). RqJC is 1.6°C/Watt for the CS5204−2. For a high current regulator such as the CS5204−2 the majority of the heat is generated in the power transistor section. The value for RqSA depends on the heat sink type, while RqCS depends on factors such as package type, heat sink interface (is an insulator and thermal grease used?), and the contact area between the heat sink and the package. Once these calculations are complete, the maximum permissible value of RqJA can be calculated and the proper heat sink selected. For further discussion on heat sink selection, see application note “Thermal Management,” document number AND8036/D, available through the Literature Distribution Center or via our website at http://onsemi.com. ORDERING INFORMATION Orderable Part Number CS5204−2GT3 CS5204−2GDP3 CS5204−2GDPR3 Type 4.0 A, 1.5 V Output 4.0 A, 1.5 V Output 4.0 A, 1.5 V Output Package TO−220−3, STRAIGHT D2PAK−3 D2PAK−3 Shipping† 50 Units / Rail 50 Units / Rail 750 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 5 CS5204−2 PACKAGE DIMENSIONS TO−220−3 T SUFFIX CASE 221A−08 ISSUE AA −T− − B− F T C SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N Q R S T U V INCHES MIN MAX 0.560 0.625 0.380 0.420 0.140 0.190 0.025 0.035 0.139 0.155 0.100 BSC −−− 0.280 0.012 0.045 0.500 0.580 0.045 0.060 0.200 BSC 0.100 0.135 0.080 0.115 0.020 0.055 0.235 0.255 0.000 0.050 0.045 −−− MILLIMETERS MIN MAX 14.23 15.87 9.66 10.66 3.56 4.82 0.64 0.89 3.53 3.93 2.54 BSC −−− 7.11 0.31 1.14 12.70 14.73 1.15 1.52 5.08 BSC 2.54 3.42 2.04 2.92 0.51 1.39 5.97 6.47 0.00 1.27 1.15 −−− S Q H 4 123 A U K −Y− L V G D 3 PL 0.25 (0.010) M R J B M N Y http://onsemi.com 6 CS5204−2 PACKAGE DIMENSIONS D2PAK−3 DP SUFFIX CASE 418AB−01 ISSUE O For D2PAK Outline and Dimensions − Contact Factory PACKAGE THERMAL DATA Parameter RqJC RqJA Typical Typical TO−220−3 1.6 50 D2PAK−3 1.6 10−50* Unit °C/W °C/W *Depending on thermal properties of substrate. RqJA = RqJC + RqCA ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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