CSPEMI202AGG

2 Channel Headset Microphone EMI Filter with ESD Protection CSPEMI202AG Features • • • • • • • Two channels of EMI filtering Pi-style EMI filters in a capacitor-resistorcapacitor (C-R-C) network Greater than 40dB attenuation at 1GHz ±8kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) ±15kV ESD protection on each channel (HBM) Supports bipolar signals—ideal for audio applications Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance 5-bump, 0.930mm X 1.410mm footprint Chip Scale Package (CSP) RoHS compliant (lead-free) finishing Product Description The CSPEMI202AG is a dual low-pass filter array integrating two pi-style filters (C-R-C) that reduce EMI/RFI emissions while at the same time providing ESD protection. This part is custom-designed to interface with a microphone port on a cellular telephone or similar device. Each high quality filter provides more than 35dB attenuation in the 800-2700 MHz range. These pi-style filters support bidirectional filtering, controlling EMI both to and from a microphone element. They also support bipolar signals, enabling audio signals to pass through without distortion. In addition, the CSPEMI202AG provides a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The diodes safely dissipate ESD strikes of ±8kV, the maximum requirement of the IEC 61000-42 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than ±15kV. The CSPEMI202AG is particularly well-suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format and low weight. The CSPEMI202AG is available in a space-saving, low-profile Chip Scale Package with RoHS compliant lead-free finishing. • • Applications • • • • • • • EMI filtering and ESD protection for headset microphone ports Wireless Handsets Handheld PCs / PDAs MP3 Players Digital Camcorders Notebooks Desktop PCs ©2010 SCILLC. All rights reserved. April 2010 Rev. 3 Publication Order Number: CSPEMI202AG/D CSPEMI202AG Rev. 3 | Page 2 of 9 | www.onsemi.com CSPEMI202AG PIN DESCRIPTIONS PIN A1 A3 B2 C1 C3 NAME MIC_IN1 MIC_IN2 GND MIC_OUT1 MIC_OUT2 DESCRIPTION Microphone Input 1 (from microphone) Microphone Input 2 (from microphone) Device Ground Microphone Output 1 (to audio circuitry) Microphone Output 2 (to audio circuitry) Ordering Information PART NUMBERING INFORMATION Bumps 5 Package CSP Ordering Part Number1 CSPEMI202AGG Part Marking AD Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Rev. 3 | Page 3 of 9 | www.onsemi.com CSPEMI202AG Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 200 UNITS °C mW mW STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS °C Rev. 3 | Page 4 of 9 | www.onsemi.com CSPEMI202AG ELECTRICAL OPERATING CHARACTERISTICS1 SYMBOL R1 C1 ILEAK VSIG PARAMETER Resistance Capacitance Diode Leakage Current Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω VIN=5.0V ILOAD = 10mA 5 -15 Note 2 7 -10 15 -5 V V CONDITIONS MIN 61 38 TYP 68 47 MAX 75 56 1.0 UNITS Ω pF μA VESD ±15 ±8 Notes 2 and 3 +15 -19 R = 68Ω, C = 47pF 60 kV kV VCL V V MHz fC Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Rev. 3 | Page 5 of 9 | www.onsemi.com CSPEMI202AG Performance Information Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B2) Figure 2. Insertion Loss VS. Frequency (A3-C3 to GND B2) Application Information Rev. 3 | Page 6 of 9 | www.onsemi.com CSPEMI202AG PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance — Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste VALUE 0.240mm Round Non-Solder Mask defined pads 0.290mm Round 0.125mm - 0.150mm 0.300mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50μm +20μm 60 seconds 260°C N on-Solder M ask D efined Pad 0.240m D m IA. Solder Stencil Opening 0.300m D m IA. Solder Mask Opening 0.290m D m IA. Figure 8. Recommended Non-Solder Mask Defined Pad Illustration Figure 9. Lead-free (SnAgCu) Solder Ball Reflow Profile Rev. 3 | Page 7 of 9 | www.onsemi.com CSPEMI202AG Mechanical Details CSP Mechanical Specifications The CSPEMI202AG is available in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CMD’s Chip Scale Packaging, see the California Micro Devices CSP Package Information document. PACKAGE DIMENSIONS Package Bumps Millimeters Dim Min A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Nom Max Min Nom Max Custom CSP 5 Inches C A2 B A 123 D1 0.30 DIA. 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) D2 SOLDER BUMPS C2 B2 B1 BOTTOM VIEW A1 C1 B4 B3 SIDE VIEW 0.885 0.930 0.975 0.0348 0.0366 0.0384 1.365 1.410 1.455 0.0537 0.0555 0.0573 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.165 0.215 0.265 0.0065 0.0085 0.0104 0.220 0.270 0.320 0.0087 0.0106 0.0126 0.562 0.606 0.650 0.0221 0.0239 0.0256 0.356 0.381 0.406 0.0140 0.0150 0.0160 3500 pieces DIMENSIONS IN MILLIMETERS Package Dimensions for CSPEMI202AG Chip Scale Package # per tape and reel Controlling dimension: millimeters Rev. 3 | Page 8 of 9 | www.onsemi.com CSPEMI202AG CSP Tape and Reel Specifications POCKET SIZE (mm) B0 X A0 X K0 1.52 X 1.07 X 0.72 TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500 PART NUMBER CSPEMI202AG CHIP SIZE (mm) 1.41 X 0.93 X 0.606 P0 4mm P1 4mm + + + Figure 5. Tape and Reel Mechanical Data ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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