CSPEMI306A

6-Channel EMI Filter Array with ESD Protection CSPEMI306A Features • • • • • • Six channels of EMI filtering for data ports Pi-style EMI filters in a capacitor-resistorcapacitor (C-R-C) network Greater than 32dB attenuation at 1GHz +15kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) +30kV ESD protection on each channel (HBM) Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance 15-bump, 2.960mm X 1.330mm footprint Chip Scale Package (CSP) Lead-free version available Product Description The CSPEMI306A is a six channel low-pass filter array that reduces EMI/RFI emissions while at the same time providing ESD protection. It is used on data ports on mobile devices. To reduce EMI/RFI emissions, the CSPEMI306A integrates a pi-style filter (C-R-C) for each of the 6 channels. Each high quality filter provides greater than 30dB attenuation in the 800-2700 MHz range. These pi-style filters also support bidirectional filtering, controlling EMI both to and from a data port connector. In addition, the CSPEMI306A provides a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The input pins safely dissipate ESD strikes of +15kV, exceeding the maximum requirement of the IEC 61000-4-2 international standard. Using the MILSTD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than +30kV. The CSPEMI306A is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package footprint and low weight. The CSPEMI306A is available in a space-saving, low-profile Chip Scale Package with optional lead-free finishing. • • Applications • • • • • • EMI filtering and ESD protection for both data and I/O ports Wireless Handsets Handheld PCs / PDAs MP3 Players Notebooks Desktop PCs ©2010 SCILLC. All rights reserved. May 2010 Rev. 2 Publication Order Number: CSPEMI306A/D CSPEMI306A Electrical Schematic 1 of 6 EMI/RFI + ESD Channels Lead-free devices are specified by using a "+" character for the top side orientation mark. Rev. 2 | Page 2 of 13 | www.onsemi.com CSPEMI306A PIN DESCRIPTIONS PIN(s) A1 A2 A3 A4 A5 A6 B1-B3 C1 C2 C3 C4 C5 C6 NAME FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 GND FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 DESCRIPTION Filter Channel 1 Filter Channel 2 Filter Channel 3 Filter Channel 4 Filter Channel 5 Filter Channel 6 Device Ground Filter Channel 1 Filter Channel 2 Filter Channel 3 Filter Channel 4 Filter Channel 5 Filter Channel 6 Ordering Information PART NUMBERING INFORMATION Standard Finish Bumps 15 Lead-free Finish Ordering Part 1 Number CSPEMI306AG 2 Package CSP Ordering Part 1 Number CSPEMI306A Part Marking 306A Part Marking 306A Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. Rev. 2 | Page 3 of 13 | www.onsemi.com CSPEMI306A Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 600 UNITS ° C mW mW STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS ° C Rev. 2 | Page 4 of 13 | www.onsemi.com CSPEMI306A ELECTRICAL OPERATING CHARACTERISTICS1 SYMBOL R C TCR TCC VDIODE ILEAK VSIG PARAMETER Resistance Capacitance Temperature Coefficient of Resistance Temperature Coefficient of Capacitance Diode Voltage (reverse bias) Diode Leakage Current (reverse bias) Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω CONDITIONS MIN 80 TYP 100 30 1200 MAX 120 36 UNITS Ω pF ppm/° C ppm/° C V At 2.5V DC 24 At 2.5V DC IDIODE=10µA VDIODE=3.3V ILOAD = 10mA 5.6 -0.4 Notes 2 and 4 5.5 -300 100 nA 6.8 -0.8 9.0 -1.5 V V VESD ±30 ±15 Notes 2,3 and 4 +10 -5 R = 100Ω, C = 30pF 58 kV kV VCL V V MHz fC Note 1: TA=25° unless otherwise specified. C Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open. Rev. 2 | Page 5 of 13 | www.onsemi.com CSPEMI306A Performance Information Typical Filter Performance (TA=25° DC Bias=0V, 50 Ohm Environment) C, Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B2) Figure 2. Insertion Loss VS. Frequency (A2-C2 to GND B2) Rev. 2 | Page 6 of 13 | www.onsemi.com CSPEMI306A Performance Information (cont’d) Typical Filter Performance (TA=25° DC Bias=0V, 50 Ohm Environment) C, Figure 3. Insertion Loss VS. Frequency (A3-C3 to GND B2) Figure 4. Insertion Loss VS. Frequency (A4-C4 to GND B2) Rev. 2 | Page 7 of 13 | www.onsemi.com CSPEMI306A Performance Information (cont’d) Typical Filter Performance (TA=25° DC Bias=0V, 50 Ohm Environment) C, Figure 5. Insertion Loss VS. Frequency (A5-C5 to GND B2) Figure 6. Insertion Loss VS. Frequency (A6-C6 to GND B2) Rev. 2 | Page 8 of 13 | www.onsemi.com CSPEMI306A Performance Information (cont’d) Typical Filter Performance (TA=25° DC Bias=0V, 50 Ohm Environment) C, Figure 7. Comparison of Filter Response Curves for CSPEMI306A VS. DC Bias Rev. 2 | Page 9 of 13 | www.onsemi.com CSPEMI306A Performance Information (cont’d) Figure 8. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25° C) Figure 9. Resistance vs. Temperature (normalized to resistance at 25°C) Rev. 2 | Page 10 of 13 | www.onsemi.com CSPEMI306A Application Information PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance — Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste VALUE 0.240mm Round Non-Solder Mask defined pads 0.290mm Round 0.125mm - 0.150mm 0.300mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50µm +20µm 60 seconds 260° C N on-Solder M ask D efined Pad 0.240m D m IA. Solder Stencil Opening 0.300m D m IA. Solder Mask Opening 0.290m D m IA. Figure 8. Recommended Non-Solder Mask Defined Pad Illustration Figure 9. Lead-free (SnAgCu) Solder Ball Reflow Profile Rev. 2 | Page 11 of 13 | www.onsemi.com CSPEMI306A Mechanical Details CSP Mechanical Specifications The CSPEMI306A is offered in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CMD’s chip scale packaging, see the California Micro Devices CSP Package Information document. PACKAGE DIMENSIONS Package Bumps Dim Millimeters Min A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Nom Max Min Custom CSP 15 B3 Inches Nom Max 2.915 2.960 3.005 0.1148 0.1165 0.1183 1.285 1.330 1.375 0.0506 0.0524 0.0541 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.180 0.230 0.280 0.0071 0.0091 0.0110 0.180 0.230 0.280 0.0071 0.0091 0.0110 0.561 0.605 0.649 0.0221 0.0238 0.0256 0.355 0.380 0.405 0.0140 0.0150 0.0160 3500 pieces 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS Package Dimensions for CSPEMI306A Chip Scale Package # per tape and reel Controlling dimension: millimeters Rev. 2 | Page 12 of 13 | www.onsemi.com CSPEMI306A CSP Tape and Reel Specifications POCKET SIZE (mm) B0 X A0 X K0 3.10 X 1.45 X 0.74 PART NUMBER CSPEMI306A CHIP SIZE (mm) 2.96 X 1.33 X 0.605 TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500 P0 4mm P1 4mm Figure 13. Tape and Reel Mechanical Data ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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