CSPEMI400

SIM Card EMI Filter Array with ESD Protection CSPEMI400 Features • • • • • • • Three channels of EMI filtering, each with ESD protection Two additional channels of ESD-only protection ±10kV ESD protection (IEC 61000-4-2, contact discharge) ±25kV ESD protection (HBM) Greater than 30dB of attenuation at 1GHz 10-bump, 1.960mm x 1.330mm footprint Chip Scale Package (CSP) Lead-free version available Product Description The CSPEMI400 is an EMI filter array with ESD protection, which integrates three pi filters (C-R-C) and two additional channels of ESD protection. The CSPEMI400 has component values of 20pF-47Ω20pF, and 20pF-100Ω-20pF. The parts include avalanche-type ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports safely dissipate ESD strikes of ±10kV, exceeding the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±25kV. The ESD diodes on pins A4 and C4 ports are designed and characterized to safely dissipate ESD strikes of ±10kV, well beyond the maximum requirement of the IEC 61000-4-2 international standard. This device is particularly well suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package format and easy-to-use pin assignments. In particular, the CSPEMI400 is ideal for EMI filtering and protecting data lines from ESD for the SIM card slot in mobile handsets. The CSPEMI400 is available in a space-saving, lowprofile Chip Scale Package with optional lead-free finishing. Applications • • • SIM Card slot in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs, etc. EMI filtering for data ports in cell phones, PDAs or notebook computers ©2010 SCILLC. All rights reserved. May 2010 Rev. 2 Publication Order Number: CSPEMI400/D CSPEMI400 Electrical Schematic Lead-free devices are specified by using a "+" character for the top side or ientation mark. Rev. 2 | Page 2 of 11 | www.onsemi.com CSPEMI400 PIN DESCRIPTIONS TYPE EMI Filter EMI Filter Device Ground EMI Filter ESD Channel ESD Channel PIN A1 C1 A2 C2 B1 B2 A3 C3 A4 C4 DESCRIPTION EMI Filter with ESD Protection for RST Signal EMI Filter with ESD Protection for RST Signal EMI Filter with ESD Protection for CLK Signal EMI Filter with ESD Protection for CLK Signal Device Ground Device Ground DAT EMI Filter with ESD Protection DAT EMI Filter with ESD Protection ESD Proection Channel - VCC Supply ESD Proection Channel Ordering Information PART NUMBERING INFORMATION Standard Finish Bumps 10 Package CSP Ordering Part 1 Number CSPEMI400 Lead-free Finish Ordering Part 1 Number CSPEMI400G 2 Part Marking AG Part Marking AG Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. Rev. 2 | Page 3 of 11 | www.onsemi.com CSPEMI400 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 300 UNITS ° C mW mW STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS ° C Rev. 2 | Page 4 of 11 | www.onsemi.com CSPEMI400 ELECTRICAL OPERATING CHARACTERISTICS SYMBOL R1 R2 C PARAMETER Resistance of R1 Resistance of R2 Capacitance VIN = 2.5VDC, 1MHz, 30mV ac I = 10µA VBIAS = 3.3V CONDITIONS MIN 80 38 16 1 TYP 100 47 20 MAX 120 56 24 UNITS Ω Ω pF VSTANDOFF ILEAK VSIG Stand-off Voltage Diode Leakage Current Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω 6.0 300 V nA ILOAD = 10mA ILOAD = -10mA Notes 2 and 4 5.6 -1.5 6.8 -0.8 9.0 -0.4 V V VESD ±25 ±10 Notes 2,3 and 4 +12 -7 R = 100Ω, C = 20pF 77 kV kV VCL V V MHz fC1 fC2 R = 47Ω, C = 20pF 85 MHz Note 1: TA=25° unless otherwise specified. C Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open. Rev. 2 | Page 5 of 11 | www.onsemi.com CSPEMI400 Performance Information Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. A1-C1 EMI Filter Performance Figure 2. A2-C2 EMI Filter Performance Rev. 2 | Page 6 of 11 | www.onsemi.com CSPEMI400 Performance Information (cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 3. A3-C3 EMI Filter Performance Figure 4. Typical Diode Capacitance vs. Input Voltage (normalized to 2.5VDC) Rev. 2 | Page 7 of 11 | www.onsemi.com CSPEMI400 Application Information The CSPEMI400 provides a bidirectional filter and protector for all the signals and the power line on the SIM (subscriber identity module) card connector. SIM cards are found in all GSM cellular phones and in some other handheld devices or card readers. The ESD diodes protect the controller against possible ESD strikes that may occur when the connector pins are exposed during direct contact, or during insertion of the SIM card into the card slot. The EMI filter suppresses all high-frequency noise, preventing the unwanted EMI signals from both entering and exiting the main board. The signals that interface with the SIM card are the Reset, the Clock and the bidirectional data I/O, as shown in Typical Application Diagram for the SIM Card Interface. Note: One channel of the CSPEMI400 with a zener diode is not shown on the diagram. Figure 5. Typical Application Diagram for the SIM Card Interface For best filter and ESD performance, both GND bumps (B1, B2) of the CSPEMI400 should be directly connected to the Ground plane. A small capacitor of about 1µF is required next to the VCC pin of the SIM connector in order to improve stability of the SIM card supply rail. Rev. 2 | Page 8 of 11 | www.onsemi.com CSPEMI400 Application Information PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance — Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste VALUE 0.240mm Round Non-Solder Mask defined pads 0.290mm Round 0.125mm - 0.150mm 0.300mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50µm +20µm 60 seconds 260° C N on-Solder M ask D efined Pad 0.240m D m IA. Solder Stencil Opening 0.300m D m IA. Solder Mask Opening 0.290m D m IA. Figure 8. Recommended Non-Solder Mask Defined Pad Illustration Figure 9. Lead-free (SnAgCu) Solder Ball Reflow Profile Rev. 2 | Page 9 of 11 | www.onsemi.com CSPEMI400 CSP Mechanical Specifications The CSPEMI400 is supplied in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP, see the California Micro Devices CSP Package Information document. Controlling dimension: millimeters PACKAGE DIMENSIONS Package Bumps Dim Millimeters Min A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Nom Max Min Custom CSP 10 BOTTOM VIEW A1 Inches Nom Max C1 B2 B1 B4 B3 SIDE VIEW 1.915 1.960 2.005 0.0754 0.0772 0.0789 1.285 1.330 1.375 0.0506 0.0524 0.0541 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.180 0.230 0.280 0.0071 0.0091 0.0110 0.180 0.230 0.280 0.0071 0.091 0.0110 C B A 1 2 3 4 C2 D1 D2 A2 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS DIMENSIONS IN MILLIMETERS 0.562 0.606 0.650 0.0221 0.0239 0.0256 0.356 0.381 0.406 0.0140 0.0150 0.0160 3500 pieces Package Dimensions for CSPEMI400 Chip Scale Package # per tape and reel Rev. 2 | Page 10 of 11 | www.onsemi.com CSPEMI400 CSP Tape and Reel Specifications POCKET SIZE (mm) TAPE WIDTH B0 X A0 X K0 W 2.08 X 1.45 X 0.71 8mm PART NUMBER CSPEMI400 CHIP SIZE (mm) 1.96 X 1.33 X 0.606 REEL DIAMETER 178mm (7") QTY PER REEL 3500 P0 4mm P1 4mm Figure 9. Tape and Reel Mechanical Data ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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