EMI9106MUTAG

EMI9106 EMI Filter for MicroSD Interfaces Description The EMI9106 is a combination EMI filter and line termination device with integrated TVS diodes for use on Multimedia Card interfaces. This state−of−the−art device utilizes solid−state, silicon− avalanche technology for superior clamping performance and DC electrical characteristics. The EMI9106 has been optimized for protection of MicroSD interfaces in cellular phones and other portable electronics. The EMI9106 consists of six circuits that includes series impedance matching resistors as required by the SD specification. TVS diodes are included on each line for ESD protection. An additional TVS diode connection is included for protection of the voltage (Vcc) bus. Termination resistor value of 40 W is provided on the SDData0, SDData1, SDData2, SDData3, CMD, and CLK lines. The TVS diodes provide effective suppression of ESD voltages in excess of ±15 kV (contact discharge) per IEC 61000−4−2, level 4. The EMI9106 is in a 16−pin, RoHS/WEEE compliant, UDFN 16−pin package. It measures 3.30 x 1.35 x 0.50 mm. The leads are spaced at a pitch of 0.4 mm and are finished with lead−free NiPd. Features • Bidirectional EMI/RFI Filtering and Line Termination with • 16 1 UDFN16 CASE 517BE MARKING DIAGRAM 9106 MG G 1 9106 = Specific Device Code M = Single Character Date Code G = Pb−Free Package (*Note: Microdot may be in either location) PINOUT DIAGRAM SDData1 Data1 SDData0 Data0 SDCLK ESD1 ESD3 Applications • MicroSD Interfaces • MMC Interfaces • CDMA, GSM, 3G Cell Phones GND PAD • • • • • Integrated ESD Protection Provides ESD Protection to IEC61000−4−2: ±15 kV Contact Discharge TVS Working Voltage: 3.3 V Termination Resistors: 40 W Typical Capacitance per Line: 12 pF (VIN = 2.5 V) Protection and Termination for Six Lines + Vcc Solid−state Technology http://onsemi.com CLK ESD1 VCC SDCMD CMD SDData3 Data3 SDData2 Data2 (Top View) Mechanical Characteristics • • • • • 0.40 mm, uDFN 16−pin Package Nominal Dimensions: 3.30 x 1.35 x 0.50 mm Pitch: 0.4 mm Pin−lead Finish: NiPd RoHS/WEEE Compliance, Lead−free Finish © Semiconductor Components Industries, LLC, 2013 December, 2013 − Rev. 0 ORDERING INFORMATION Device Package Shipping† EMI9106MUTAG UDFN16 (Pb−Free) 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 1 Publication Order Number: EMI9106/D EMI9106 ELECTRICAL SCHEMATIC Table 1. PIN DESCRIPTIONS Pin Name Description 1 SDData1 Data line #1 input/output 2 SDData0 Data line #0 input/output 3 SDCLK Clock line Input/Output 4 ESD1 Single ESD 5 ESD3 Single ESD 6 SDCMD Command Line Input/Output 7 SDData3 Data line #3 input/output 8 SDData2 Data line #2 input/output 9 Data2 Data line #2 input/output 10 Data3 Data line #3 input/output 11 CMD Command Line Input/Output 12 VCC Power Supply ESD Protection 13 ESD1 Single ESD 14 CLK Clock line Input/Output 15 Data0 Data line #0 input/output 16 Data1 Data line #1 input/output GND PAD GND Ground return to shield http://onsemi.com 2 EMI9106 SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Rating Units Operating Temperature Range −40 to +85 °C Storage Temperature Range −55 to +150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Parameter RCH Channel Resistance (R1 to R6) LCH Channel Inductance C Conditions Capacitance per Channel VIN = 0 V; 1 MHz; 30 mVRMS Max Units 34 40 46 W 16 20 nH 24 VIN = 2.5 V; 1 MHz; 30 mVRMS; (Note 2) 12 0.1 0.5 6.8 −0.8 9.0 −0.4 Diode Leakage Current per Channel VIN = 3 V VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD = 10 mA ILOAD = −10 mA fC Typ 20 ILEAK VESD Min pF pF mA V ESD Protection − Peak Discharge Voltage at any channel input, in system: a) Contact discharge per IEC 61000−4−2 Standard and b) Air discharge per IEC 61000−4−2 Standard 5.6 −1.5 kV (Note 2) ±15 (Note 2) ±15 Cut−off frequency ZSOURCE = 50 W, ZLOAD = 50 W 300 1. All parameters specified at TA = 25°C unless otherwise noted. 2. This parameter is guaranteed by design and verified by device characterization http://onsemi.com 3 MHz EMI9106 PERFORMANCE INFORMATION 0 INSERTION LOSS (dB) −5 −10 −15 −20 −25 −30 −35 −40 −45 −50 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 FREQUENCY (Hz) Figure 1. Typical Insertion Loss vs. Frequency (Data0, Data1, Data2, Data3, CLK, CMD) http://onsemi.com 4 EMI9106 PACKAGE DIMENSIONS UDFN16, 3.3x1.35, 0.4P CASE 517BE ISSUE O A B D 2X 0.10 C PIN ONE REFERENCE 2X 0.10 C L1 ÉÉÉ ÉÉÉ DETAIL A E OPTIONAL CONSTRUCTIONS TOP VIEW EXPOSED Cu A DETAIL B 0.05 C (A3) 16X A1 0.05 C NOTE 4 16X A1 SIDE VIEW K 1 8 16 9 e C SEATING PLANE ÇÇ ÇÇ ÉÉ NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.25 mm FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. MOLD CMPD A3 DETAIL B OPTIONAL CONSTRUCTION DIM A A1 A3 b D D2 E E2 e K L L1 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 3.30 BSC 2.70 2.90 1.35 BSC 0.30 0.50 0.40 BSC 0.15 −−− 0.20 0.30 −−− 0.05 DETAIL A D2 L L L E2 16X RECOMMENDED SOLDERING FOOTPRINT* PACKAGE OUTLINE b BOTTOM VIEW 3.00 16X 0.40 0.10 C A B 0.05 C NOTE 3 1.55 0.50 16X 0.40 PITCH 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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