EMT1DXV6
Dual General Purpose
Transistor
PNP Dual
This transistor is designed for general purpose amplifier
applications. It is housed in the SOT−563 which is designed for low
power surface mount applications.
(3)
Features
• Lead−Free Solder Plating
• Low VCE(SAT), t0.5 V
• NSV Prefix for Automotive and Other Applications Requiring
•
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Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
(1)
Q1
Q2
(4)
(5)
(6)
6
MAXIMUM RATINGS
Rating
(2)
Symbol
Value
1
Unit
SOT−563
CASE 463A
STYLE 1
Collector −Emitter Voltage
VCEO
−60
V
Collector −Base Voltage
VCBO
−50
V
Emitter −Base Voltage
VEBO
−6.0
V
IC
−100
mAdc
MARKING DIAGRAM
Symbol
Max
Unit
3T M G
G
Collector Current − Continuous
THERMAL CHARACTERISTICS
Characteristic
(One Junction Heated)
Total Device Dissipation
TA = 25°C
PD
Derate above 25°C
1
mW/°C
3T = Specific Device Code
M = Month Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
RqJA
350
(Note 1)
°C/W
Symbol
Max
Unit
ORDERING INFORMATION
mW
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Thermal Resistance,
Junction-to-Ambient
Characteristic
(Both Junctions Heated)
mW
357
(Note 1)
2.9
(Note 1)
Total Device Dissipation
TA = 25°C
PD
500
(Note 1)
4.0
(Note 1)
Derate above 25°C
mW/°C
Thermal Resistance,
Junction-to-Ambient
RqJA
250
(Note 1)
°C/W
Junction and Storage
Temperature Range
TJ, Tstg
−55 to +150
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−4 @ Minimum Pad.
© Semiconductor Components Industries, LLC, 2014
November, 2014 − Rev. 2
1
Publication Order Number:
EMT1DXV6T1/D
EMT1DXV6
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Symbol
Min
Typ
Max
Unit
Collector−Base Breakdown Voltage
(IC = −50 mAdc, IE = 0)
V(BR)CBO
−60
−
−
Vdc
Collector−Emitter Breakdown Voltage
(IC = −1.0 mAdc, IB = 0)
V(BR)CEO
−50
−
−
Vdc
Emitter−Base Breakdown Voltage
(IE = −50 mAdc, IE = 0)
V(BR)EBO
−6.0
−
−
Vdc
Collector−Base Cutoff Current
(VCB = −30 Vdc, IE = 0)
ICBO
−
−
−0.5
nA
Emitter−Base Cutoff Current
(VEB = −5.0 Vdc, IB = 0)
IEBO
−
−
−0.5
mA
−
−
−0.5
120
−
560
−
140
−
−
3.5
−
Characteristic
Collector−Emitter Saturation Voltage (Note 2)
(IC = −50 mAdc, IB = −5.0 mAdc)
VCE(sat)
DC Current Gain (Note 2)
(VCE = −6.0 Vdc, IC = −1.0 mAdc)
Vdc
hFE
Transition Frequency
(VCE = −12 Vdc, IC = −2.0 mAdc, f = 30 MHz)
−
fT
Output Capacitance
(VCB = −12 Vdc, IE = 0 Adc, f = 1 MHz)
COB
MHz
pF
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Pulse Test: Pulse Width ≤ 300 ms, D.C. ≤ 2%.
ORDERING INFORMATION
Package
Shipping†
EMT1DXV6T1G
SOT−563
(Pb−Free)
4000 / Tape & Reel
NSVEMT1DXV6T1G*
SOT−563
(Pb−Free)
4000 / Tape & Reel
EMT1DXV6T5G
SOT−563
(Pb−Free)
8000 / Tape & Reel
NSVEMT1DXV6T5G*
SOT−563
(Pb−Free)
8000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP
Capable.
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2
EMT1DXV6
TYPICAL CHARACTERISTICS
1000
VCE = 10 V
120
90
300 mA
250
200
60
150
IB = 50 mA
0
3
6
12
9
10
0.1
15
10
100
IC, COLLECTOR CURRENT (mA)
Figure 1. IC − VCE
Figure 2. DC Current Gain
900
TA = 25°C
800
COLLECTOR VOLTAGE (mV)
VCE , COLLECTOR‐EMITTER VOLTAGE (V)
1
VCE, COLLECTOR VOLTAGE (V)
2
1.5
1
0.5
700
600
500
400
300
TA = 25°C
VCE = 5 V
200
100
0
0.01
0.1
1
10
0
0.2
100
1
5
10
20
40
60
80
IC, COLLECTOR CURRENT (mA)
Figure 3. Collector Saturation Region
Figure 4. On Voltage
13
14
12
12
11
10
9
8
7
6
0.5
IB, BASE CURRENT (mA)
Cob, CAPACITANCE (pF)
Cib, INPUT CAPACITANCE (pF)
TA = - 25°C
100
100
30
0
TA = 25°C
TA = 75°C
DC CURRENT GAIN
IC, COLLECTOR CURRENT (mA)
TA = 25°C
100
150 200
10
8
6
4
2
0
1
2
3
0
4
0
VEB (V)
10
20
VCB (V)
Figure 5. Capacitance
Figure 6. Capacitance
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3
30
40
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOT−563, 6 LEAD
CASE 463A
ISSUE H
6
1
SCALE 4:1
DOCUMENT NUMBER:
DESCRIPTION:
98AON11126D
SOT−563, 6 LEAD
DATE 26 JAN 2021
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 2
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
SOT−563, 6 LEAD
CASE 463A
ISSUE H
DATE 26 JAN 2021
GENERIC
MARKING DIAGRAM*
XX MG
1
XX = Specific Device Code
M = Month Code
G
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
DOCUMENT NUMBER:
DESCRIPTION:
98AON11126D
SOT−563, 6 LEAD
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 2 OF 2
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
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, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
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