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FAN23SV15MAMPX
15 A Synchronous Buck Regulator
Features
Description
VIN Range: 7 V to 18 V Using Internal Linear
Regulator for Bias
VIN Range: 4.5 V to 5.5 V with VIN/PVIN/PVCC
Connected to Bypass Internal Regulator
High Efficiency: Over 96% Peak
The FAN23SV15MA is a highly efficient synchronous
buck regulator. The regulator is capable of operating
with an input range from 7 V to 18 V and supporting up
to 15 A load currents. The device can operate from a
5 V rail (±10%) if VIN, PVIN, and PVCC are connected
together to bypass the internal linear regulator.
Continuous Output Current: 15 A
Internal Linear Bias Regulator
Accurate Enable facilitates VIN UVLO Functionality
PFM Mode for Light-Load Efficiency
Excellent Line and Load Transient Response
Precision Reference: ±1% Over Temperature
Output Voltage Range: 0.6 to 5.5 V
Programmable Frequency: 200 kHz to 1 MHz
Programmable Soft-Start
Low Shutdown Current
Adjustable Sourcing Current Limit
The FAN23SV15MA utilizes Fairchild’s constant on-time
control architecture to provide excellent transient
response and to maintain a relatively constant switching
frequency. The device utilizes Pulse Frequency
Modulation (PFM) mode to maximize light-load
efficiency by reducing switching frequency when the
inductor is operating in discontinuous conduction mode
at light loads.
Switching frequency and over-current protection can
be programmed to provide a flexible solution for
various applications. Output over-voltage, undervoltage, over-current, and thermal shutdown protections
help prevent damage to the device during fault
conditions. After thermal shutdown is activated, a
hysteresis feature restarts the device when normal
operating temperature is reached.
Internal Boot Diode
Thermal Shutdown
Halogen and Lead Free, RoHS Compliant
Applications
Servers and Desktop Computers
NVDC Notebooks, Netbooks
Game Consoles
Telecommunications
Storage
Ordering Information
Part Number
Configuration
Operating
Temperature Range
Output
Current (A)
Package
FAN23SV15MAMPX
PFM, No Ultrasonic
Mode
-40 to 125°C
15
34-Lead, PQFN,
5.5 mm x 5.0 mm
© 2015 Fairchild Semiconductor Corporation
FAN23SV15MA • Rev. 1.1
www.fairchildsemi.com
FAN23SV15MAMPX — 15 A Synchronous Buck Regulator
November 2015
VIN = 12V
VIN = 12V
R11
10Ω
C9
0.1µF
C10
2.2µF
CIN
0.1µF
R7
64.9kΩ
PVCC
VCC
Ext
EN
VIN
PVIN
C3
0.1µF
EN
R7, R8 used for Accurate EN
R7, R8 open for Ext EN
CIN
4x10µF
R8
10kΩ
L1
0.56µH
SW
PGOOD
ILIM
SOFT START
R2
1.5kΩ
R5 1.37kΩ
C7
15nF
VOUT = 1.2V
IOUT=0-15A
BOOT
FAN23SV15MA
C4
0.1µF
C5
100pF
FREQ
R3
10kΩ
COUT
8x47µF
FB
R9
54.9kΩ
AGND
R6
4.99kΩ
PGND
R4
10kΩ
Figure 1. Typical Application with VIN = 12 V
VIN = 5V
R11
10Ω
C9
0.1µF
PVCC
VCC
Ext
EN
C10
2.2µF
CIN
0.1µF
VIN
PVIN
C3
0.1µF
EN
FAN23SV15MA
L1
0.56µH
ILIM
SOFT START
R5 1.37kΩ
R2
1.5kΩ
C4
0.1µF
C5
100pF
FREQ
R9
54.9kΩ
VOUT = 1.2V
IOUT=0-15A
BOOT
SW
PGOOD
C7
15nF
CIN
4x10µF
FAN23SV15 MAMPX — 15 A Synchronous Buck Regulator
Typical Application Diagram
R3
10kΩ
COUT
8x47µF
FB
AGND
R6
4.99kΩ
PGND
R4
10kΩ
Figure 2. Typical Application with VIN=5 V
© 2015 Fairchild Semiconductor Corporation
FAN23SV15MA • Rev. 1.1
www.fairchildsemi.com
2
VIN
BOOT
PVIN
PVCC
Linear
Regulator
PVCC
VCC
VCC
VCC UVLO
1.26V/1.14V
PVCC
EN
ENABLE
VCC
VCC
10µA
Modulator
HS Gate
Driver
SS
FB
FB
Comparator
VREF
SW
FREQ
PFM
Comparator
Control
Logic
x1.2
2nd Level OVP
Comparator
PVCC
st
x1.1
1 Level OVP
Comparator
x0.9
Under-Voltage
Comparator
LS Gate
Driver
VCC
PGOOD
Thermal
Shutdown
10µA
Current Limit
Comparator
AGND
ILIM
PGND
Figure 3. Block Diagram
© 2015 Fairchild Semiconductor Corporation
FAN23SV15MA • Rev. 1.1
www.fairchildsemi.com
3
FAN23SV15MAMPX — 15 A Synchronous Buck Regulator
Functional Block Diagram
VIN
PVIN
9
SW
PVIN
8
BOOT
PVIN
7
AGND
PVIN
6
PVIN
PVIN
5
PVIN
AGND
4
PVIN
BOOT
3
PVIN
SW
2
PVIN
VIN
1
9
8
7
6
5
4
3
2
1
10
PVIN
PVIN 10
34
NC
11
PVIN
PVIN 11
33
NC
12
SW
SW
12
32
FREQ
13
SW
SW 13
31
SS
14
SW
SW
30 PGOOD
29
15
SW
SW 15
29
EN
NC
28
16
SW
SW 16
28
NC
FB
27
17
SW
SW 17
27
FB
24
23
22
PVCC
ILIM
AGND
SW
PGND
19
18
Figure 4. Pin Assignments, Bottom View
18
19
20
21
22
23
24
25
26
VCC
25
20
PVCC
26
21
VCC
EN
14
ILIM
SW
(P3)
PGOOD 30
AGND
AGND
(P1)
SW
31
PGND
SS
PGND
32
PGND
FREQ
PGND
33
PGND
NC
PVIN
(P2)
PGND
34
PGND
NC
Figure 5. Pin Assignments, Top View
Pin Definitions
Name
Pad / Pin
PVIN
P2, 5-11
VIN
1
Power input to the linear regulator; used in the modulator for input voltage feed-forward
PVCC
25
Power output of the linear regulator; directly supplies power for the low-side gate driver
and boot diode. Can be connected to VIN and PVIN for operation from 5 V rail.
Power supply input for the controller
VCC
26
PGND
18-21
AGND
P1, 4, 23
SW
Description
Power input for the power stage
Power ground for the low-side power MOSFET and for the low-side gate driver
Analog ground for the analog portions of the IC and for substrate
P3, 2, 12-17, 22 Switching node; junction between high-and low-side MOSFETs
BOOT
3
Supply for high-side MOSFET gate driver. A capacitor from BOOT to SW supplies the
charge to turn on the N-channel high-side MOSFET. During the freewheeling interval
(low-side MOSFET on), the high-side capacitor is recharged by an internal diode
connected to PVCC.
ILIM
24
Current limit. A resistor between ILIM and SW sets the current limit threshold.
FB
27
Output voltage feedback to the modulator
EN
29
Enable input to the IC. Pin must be driven logic high to enable, or logic low to disable.
SS
31
Soft-start input to the modulator
FREQ
32
On-time and frequency programming pin. Connect a resistor between FREQ and
AGND to program on-time and switching frequency.
PGOOD
30
Power good; open-drain output indicating VOUT is within set limits.
NC
28, 33-34
Leave pin open or connect to AGND.
© 2015 Fairchild Semiconductor Corporation
FAN23SV15MA • Rev. 1.1
www.fairchildsemi.com
4
FAN23SV15MAMPX — 15 A Synchronous Buck Regulator
Pin Configuration
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
VPVIN
VIN
VBOOT
VSW
VBOOT
Parameter
Conditions
Min.
Max.
Unit
Power Input
Referenced to PGND
-0.3
25.0
V
Modulator Input
Referenced to AGND
-0.3
25.0
V
Referenced to PVCC
-0.3
26.0
V
Referenced to PVCC, +11% of VREF (666 mV), both HS and LS
turn off. By turning off the LS during an OV event, V OUT
overshoot can be reduced when there is positive
inductor current by increasing the rate of discharge.
www.fairchildsemi.com
12
FAN23SV15MAMPX — 15 A Synchronous Buck Regulator
To reduce VOUT ripple and achieve a smoother ramp of
the output voltage, tON is modulated during soft-start. tON
starts at 50% of the steady-state on-time (PWM Mode)
and ramps up to 100% gradually.
(12)
A second over-voltage detection is implemented to
protect the load from more serious failure. When VFB
rises +22% above the VREF (732 mV), the HS latches off
until a power cycle on VCC and the LS is forced on until
530 mV of VFB.
The minimum value of C5 can be selected to minimize
the capacitive component of ripple appearing on the
feedback pin:
(13)
Over-Temperature Protection (OTP)
FAN23SV15MA incorporates an over-temperature
protection circuit that disables the converter when the
controller die temperature reaches 155°C. The IC
restarts when the die temperature falls below 140°C.
Using the minimum value of C5 generally offers the best
transient response, and 100 pF is a good initial value in
many applications. Under some operating conditions,
excessive pulse jitter may be observed. To reduce jitter
and improve stability, the value of C5 can be increased:
Power Good (PGOOD)
The PGOOD pin serves as an indication to the system
that the output voltage of the regulator is stable and
within regulation. Whenever VOUT is outside the
regulation window or the regulator is at overtemperature (UV, OV, and OT), the PGOOD pin is
pulled LOW.
(14)
5 V PVCC
Application Information
The PVCC is the output of the internal regulator that
supplies power to the drivers and VCC. It is crucial to keep
this pin decoupled to PGND with a ≥1 µF X5R or X7R
ceramic capacitor. Because VCC powers internal analog
circuit, it is filtered from PVCC with a 10 Ω resistor and
0.1 µF X7R decoupling ceramic capacitor to AGND.
Stability
Setting the Output Voltage (VOUT)
Constant on-time stability consists of two parameters:
stability criterion and sufficient signal at VFB.
The output voltage VOUT is regulated by initiating a highside MOSFET on-time interval when the valley of the
divided output voltage appearing at the FB pin reaches
VREF. Since this method regulates at the valley of the
output ripple voltage, the actual DC output voltage on
VOUT is offset from the programmed output voltage by
the average value of the output ripple voltage. The initial
VOUT setting of the regulator can be programmed from
0.6 V to 5.5 V by an external resistor divider (R3 and
R4):
PGOOD is an open-drain output that asserts LOW when
VOUT is out of regulation or when OT is detected.
Stability criterion is given by:
(9)
Sufficient signal requirement is given by:
(10)
where IIND is the inductor current ripple and VFB is
the ripple voltage on VFB, which should be ≥12 mV.
(15)
In certain applications, especially designs utilizing only
ceramic output capacitors, there may not be sufficient
ripple magnitude available on the feedback pin for
stable operation. In this case, an external circuit
consisting of 2 resistors (R2 and R6) and 2 capacitors
(C4 and C5) can be added to inject ripple voltage into
the FB pin (See Figure 1).
where VREF is 600 mV.
For example; for 1.2 V VOUT and 10 k R3, then R4 is
10 k. For 600 mV VOUT, R4 is left open. VFB is
trimmed to a value of 596 mV when VREF=600 mV, so
the final output voltage, including the effect of the output
ripple voltage, can be approximated by the equation:
There are some specific considerations when selecting
the RCC ripple injector circuit. For typical applications,
use 4.99 kΩ for R6; the value of C4 can be selected as
0.1 µF and approximate values for R2 and C5 can be
determined using the following equations.
(16)
Setting the Switching Frequency (fSW)
fSW is programmed through external RFREQ as follows:
R2 must be small enough to develop 12 mV of ripple:
(17)
(11)
where CtON=2.2 pF internal capacitor that generates
tON. For example; for fSW=500 kHz and VOUT=1.2 V,
select a standard value for RFREQ=54.9 k.
R2 must be selected such that the R2C4 time constant
enables stable operation:
© 2015 Fairchild Semiconductor Corporation
FAN23SV15MA • Rev. 1.1
www.fairchildsemi.com
13
FAN23SV15MAMPX — 15 A Synchronous Buck Regulator
Once the VFB voltage falls below VREF, the latched OV
signal is cleared and operation returns to normal.
The inductor is typically selected based on the ripple
current (IL), which is usually selected as 25% to 45% of
the maximum DC load. The inductor current rating
should be selected such that the saturation and heating
The inductor value is given by:
(21)
(18)
where IMAX and IMIN are maximum and minimum
load steps, respectively and VOUT is the voltage
overshoot, usually specified at 3 to 5%.
For example: for 12 V VIN, 1.2 V VOUT, 15 A load, 25%
IL, and 500 kHz fSW; L=576 nH, and a standard value of
560 nH is selected.
For example: for VI=12 V, VOUT=1.2 V, 10 A IMAX, 5 A
IMIN, fSW =500 kHz, LOUT=560 nH, and 4% VOUT
deviation of 48 mV; the COUT value is calculated to be
356 µF. This capacitor requirement can be satisfied
using eight 47 µF, 6.3 V-rated X5R ceramic capacitors.
This calculation applies for load current slew rates that
are faster than the inductor current slew rate, which can
be defined as VOUT/L during the load current removal.
Input Capacitor Selection
Input capacitor CIN is selected based on voltage rating,
RMS current ICIN(RMS) rating, and capacitance. For
capacitors having DC voltage bias derating, such as
ceramic capacitors, higher rating is strongly
recommended. RMS current rating is given by:
Setting the Current Limit
(19)
Current limit is implemented by sensing the inductor
valley current across the LS MOSFET VDS during the LS
on-time. The current limit comparator prevents a new
on-time from being started until the valley current is less
than the current limit.
where ILOAD-MAX is the maximum load current and D
is the duty cycle VOUT/VIN. The maximum ICIN(RMS)
occurs at 50% duty cycle.
The capacitance is given by:
The set point is configured by connecting a resistor from
the ILIM pin to the SW pin. A trimmed current is output
onto the ILIM pin, which creates a voltage across the
resistor. When the voltage on ILIM goes negative, an
over-current condition is detected.
(20)
where VIN is the input voltage ripple, normally 1% of
VIN.
RILIM is calculated by:
For example; for VIN=1 2V, VIN=120 mV, VOUT=1.2 V,
15 A load, and fSW=500 kHz; CIN is 22.5 µF and ICIN(RMS)
is 4.5 ARMS. Select four 10 µF 25 V-rated ceramic
capacitors with X7R or similar dielectric, recognizing
that the capacitor DC bias characteristic indicates that
the capacitance value falls approximately 40% at
VIN=12 V, with a resultant small increase in VIN ripple
voltage above 120 mV used in the calculation. Also,
each 10 µF can carry over 3 ARMS in the frequency
range from 100 kHz to 1 MHz, exceeding the input
capacitor current rating requirements. An additional 1 µF
capacitor may be needed to suppress noise generated
by high frequency switching transitions.
(22)
where KILIM is the current source scale factor, and
IVALLEY is the inductor valley current when the current
limit threshold is reached. The factor 1.08 accounts
for the temperature offset of the LS MOSFET
compared to the control circuit.
With the constant on-time architecture, HS is always
turned on for a fixed on-time; this determines the peakto-peak inductor current.
Current ripple I is given by:
Output Capacitor Selection
(23)
Output capacitor COUT is selected based on voltage
rating, RMS current ICOUT(RMS) rating, and capacitance.
For capacitors having DC voltage bias derating, such as
ceramic capacitors, higher rating is highly recommended.
From the equation above, the worst-case ripple occurs
during an output short circuit (where VOUT is 0 V). This
should be taken into account when selecting the current
limit set point.
When calculating COUT, usually the dominant
requirement is the current load step transient. If the
unloading transient requirement (IOUT transitioning from
HIGH to LOW), is satisfied, then the load transient (IOUT
transitioning LOW to HIGH), is also usually satisfied.
The unloading COUT calculation, assuming COUT has
negligible parasitic resistance and inductance in the
circuit path, is given by:
© 2015 Fairchild Semiconductor Corporation
FAN23SV15MA • Rev. 1.1
www.fairchildsemi.com
14
FAN23SV15MAMPX — 15 A Synchronous Buck Regulator
current ratings exceed the intended currents
encountered in the application over the expected
temperature range of operation. Regulators that require
fast transient response use smaller inductance and
higher current ripple; while regulators that require higher
efficiency keep ripple current on the low side.
Inductor Selection
The AGND thermal pad (P1) should be connected to
AGND plane on inner layer using four 0.25 mm vias
spread under the pad. No vias are included under PVIN
(P2) and SW (P3) to maintain the PGND plane under
the power circuitry intact.
The valley current level for calculating RILIM is given by:
(24)
where ILOAD (CL) is the DC load current when the
current limit threshold is reached.
Power circuit loops that carry high currents should be
arranged to minimize the loop area. Primary focus
should be directed to minimize the loop for current flow
from the input capacitor to PVIN, through the internal
MOSFETs, and returning to the input capacitor. The
input capacitor should be placed as close to the PVIN
terminals as possible.
For example: In a converter designed for 15 A steadystate operation and 4.5 A current ripple, the current-limit
threshold could be selected at 120% of ILOAD,(SS) to
accommodate transient operation and inductor value
decrease under loading. As a result, ILOAD,(CL) is 18 A,
IVALLEY=15.75 A, and RILIM is selected as the standard
value of 1.37 k.
The current return path from PGND at the low-side
MOSFET source to the negative terminal of the input
capacitor can be routed under the inductor and also
through vias that connect the input capacitor and lowside MOSFET source to the PGND region under the
power portion of the IC.
Boot Resistor
In some applications, especially with higher input voltage,
the VSW ring voltage may exceed derating guidelines of
80% to 90% of absolute rating for VSW. In this situation a
resistor can be connected in series with boot capacitor
(C3 in Figure 1) to reduce the turn-on speed of the high
side MOSFET to reduce the amplitude of the VSW ring
voltage.
The SW node trace which connects the source of the
high-side MOSFET and the drain of the low-side
MOSFET to the inductor should be short and wide.
To control the voltage across the output capacitor, the
output voltage divider should be located close to the FB
pin, with the upper FB voltage divider resistor connected
to the positive side of the output capacitor, and the
bottom resistor should be connected to the AGND
portion of the FAN23SV15MA device.
PCB (Printed Circuit Board) Layout
Guidelines
The following points should be considered before
beginning a PCB layout using the FAN23SV15MA. A
sample PCB layout from the evaluation board is shown in
Figure 24-Figure 27 following the layout guidelines.
When using ceramic capacitor solutions with external
ramp injection circuitry (R2, C4, C5 in Figure 1), R2 and
C4 should be connected near the inductor, and coupling
capacitor C5 should be placed near FB pin to minimize
FB pin trace length.
Power components consisting of the input capacitors,
output capacitors, inductor, and FAN23SV15MA
device should be placed on a common side of the pcb
in close proximity to each other and connected using
surface copper.
Decoupling capacitors for PVCC and VCC should be
located close to their respective device pins.
Sensitive analog components including SS, FB, ILIM,
FREQ, and EN should be placed away from the highvoltage switching circuits such as SW and BOOT, and
connected to their respective pins with short traces.
SW node connections to BOOT, ILIM, and ripple injection
resistor R2 should be made through separate traces.
The inner PCB layer closest to the FAN23SV15MA
device should have Power Ground (PGND) under the
power processing portion of the device (PVIN, SW, and
PGND). This inner PCB layer should have a separate
Analog Ground (AGND) under the P1 pad and the
associated analog components. AGND and PGND
should be connected together near the IC between
PGND pins 18-21 and AGND pin 23 which connects to
P1 thermal pad.
© 2015 Fairchild Semiconductor Corporation
FAN23SV15MA • Rev. 1.1
www.fairchildsemi.com
15
FAN23SV15MAMPX — 15 A Synchronous Buck Regulator
The FAN23SV15MA uses valley-current sensing; the
current limit (IILIM) set point is the valley (IVALLEY).
FAN23SV15MAMPX — 15 A Synchronous Buck Regulator
Figure 24. Evaluation Board Top Layer Copper
Figure 25. Evaluation Board Inner Layer 1 Copper
© 2015 Fairchild Semiconductor Corporation
FAN23SV15MA • Rev. 1.1
www.fairchildsemi.com
16
FAN23SV15MAMPX — 15 A Synchronous Buck Regulator
Figure 26. Evaluation Board Inner Layer 2 Copper
Figure 27. Evaluation Board Bottom Layer Copper
© 2015 Fairchild Semiconductor Corporation
FAN23SV15MA • Rev. 1.1
www.fairchildsemi.com
17
5.50±0.10
26
18
1.05±0.10
17
27
0.25±0.05 (30X)
5.00±0.10
34
0.25±0.05
0.025±0.025
10
1
9
SEATING
PLANE
PIN#1
INDICATOR
SEE
DETAIL 'A'
1.58±0.01
(0.35)
SCALE: 2:1
2.18±0.01
(0.43)
0.50±0.01
9
1
(0.25)
0.40±0.01 (30X)
(0.35) 34
10
0.68±0.01
(0.35)
3.50±0.01
2.58±0.01
(1.75)
17
(0.75)
(0.33)
(0.35)
27
0.43±0.01
18
26
(0.35)
NOTES: UNLESS OTHERWISE SPECIFIED
A) NO INDUSTRY REGISTRATION APPLIES.
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE BURRS
OR MOLD FLASH. MOLD FLASH OR
BURRS DOES NOT EXCEED 0.10MM.
D) DIMENSIONING AND TOLERANCING PER
ASME Y14.5M-2009.
E) DRAWING FILE NAME: MKT-PQFN34AREV2
F) FAIRCHILD SEMICONDUCTOR
(0.25)
(0.28) (3X)
(0.24)
1.75±0.01
5.70
2.18
1.58
0.55 (30X)
2.10
(0.35)
1.80
26
18
0.55
17
27
(1.75)
2.58
4.10
3.50
3.60
(1.85)
0.68
34
10
0.75
1
(0.30)
9
(0.35)
0.50±0.05
0.43
(0.08)
4.10
LAND PATTERN
RECOMMENDATION
0.20
0.30 (30X)
5.20
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are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
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