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FAN2558/FAN2559
180mA Low Voltage CMOS LDO
Features
General Description
• Fixed 1.0V, 1.2V, 1.3V, 1.5V, 1.8V, 2.5V, 3.3V, 3.5V, 3.6V,
3.8V and Adjustable Output
• Power Good Indicator with Open Drain Output
• 180mA Output Current
• 100µA Ground Current
• Cbypass for Low Noise Operation
• Fast Enable for CDMA Applications
• High Ripple Rejection
• Current Limit
• Thermal Shutdown
• Excellent Line and Load Regulation
• Requires Only 1µF Output Capacitor
• Stable with 0 to 300mΩ ESR
• TTL-level Compatible Enable Input
• Active Output Discharge
The FAN2558/9 low voltage CMOS LDOs feature fixed or
adjustable output voltage, 180mA load current, delayed
power good output (open drain) and 1% output accuracy
with excellent line and load regulation. An external bypass
capacitor provides ultra-low noise operation.
Applications
•
•
•
•
The FAN2558/9 low voltage LDOs incorporate both thermal
shutdown and short circuit protection. Output is stable with a
1µF, low ESR capacitor. The FAN2558/9 family is available
in 5-Lead SOT-23, 6-Lead SOT-23 and 2x2mm MLP-6
packages.
FAN2558: Fixed Output LDO with Power Good output
FAN2558ADJ: Adjustable Output LDO with Power Good
output
FAN2559: Fixed Output LDO with Power Good output,
Low Noise
Processor Power-up sequencing
PDAs, Cell Phones
Portable Electronic Equipment
PCMCIA Vcc and Vpp regulation/switching
Available standard output voltages are 1.0, 1.2V, 1.3V, 1.5V,
1.8V, 2.5V, 3.3V, 3.5V, 3.6V, and 3.8V. Custom output voltage options are also available.
Typical Application
47KΩ
47KΩ
47KΩ
RPG
RPG
RPG
FB
VIN
FB
VIN
VOUT
C OUT
SHDN
GND
CAP+
CAP+
CAPEN
FAN2558
PG
R1
SHDN
GND
CAPEN
FB
R2
FAN2558ADJ
C OUT
C OUT
SHDN
GND
ADJ
PG
VOUT
VIN
VOUT
CAP+
CAPEN
CBYP
C BYP
PG
FAN2559
REV. 1.0.4 3/15/04
FAN2558/FAN2559
PRODUCT SPECIFICATIONS
Pin Assignments
TOP-VIEW
VIN 1
VIN 1
5 VOUT
GND 2
EN 3
GND
2
5 ADJ/BYP
EN
3
4 PG
4 PG
FAN2558
5-Lead SOT-23 PACKAGE
VOUT
NC/ADJ/BYP
PG
6 VOUT
FAN2558ADJ/FAN2559
6-Lead SOT-23 PACKAGE
1
6
2
5
3
4
VIN
GND
EN
FAN2558/FAN2558ADJ/FAN2559
2x2mm MLP-6 PACKAGE
Pin Name
Pin no.
FAN2558
FAN2558ADJ
FAN2559
5SOT-23
2x2mm MLP-6
6SOT-23
2x2mm MLP-6
6SOT-23
2x2mm MLP-6
1
VIN
VOUT
VIN
VOUT
VIN
VOUT
2
GND.
NC
GND.
ADJ
GND.
BYP
3
EN
PG
EN
PG
EN
PG
4
PG
EN
PG
EN
PG
EN
5
VOUT
GND
ADJ
GND
BYP
GND
VIN
VOUT
VIN
VOUT
VIN
6
Pin Descriptions
Symbol
VIN
Power Supply Input
VOUT
Regulated Voltage Output
GND
Ground Connection
PG
Power Good Output, Open Drain
ADJ
Ratio of potential divider from Vout to ADJ determines output voltage
BYP
Reference Noise Bypass
EN
2
Pin Function Description
Chip Enable Input. The regulator is fully enabled when TTL “H” is applied to this input. The regulator
enters into shutdown mode when TTL “L” is applied to this input.
REV. 1.0.4 3/15/04
PRODUCT SPECIFICATIONS
FAN2558/FAN2559
Absolute Maximum Ratings
Parameter
Min.
Max.
6
V
Voltage on any other pin to GND
-0.3
VIN + 0.3
V
Junction Temperature (TJ)
-55
150
°C
Storage Temperature
-65
150
°C
300
°C
Internally
Limited
W
VIN to GND
Lead Soldering Temperature, 10 seconds
Power Dissipation (PD)
Electrostatic Discharge (ESD) Protection (Note1)
HBM
4
CDM
1
Units
kV
Recommended Operating Conditions
Parameter
Max.
Units
Supply Voltage Range, VIN for VOUT < 2.0V
Min.
2.7
5.5
V
Supply Voltage Range, VIN for VOUT ≥ 2.0V
VOUT + VDROPOUT
5.5
V
180
mA
VIN
V
Load Current
Enable Input Voltage VEN
Power Good Output Voltage Range VPG
Junction Temperature
0
Typ.
0
VIN
V
-40
125
°C
Thermal Resistance-Junction to Ambient SOT-23 (Note 2)
235
Thermal Resistance-Junction to Case, 2mm x 2mm
6-lead MLP
75
°C/W
Notes:
1. Using Mil Std. 883E, method 3015.7 (Human Body Model) and EIA/JESD22C101-A (Charge Device Model)
2. Junction to ambient thermal resistance, ΘJC, is a strong function of PCB material, board thickness, thickness and number of
copper plains, number of via used, diameter of via used, available copper surface, and attached heat sink characteristics.
REV. 1.0.4 3/15/04
3
FAN2558/FAN2559
PRODUCT SPECIFICATIONS
Electrical Characteristics
VIN = VIN min (note 5) to 5.5V, VEN = VIN, ILOAD = 100µA, TA = -40°C to +85°C, unless otherwise noted. Typical values
are at 25°C.
Symbol
VOUT
VOUT(ADJ)
Parameter
Conditions
Min.
Typ.
Max.
Units
Output Voltage Accuracy
(Note 3)
ILOAD = 100µA
-2
1
2
%
Output Voltage Range
(Adjustable)
ILOAD = 100µA
1
VIN
V
VIN min < VIN < 5.5V
-0.3
0.3
%/V
4
%
∆VOUT_LNR
Line Regulation
∆VOUT_LDR
Load Regulation (Note 4)
ILOAD = 0.1mA to 150mA
2.5
µA
ISD
Supply Current in Shutdown
Mode
VEN < 0.4V
PG = No Connection
0.1
IGND
Ground Pin Current (Note 4)
ILOAD = 0mA, VIN = 5.5V
90
150
ILOAD = 150mA, VIN = 5.5V
110
150
350
500
ILIM
Current Limit
TSD
Thermal Shutdown
Temperature
VOUT = 0V
260
150
Thermal Shutdown Hysteresis
Enable Input Low
VIN = 5.5V, Shutdown
VENH
Enable Input High
VIN = 5.5V, Enabled
IE
VPG
Enable Input Current
mA
°C
10
VENL
µA
°C
0.4
1.6
V
V
VENL ≤ 0.4V, VIN = 5.5V
0.01
VENH ≥ 1.6V, VIN = 5.5V
0.01
µA
Low Threshold
% of VOUT PG ON
High Threshold
% of VOUT PG OFF
PG Output Low Voltage
IPG_SINK = 100µA,
Fault Condition
0.02
IPG
PG Leakage Current
PG off, VPG =5.5V
0.01
TEN
Enable Response Time
COUT = 1µF
CBYPASS = 10nF
30
300
µS
TON
Power "ON" Delay Time
COUT = 1µF
CBYPASS = 10nF
VENL ≥ 1.6V,
VIN = 0V to VOUT + 1V
300
500
µS
DPG
PG Delay time
5
mS
VPGL
VDROP-OUT
Dropout Voltage
(For Adjustable Output
Version)
VFB_ADJ
Feedback Voltage
(For Adjustable Output
Version)
89
%
1
VOUT > 2.7V and
ILOAD = 180mA
97
%
0.1
V
µA
400
mV
0.59
V
Note:
3. Guaranteed ±1% output voltage accuracy parts are available on customer request.
4. Measured at constant junction temperature using low duty cycle pulse testing.
5. VIN min = 2.7V or (VOUT + 1V), whichever is greater.
4
REV. 1.0.4 3/15/04
PRODUCT SPECIFICATIONS
FAN2558/FAN2559
DC Electrical Characteristics (Continued)
VIN = VIN min (note 5) to 5.5V, VEN = VIN, ILOAD = 100µA, TA = -40°C to +85°C, unless otherwise noted. Typical
values are at 25°C.
Symbol
Parameter
Conditions
PSRR
Power Supply Rejection Ratio
DC to 100kHz
COUT =1µF
CBYPASS= 10nF
ILOAD = 0 to 150mA
VOUT ≤ 1.8V
50
dB
Output Noise
BW: 300Hz to 50kHz
COUT =1µF
CBYPASS= 10nF
ILOAD = 0 to 150mA
30
µVRMS
eN
REV. 1.0.4 3/15/04
Min.
Typ.
Max.
Units
5
FAN2558/FAN2559
Functional Description
Utilizing BiCMOS technology, the FAN2525/FAN2559
product family is optimized for use in compact battery powered systems. These LDOs offer a unique combination of
high ripple rejection, low noise, low power consumption,
high tolerance for a variety of output capacitors, and less
than 1µA “OFF” current. In the circuit, a differential current
sense amplifier controls a series-pass P-Channel MOSFET to
achieve high ripple rejection. A separate error amplifier compares the load voltage at the output with an onboard trimmed
low voltage bandgap reference for output regulation.
Thermal shutdown and current limit circuits protect the
device under extreme conditions. When the device temperature reaches 150°C, the output is disabled. When the device
cools down by 10°C, it is re-enabled. The user can shut down
the device using the Enable control pin at any time. The current limit circuit is trimmed, which leads to consistent power
on /enable delays, and provides safe short circuit current
densities even in narrow traces of the PCB.
A carefully optimized control loop accommodates a wide
range of ESR values in the output bypass capacitor, allowing
the user to optimize space, cost, and performance requirements.
An Enable pin shuts down the regulator output to conserve
power, reducing supply current to less than 1µA.
The fixed-voltage FAN2559 has a noise bypass pin. Power
Good is available as a diagnostic function to indicate that the
output voltage has reduced within 5% of the nominal value.
The six pin adjustable-voltage version utilizes pin 5 to connect to an external voltage divider which feeds back to the
regulator error amplifier, thus setting the output voltage to
the desired value.
Applications Information
External Capacitors – Selection
The FAN2558/FAN2559 gives the user the flexibility to utilize a wide variety of capacitors compared to other LDOs.
An innovative design approach offers significantly reduced
sensitivity to ESR, which degrades regulator loop stability in
older designs. While the improvements featured in the
FAN2558/FAN2559 family greatly simplify the design task,
6
PRODUCT SPECIFICATIONS
capacitor quality still must be considered if the designer is to
achieve optimal circuit performance. In general, ceramic
capacitors offer superior ESR performance, and a smaller
case size than tantalum capacitors.
Input Capacitor
An input capacitor of 2.2µF (nominal value) or greater,
connected between the Input pin and Ground, placed in close
proximity to the device, will improve transient response and
ripple rejection. Higher values will further improve ripple
rejection and transient response. An input capacitor is recommended when the input source, either a battery or a regulated AC voltage, is located far from the device. Any good
quality ceramic, tantalum, or metal film capacitor will give
acceptable performance; however, in extreme cases capacitor
surge current ratings may have to be considered.
Output Capacitor
An output capacitor is required to maintain regulator loop
stability. Stable operation will be achieved with a wide variety of capacitors with ESR values ranging from 0mΩ up to
400mΩ. Multilayer ceramic, tantalum or aluminum electrolytic capacitors may be used. A nominal value of at least 1µF
is recommended. Note that the choice of output capacitor
affects load transient response, ripple rejection, and it has a
slight effect on noise performance as well.
An internal resistor of approximately 100Ω is connected
between VOUT and GND in shutdown mode, to discharge the
output capacitor at a faster rate.
Bypass Capacitor (FAN2559 Only)
In the fixed-voltage configuration, connecting a capacitor
between the bypass pin and ground can significantly reduce
output noise. Values ranging from 0pF to 47nF can be used,
depending on the sensitivity to output noise in the application.
At the high-impedance Bypass pin, care must be taken in the
PCB layout to minimize noise pickup, and capacitors must
be selected to minimize current loading (leakage). Noise
pickup from external sources can be considerable. Leakage
currents into the Bypass pin will directly affect regulator
accuracy and should be kept as low as possible; thus, highquality ceramic and film types are recommended for their
low leakage characteristics. Cost-sensitive applications not
concerned with noise can omit this capacitor.
REV. 1.0.4 3/15/04
PRODUCT SPECIFICATIONS
Control Functions
Enable Pin
Connecting 2V or greater to the Enable pin will enable the
output, while 0.4V or less will disable it while reducing the
quiescent current consumption to less than 1µA. If this shutdown function is not needed, the pin can simply be connected permanently to the VIN pin. Allowing this pin to float
will cause erratic operation.
Error Flag (Power Good)
Fault conditions such as input voltage dropout (low VIN),
overheating, or overloading (excessive output current), will
set an error flag. The PG pin which is an open-drain output,
will go LOW when VOUT is less than 95% or the specified
output voltage. When the voltage at VOUT is greater than
95% of the specified output voltage, the PG pin is HIGH. A
logic pull-up resistor of 47KΩ is recommended at this output. The pin can be left disconnected if unused.
Thermal Protection
The FAN2558/FAN2559 is designed to supply high peak
output currents for brief periods, however sustained excessive output load at high input - output voltage difference will
increase the device’s temperature and exceed maximum ratings due to power dissipation. During output overload conditions, when the die temperature exceeds the shutdown limit
temperature of 150°C, an onboard thermal protection will
disable the output until the temperature drops approximately
10°C below the limit, at which point the output is re-enabled.
During a thermal shutdown, the user may assert the powerdown function at the Enable pin, reducing power consumption to a minimum.
Thermal Characteristics
The FAN2558/FAN2559 is designed to supply 180mA at the
specified output voltage with an operating die (junction)
temperature of up to 125°C. Once the power dissipation and
thermal resistance is known, the maximum junction temperature of the device can be calculated. While the power dissipation is calculated from known electrical parameters, the
actual thermal resistance depends on the thermal characteristics of the SOT23-5 surface-mount package and the surrounding PC board copper to which it is mounted.
The power dissipation is equal to the product of the input-tooutput voltage differential and the output current plus the
ground current multiplied by the input voltage,
or:
P D = ( V IN – V OUT ) × I OUT + V IN × I GND
REV. 1.0.4 3/15/04
FAN2558/FAN2559
The ground pin current IGND can be found in the charts
provided in the Electrical Characteristics section.
The relationship describing the thermal behavior of the
package is:
T J ( max ) – T A
P D ( max ) = -------------------------------
θ JA
where TJ(max) is the maximum allowable junction temperature of the die, which is 125°C, and TA is the ambient operating temperature. θJA is dependent on the surrounding PC
board layout and can be empirically obtained. While the θJC
(junction-to-case) of the SOT23-5 package is specified at
130°C /W, the θJA of the minimum PWB footprint will be at
least 235°C /W. This can be improved by providing a heat
sink of surrounding copper ground on the PWB. Depending
on the size of the copper area, the resulting θJA can range
from approximately 180°C /W for one square inch to nearly
130°C /W for 4 square inches. The addition of backside copper with through-holes, stiffeners, and other enhancements
can also aid in reducing thermal resistance. The heat contributed by the dissipation of other devices located nearby must
be included in the design considerations. Once the limiting
parameters in these two relationships have been determined,
the design can be modified to ensure that the device remains
within specified operating conditions. If overload conditions
are not considered, it is possible for the device to enter a
thermal cycling loop, in which the circuit enters a shutdown
condition, cools, re-enables, and then again overheats and
shuts down repeatedly due to an unmanaged fault condition.
Adjustable Version
The FAN2558ADJ includes an input pin ADJ which allows
the user to select an output voltage ranging from 1V to near
VIN, using an external resistor divider. The voltage VADJ presented to the ADJ pin is fed to the onboard error amplifier
which adjusts the output voltage until VADJ is equal to the
onboard bandgap reference voltage of 1.00V(typ). The equation is:
R1
V OUT = 0.59V × 1 + -----R2
Since the bandgap reference voltage is trimmed, 1% initial
accuracy can be achieved. The total value of the resistor
chain should not exceed 250KOhm total to keep the error
amplifier biased during no-load conditions. Programming
output voltages very near VIN need to allow for the magnitude and variation of the dropout voltage VDO over load, supply, and temperature variations. Note that the low-leakage
FET input to the CMOS error amplifier induces no bias
current error to the calculation.
7
FAN2558/FAN2559
General PCB Layout Considerations
For optimum device performance, careful circuit layout and
grounding techniques must be used. Establishing a small
local ground, to which the GND pin, and the output and
bypass capacitors are connected, is recommended. The input
capacitor should be grounded to the main ground plane. The
quiet local ground is then routed back to the main ground
plane using feed through via. In general, the high-frequency
compensation components (input, bypass, and output capacitors) should be located as close to the device as possible.
Close proximity of the output capacitor is especially important to achieve optimum performance, especially during high
8
PRODUCT SPECIFICATIONS
load conditions. A large copper area in the local ground
serves as heat sink (as discussed above) when high power
dissipation significantly increases device temperature. Component-side copper provides significantly better thermal performance. Added feed through connecting the device side
ground plane to the back plane further reduces thermal resistance.
REV. 1.0.4 3/15/04
PRODUCT SPECIFICATIONS
FAN2558/FAN2559
Block Diagram (Note 6)
VIN
EN
BYPASS
Bandgap
Shutdown
Control
Precharge/Fast Enable
Shutdown
Thermal
Shutdown
Load Current
Sense
Error Amplifier
p
VOUT
n
GND
Out of Regulation
Detection
PG
n
Delay
Over-Current
Dropout
Detection
GND
Note:
6. Fixed output voltage version. BYPASS pin is available for FAN2559 only.
REV. 1.0.4 3/15/04
9
FAN2558/FAN2559
PRODUCT SPECIFICATIONS
Typical Performance Characteristics
Unless otherwise specified, CIN = COUT = 1µF, RPG = 47kΩ, TA = 25°C, EN = VIN
Output Voltage vs. Temperature
Output Voltage vs. Temperature
VIN = 5.5V
ILOAD = 180mA
Output Voltage (V)
Output Voltage (V)
ILOAD = 0mA
VIN = 5.5V
Junction Temperature (°C)
Junction Temperature (°C)
Ground Current vs. Temperature
Ground Current vs. Temperature
ILOAD = 180mA
VIN = 5.5V
VIN = 2.7V
Junction Temperature (°C)
VIN = 2.7V
Junction Temperature (°C)
Power On Response Time vs. Temperature
Enable Delay (µS)
Power On Delay (µS)
Enable Response Time vs. Temperature
Junction Temperature (°C)
10
VIN = 5.5V
Ground Current (µA)
Ground Current (µA)
ILOAD = 0mA
Junction Temperature (°C))
REV. 1.0.4 3/15/04
PRODUCT SPECIFICATIONS
FAN2558/FAN2559
Typical Performance Characteristics (Continued)
Unless otherwise specified, CIN = COUT = 1µF, RPG = 47kΩ, TA = 25°C, EN = VIN
Output Voltage vs. Input Voltage
ILOAD = 100µA
Output Voltage (V)
Power Good Delay (mS)
Power Good Delay vs. Input Voltage
ILOAD =100µA
ILOAD =180mA
Input Voltage (V)
Input Voltage (V)
Output Voltage vs. Enable Voltage
Output Voltage vs. Load Current
COUT =1µF
VIN =2.7V
Output Voltage (V)
Output Voltage (V)
COUT =1µF
ILOAD =100µA
Load Current (mA)
Enable Voltage (V)
Ripple Rejection vs. Frequency
Ripple Rejection vs. Frequency
REV. 1.0.4 3/15/04
VOUT ≤ 1.8V
ILOAD =0mA
COUT =1µF
CBYP = 10nF
ILOAD =180mA
Ripple Rejection (dB)
Ripple Rejection (dB)
VOUT ≤ 1.8V
COUT =1µF
CBYP = 10nF
11
FAN2558/FAN2559
PRODUCT SPECIFICATIONS
Typical Performance Characteristics (Continued)
Unless otherwise specified, CIN = COUT = 1µF, RPG = 47kΩ, TA = 25°C, EN = VIN
Enable Voltage
(2V/div)
Output Spectral Noise Density
Enable Delay = 27.6µS
VOUT =1.2V
VIN =2.7V
Output Voltage
(500mV/div)
Noise (nVrms/rtHz)
ILOAD = 180mA
COUT =1µF
CBYP = 10nF
ILOAD =0mA
COUT =1µF
CBYP =10nF
Time (20µS/div)
Load Transient Response
Power Good Delay
Power Good Delay = 2mSec
Output Voltage
(1V/div)
Output Voltage
(100mV/div)
VIN = 2.7V
VOUT =1.8V
COUT = 4.7µF
VOUT =1V
COUT =1µF
Power Good
(2V/div)
Output Current
(50mA/div)
ILOAD =100mA
VIN =3V
ILOAD = 0mA
Time (200µS/div)
Time (1mS/div)
Power Good in Fail Condition
Power Good Current (mA)
25
VIN = 4V
20
VIN = 5V
15
VIN = 3V
10
5
0
0.0
0.5
1.0
1.5
2.0
Power Good Voltage (V)
12
REV. 1.0.4 3/15/04
PRODUCT SPECIFICATIONS
FAN2558/FAN2559
Mechanical Dimensions
2x2mm 6-Lead MLP
REV. 1.0.4 3/15/04
13
FAN2558/FAN2559
PRODUCT SPECIFICATIONS
Mechanical Dimensions
6-Lead SOT-23 Package
5-Lead SOT-23 Package
B
B
e
e
c
c
L
E
L
H
E
α
α
e1
e1
D
D
A
A
A1
Symbol
Inches
H
A1
Millimeters
Min
Max
Min
Max
A
.035
.057
.90
1.45
A1
.000
.006
.00
.15
B
.008
.020
.20
.50
c
.003
.010
.08
.25
D
.106
.122
2.70
3.10
E
.059
.071
1.50
1.80
e
.037 BSC
.95 BSC
e1
.075 BSC
1.90 BSC
H
.087
.126
2.20
3.20
L
.004
.024
.10
.60
α
0°
10°
0°
10°
Notes
Notes:
7. Package outline exclusive of mold flash & metal burr.
8. Packageoutline exclusive of solder plating.
9. EIAJ Ref Number SC_74A
14
REV. 1.0.4 3/15/04
PRODUCT SPECIFICATIONS
FAN2558/FAN2559
Ordering Information
TA= -40°C to 85°C
Part Number Output Voltage
FAN2558
1.0V
1.2V
1.3V
1.5V
1.8V
2.5V
3.3V
3.5V
3.6V
3.8V
1.0V
1.2V
1.3V
1.5V
1.8V
Adjustable
FAN2559
1.0V
1.2V
1.3V
1.5V
1.8V
1.0V
1.2V
1.3V
1.5V
1.8V
Package Marking
58T
58U
58X
58V
58O
58J
58K
58P
58Q
58I
58T
58U
58X
58V
58O
58R
58R
59T
59U
59X
59V
59O
59T
59U
59X
59V
59O
Package
5-Lead SOT-23
2mm x 2mm 6-Lead MLP
6-Lead SOT-23
2mm x 2mm 6-Lead MLP
6-Lead SOT-23
2mm x 2mm 6-Lead MLP
Order Code
FAN2558S10X
FAN2558S12X
FAN2558S13X
FAN2558S15X
FAN2558S18X
FAN2558S25X
FAN2558S33X
FAN2558S35X
FAN2558S36X
FAN2558S38X
FAN2558MP10X
FAN2558MP12X
FAN2558MP13X
FAN2558MP15X
FAN2558MP18X
FAN2558SX
FAN2558MPX
FAN2559S10X
FAN2559S12X
FAN2559S13X
FAN2559S15X
FAN2559S18X
FAN2559MP10X
FAN2559MP12X
FAN2559MP13X
FAN2559MP15X
FAN2559MP18X
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LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, and (c) whose failure to
perform when properly used in accordance with
instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
www.fairchildsemi.com
REV. 1.0.4 3/15/04
2004 Fairchild Semiconductor Corporation
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