FAN5341UMPX

LED Driver, Series Boost, with Integrated Schottky Diode and Single-Wire Digital Interface FAN5341 www.onsemi.com Description The FAN5341 is an asynchronous constant−current LED driver capable of efficiently delivering up to 500 mW to a string of up to five LEDs in series. Optimized for small form−factor applications, the 1.2 MHz fixed switching frequency allows the use of small chip inductors and capacitors. The FAN5341 uses a simple single−wire digital control interface to program the brightness levels of the LEDs in 32 linear steps by applying digital pulses. For safety, the device features integrated over−voltage, over−current, short−circuit detection, and thermal−shutdown protection. In addition, input under−voltage lockout protection is triggered if the battery voltage is too low. The FAN5341 is available in a very low profile, small form−factor 2 mm x 2 mm x 0.55 mm 6−lead UMLP package that is green and RoHS compliant. Features • • • • • • • • • • • • • • Asynchronous Boost Converter Internal Schottky Diode Up to 500 mW Output Power Drives 3 to 5 LEDs in Series 2.7 V to 5.5 V Input Voltage Range Single−Wire Digital Control Interface to Set LED Brightness Levels ♦ 32 Linear Steps 1.2 MHz Fixed Switching Frequency Soft−Start Capability Input Under−Voltage Lockout (UVLO) Output Over−Voltage Protection (OVP) Short−Circuit Detection Thermal Shutdown (TSD) Protection Low Profile 6−lead 2.0 x 2.0 x 0.55 mm UMLP Package This Device is Pb−Free, Halogen Free/BFR Free and is RoHS Compliant UDFN6 2 x 2, 0.65P CASE 517DS MARKING DIAGRAM &Z&2&K 341 &Z &2 &K 341 = Assembly Plant Code = 2−Digit Date Code = Lot Code = Specific Device Code ORDERING INFORMATION See detailed ordering and shipping information on page 2 of this data sheet. Applications • • • • Cellular Mobile Handsets Mobile Internet Devices Portable Media Players PDA, DSC, MP3 Players © Semiconductor Components Industries, LLC, 2009 January, 2021 − Rev. 3 1 Publication Order Number: FAN5341/D FAN5341 Table 1. ORDERING INFORMATION Part Number Temperature Range Package Packing Method† FAN5341UMPX −40°C to 85°C 6−lead, 2.0 x 2.0 mm UMLP 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. TYPICAL APPLICATION DIAGRAM L = 10 mH VIN 2.7 V to 5.5 V CIN = 1 mF 2 GND SW 5 FAN5341 6 1 VOUT COUT = 1 mF EN 3 4 FB 3−5 LEDs RSET = 12.7 W @ ILED = 20 mA RSET = 10.0 W @ ILED = 25 mA Figure 1. Typical Application BLOCK DIAGRAM VIN 2 1 VOUT 6 BOOST CONTROL EN SW D1 GATE DRIVE GND 5 3 OVP/ SCD 4 FB Digital I/F Figure 2. Functional Block Diagram www.onsemi.com 2 FAN5341 PIN CONFIGURATION VOUT 1 VIN 2 P1 GND EN 3 6 GND 5 SW 4 FB Figure 3. UMLP6 Package (Top View) Table 2. PIN DEFINITIONS Pin # Name Description 1 VOUT Boost Output Voltage. Output of the boost regulator. Connect the LEDs to this pin. Connect COUT (Output Capacitor) to GND. 2 VIN Input Voltage. Connect to power source and decouple with CIN to GND. 3 EN Enable Brightness Control. Program dimming levels by driving pin with digital pulses. 4 FB Voltage Feedback. The boost regulator regulates this pin to 0.253 V to control the LED string current. Tie this pin to a current setting resistor (RSET) between GND and the cathode of the LED string. 5 SW Switching node. Tie inductor L1 from VIN to SW pin. 6 GND Ground. Tie directly to a GND plane. Table 3. ABSOLUTE MAXIMUM RATINGS Symbol Min. Max. Units VIN Pin −0.3 6.0 V FB, EN Pins –0.3 VIN + 0.3 V VSW SW Pin −0.3 22.0 V VOUT VOUT Pin −0.3 22.0 V ESD Electrostatic Discharge Protection Level VIN VFB, VEN Parameter Human Body Model per JESD22−A114 3.3 Charged Device Model per JESD22−C101 2.0 kV TJ Junction Temperature –40 +150 °C TSTG Storage Temperature –65 +150 °C +260 °C TL Lead Soldering Temperature, 10 Seconds Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Table 4. RECOMMENDED OPERATING CONDITIONS Symbol VIN Parameter VIN Supply Voltage VOUT VOUT Voltage (Note 1) IOUT VOUT Load Current 500 mW Maximum Output Power Min. Max. Units 2.7 5.5 V 6.2 17.5 V 5 25 mA TA Ambient Temperature –40 +85 °C TJ Junction Temperature –40 +125 °C Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 1. Application should guarantee that minimum and maximum duty−cycle should fall between 20−85% to meet the specified range. www.onsemi.com 3 FAN5341 Table 5. THERMAL PROPERTIES Symbol Parameter NOTE: Typical Units 70 °C/W Junction−to−Ambient Thermal Resistance, UMLP6 Package θJA Junction−to−ambient thermal resistance is a function of application and board layout. This data is measured with four−layer 2s2p boards in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction temperature TJ(max) at a given ambient temperature TA. Table 6. ELECTRICAL SPECIFICATIONS (VIN = 2.7 V to 5.5 V and TA = −40C to +85°C unless otherwise noted. Typical values are at TA = 25°C and VIN = 3.6 V.) Parameter Symbol Conditions Min Typ Max Units 0.30 0.75 μA V POWER SUPPLIES ISD VUVLO VUVHYST Shutdown Supply Current EN = GND, VIN = 3.6 V Under−Voltage Lockout Threshold VIN Rising 2.10 2.35 2.60 VIN Falling 1.90 2.15 2.40 Under−Voltage Lockout Hysteresis 250 mV EN: ENABLE PIN VIH HIGH−Level Input Voltage 1.2 VIL LOW−Level Input Voltage REN EN Pull−Down Resistance TLO EN Low Time for Dimming VIN = 3.6 V; See Figure 14 0.5 THI Time Delay Between Steps VIN = 3.6 V; See Figure 14 0.5 μs TSD EN Low, Shutdown Pulse Width VIN = 3.6 V; from Falling Edge of EN 1 ms 240 200 V 300 0.4 V 400 kW 300 μs FEEDBACK AND REFERENCE VFB Feedback Voltage ILED = 20 mA from −40°C to +85°C, 2.7 V ≤ VIN ≤ 5.5 V 253 266 mV IFB Feedback Input Current VFB = 253 mV 0.1 1.0 μA VIN = 3.6 V, ISW = 100 mA 600 POWER OUTPUTS RDS(ON)_Q1 Boost Switch On−Resistance VIN = 2.7 V, ISW = 100 mA 650 ISW(OFF) SW Node Leakage (Note 2) EN = 0, VIN = VSW = VOUT = 5.5 V, VLED = 0 0.1 ILIM−PK Boost Switch Peak Current Limit VIN = 3.6 V 750 mW 2.0 μA mA OSCILLATOR fSW Boost Regulator Switching Frequency 1.0 1.2 1.4 MHz 18.0 18.9 21.0 V OUTPUT AND PROTECTION VOVP Boost Output Over−Voltage Protection OVP Hysteresis 0.8 VTLSC VOUT Short Circuit Detection Threshold VOUT Falling VIN − 1.4 V VTHSC VOUT Short Circuit Detection Threshold VOUT Rising VIN − 1.2 V DMAX Maximum Boost Duty Cycle (Notes 3, 4) DMIN Minimum Boost Duty Cycle (Notes 3, 4) % 85 20 www.onsemi.com 4 FAN5341 Table 6. ELECTRICAL SPECIFICATIONS (continued) (VIN = 2.7 V to 5.5 V and TA = −40C to +85°C unless otherwise noted. Typical values are at TA = 25°C and VIN = 3.6 V.) Symbol Parameter Conditions Min Typ Max Units TTSD Thermal Shutdown 150 °C THYS Thermal Shutdown Hysteresis 35 °C 2. SW leakage current includes the leakage current of 2 internal switches, SW to GND and SW to VOUT. 3. Not tested in production and guaranteed by design. 4. Application should guarantee that minimum and maximum duty cycle should fall between 20−85% to meet the specified range. www.onsemi.com 5 FAN5341 ELECTRICAL SPECIFICATIONS 90 90 5 LEDs L = 10 mH COUT = 1.0 mF ILED = 25 mA 80 Efficiency (%) Efficiency (%) 80 70 VIN = 2.7 V 60 5 LEDs L = 4.7 mH COUT = 1.0 mF ILED = 25 mA 70 60 VIN = 2.8 V VIN = 3.6 V VIN = 3.6 V VIN = 4.2 V 5 10 15 20 25 10 20 15 25 LED Current (mA) LED Current (mA) Figure 4. 5 LEDs: Efficiency vs. LED Current vs. Input Voltage Figure 5. 5 LEDs: Efficiency vs. LED Current vs. Input Voltage 4 LEDs L = 10 mH COUT = 1.0 mF ILED = 25 mA 80 70 VIN = 2.7 V 60 VIN = 3.6 V VIN = 4.2 V 50 0.6 0.4 0.2 0 −0.2 10 15 20 +25°C 25 +85°C 2.7 3 3.3 3.6 3.9 4.2 LED Current (mA) Input Voltage (V) Figure 6. 4 LEDs: Efficiency vs. LED Current vs. Input Voltage Figure 7. Delta of VFB over Input Voltage and Temperature for 4 LEDs with L = 10 mH and COUT = 1.0 mF at ILED = 25 mA 90 20.0 3 LEDs L = 10 mH COUT = 1.0 mF ILED = 25 mA 80 −40°C −0.4 −0.6 5 19.5 4 LEDs L = 10 mH COUT = 1.0 mF ILED = 25 mA 19.0 OVP (V) Efficiency (%) 5 0.8 90 Efficiency (%) VIN = 4.2 V 50 Delta Feedback Voltage (mV) 50 70 18.5 18.0 60 VIN = 2.8 V 17.5 VIN = 3.6 V VIN = 4.2 V 17.0 50 5 10 15 20 2.7 25 3 3.3 3.6 3.9 Input Voltage (V) LED Current (mA) Figure 9. Over−Voltage Protection vs. Input Voltage Figure 8. 3 LEDs: Efficiency vs. LED Current vs. Input Voltage www.onsemi.com 6 4.2 FAN5341 ELECTRICAL SPECIFICATIONS (continued) Figure 11. FAN5341 Dimming Operation at VIN = 3.6 V for 4 LEDs with L = 10 mH, COUT = 1.0 mF and ILED = 25 mA Figure 10. Line Transient Response for 4 LEDs at VIN = 3.6 V + 0.6 V with L = 10 mH, COUT = 1.0 mF and ILED = 25 mA Figure 13. Steady−State Waveform for VOUT, Switch Voltage and Inductor Current for 4 LEDs at VIN = 3.6 V + 0.6 V with L = 10 mH, COUT = 1.0 mF and ILED = 25 mA Figure 12. Startup Waveform for Switch Voltage, Inductor Current, VFB and EN for 4 LEDs at VIN = 3.6 V + 0.6 V with L = 10 mH, COUT = 1.0 mF and ILED = 25 mA www.onsemi.com 7 FAN5341 CIRCUIT DESCRIPTION Overview Digital Dimming Control The FAN5341 is an inductive current−mode boost serial LED driver that achieves LED current regulation by maintaining 0.253 V across the RSET resistor. The current through the LED string (ILED) is therefore given by: The FAN5341 starts driving the LEDs at the maximum brightness level. After startup, the control logic is ready to accept programming pulses to decrease the brightness level by the number of positive edges applied to the EN pin. Figure 14 shows the digital pulse dimming control. I LED + 0.253 R SET (eq. 1) Over−Current and Short−Circuit Detection The voltage VOUT is determined by the sum of the forward voltages across each LED, plus the voltage across RSET, which is always 253 mV. The boost regulator employs a cycle−by−cycle peak inductor current limit of ~750 mA. Over−Voltage / Open−Circuit Protection Driving Five LEDs in Series If the LED string is an open circuit, FB remains at 0 V and the output voltage continues to increase in the absence of an over−voltage protection (OVP) circuit. The FAN5341’s OVP circuit disables the boost regulator when VOUT exceeds 18.9 V and continues to keep the regulator off until VOUT drops below 18.1 V. FAN5341 can drive five LEDs in series but, the forward voltage (VF) of the LED MUST be less than 3.5 V such that it remains under the over−voltage specification of 18.9 V. UVLO and Soft−Start If EN has been low for more than 1 ms, the IC may initiate a “cold start” soft−start cycle when EN rises, provided VIN is above the UVLO threshold. Thermal Shutdown When the die temperature exceeds 150°C, a reset occurs and remains in effect until the die cools to 125°C, at which time, the circuit is allowed to begin the soft−start sequence. Digital Interface The FAN5341 implements a single−wire digital interface to program the LED brightness to one of thirty−two (32) levels spaced in linear steps. With this single−wire solution, the FAN5341 does not require the system processor to constantly supply a signal to it to drive the LEDs. tHI EN 0 1 Level 32: 100% Level 31 tSD tLO 3 2 4 28 29 30 31 0 1 Level 32: 100% Level 30 Level 29 Level 28 Level 5 Level 4 Level 3 Shutdown Level 2 Level 1 Figure 14. Digital Pulse−Dimming Control Diagram www.onsemi.com 8 Level 31 FAN5341 APPLICATION INFORMATION Inductor & Output Capacitor Selection Table 7. RECOMMENDED EXTERNAL COMPONENTS # of LEDs Inductor (L) 3, 4, 5 10.0 mH 4.7 mH Part Number Manufacturer LQH43MN100K03 Murata NLCV32T−100K−PFR TDK VLF3010AT−100MR49−1 TDK LQH43MN4R7K03 Murata NLCV32T−4R7M−PFR TDK LPF2010T−4R7M ABCO Min COUT Part Number Manufacturer 1.00 mF CV105X5R105K25AT AVX/Kyocera 1.00 mF CV105X5R105K25AT AVX/Kyocera Component Placement and PCB Recommendations Figure 15. Recommended Component Placement Input Capacitance PCB Recommendations • The inductor can be connected to VIN with vias In a typical application, the input and output capacitors should be placed as close to the IC as possible; no additional capacitance is needed to ensure proper functionality. However, in a testing environment, where the FAN5341 is typically powered by a power supply with relatively long cables, an additional input capacitor (10 mF) may be needed to ensure stable functioning. This capacitor should be placed close to where the power supply cables attach to the FAN5341 evaluation board. through another layer if needed. • The feedback pin should be connected back to the IC on a sub−layer. www.onsemi.com 9 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UDFN6 2x2, 0.65P CASE 517DS ISSUE O DOCUMENT NUMBER: DESCRIPTION: 98AON13697G UDFN6 2x2, 0.65P DATE 31 OCT 2016 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. 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