DATA SHEET
www.onsemi.com
High-Side and Low-Side
Gate Driver
SOIC8
CASE 751EG
FAN7382
The FAN7382, a monolithic high and low side gate−drive IC, can
drive MOSFETs and IGBTs that operate up to +600 V. onsemi’s
high−voltage process and commonmode noise canceling technique
provides stable operation of the high−side driver under high−dv/dt
noise circumstances. An advanced level−shift circuit allows high−side
gate driver operation up to VS = −9.8 V (typical) for VBS = 15 V.
The input logic level is compatible with standard TTL−series logic
gates. UVLO circuits for both channels prevent malfunction when
VCC or VBS is lower than the specified threshold voltage. Output
drivers typically source/sink 350 mA/650 mA, respectively, which is
suitable for fluorescent lamp ballasts, PDP scan drivers, motor
controls, etc.
SOIC14 N
CASE 751ER
MARKING DIAGRAMS
SOIC8
7382
ALYW
Features
• Floating Channels Designed for Bootstrap Operation to +600 V
• Typically 350 mA/650 mA Sourcing/Sinking Current Driving
Capability for Both Channels
• Common−Mode dv/dt Noise Canceling Circuit
• Extended Allowable Negative VS Swing to −9.8 V for Signal
•
•
•
•
•
•
Propagation at VCC = VBS = 15 V
VCC & VBS Supply Range from 10 V to 20 V
UVLO Functions for Both Channels
TTL Compatible Input Logic Threshold Levels
Matched Propagation Delay Below 50 ns
Output In−phase with Input Signal
These are Pb−Free Devices
7382
A
L
YW
= Device Code
= Assembly Site
= Wafer Lot Number
= Assembly Start Week
SOIC14 N
7382M1
&E&Z&3&K
7382M1
&E
&Z
&3
&K
= Device Code
= Designates Space
= Assembly Location
= 3−Digit Date Code
= 2−Digits Lot Run Traceability Code
ORDERING INFORMATION
See detailed ordering and shipping information on page 12 of
this data sheet.
© Semiconductor Components Industries, LLC, 2005
February, 2022 − Rev. 2
1
Publication Order Number:
FAN7382/D
FAN7382
Typical Application Circuit
600 V
15 V
RBOOT
DBOOT
1 V
CC
VB 8
HIN
2 HIN
HO 7
LIN
3 LIN
VS 6
4 COM
LO 5
Q1
R1
R2
CBOOT
C1
Q2
R3
Load
R4
Figure 1. Application Circuit for Half−Bridge
Internal Block Diagram
2
HS(ON/OFF)
500 K
PULSE
GENERATOR
HIN
RR
S Q
DRIVER
UVLO
UVLO
DELAY
3
DRIVER
LS(ON/OFF)
LIN
8
VB
7
HO
6
VS
1
VCC
5
LO
4
COM
500 K
Figure 2. Functional Block Diagram
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2
FAN7382
Pin Assignments
FAN7382MX
FAN7382M1X
VCC
1
8
VB
VCC
1
14
NC
HIN
2
7
HO
HIN
2
13
VB
LIN
3
6
VS
LIN
3
12
HO
COM
4
5
LO
NC
4
11
VS
NC
5
10
NC
COM
6
9
NC
LO
7
8
NC
Figure 3. Pin Configuration (Top View)
PIN DIFINITIONS
Name
Description
VCC
Low−Side Supply Voltage
HIN
Logic Input for High−Side Gate Driver Output
LIN
Logic Input for Low−Side Gate Driver Output
COM
Logic Ground and Low−Side Driver Return
LO
Low−Side Driver Output
VS
High−Voltage Floating Supply Return
HO
High−Side Driver Output
VB
High−Side Floating Supply
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3
FAN7382
ABSOLUTE MAXIMUM RATINGS
Symbol
Min
Max
Unit
High−Side Offset Voltage
Parameter
VS
VB − 25
VB + 0.3
V
High−Side Floating Supply Voltage
VB
−0.3
625
High−Side Floating Output Voltage HO
VHO
VS − 0.3
VB + 0.3
Low−Side and Logic Fixed Supply Voltage
VCC
−0.3
25
Low−Side Output Voltage LO
VLO
−0.3
VCC + 0.3
Logic Input Voltage (HIN, LIN)
VIN
−0.3
VCC + 0.3
Logic Ground
COM
VCC − 25
VCC + 0.3
Allowable Offset Voltage Slew Rate
dVS/dt
Power Dissipation
PD
(Notes 1, 2, 3)
50
V/ns
SOIC8
0.625
W
SOIC14 N
1.0
Junction temperature
TJ
150
°C
Storage Temperature
TSTG
150
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Mounted on 76.2 x 114.3 x 1.6 mm PCB (FR−4 glass epoxy material).
2. Refer to the following standards:
JESD51−2: Integral circuits thermal test method environmental conditions − natural convection
JESD51−3: Low effective thermal conductivity test board for leaded surface mount packages
3. Do not exceed PD under any circumstances.
THERMAL CHARACTERISTICS
Parameter
Symbol
Min
Max
Unit
qJA
SOIC8
200
°C/W
SOIC14 N
110
Symbol
Min
Max
Unit
High−Side Floating Supply Voltage
VB
VS + 10
VS + 20
V
High−Side Floating Supply Offset Voltage
VS
6 − VCC
600
V
High−Side (HO) Output Voltage
VHO
VS
VB
V
Low−Side (LO) Output Voltage
VLO
COM
VCC
V
Logic Input Voltage (HIN, LIN)
VIN
COM
VCC
V
Low−Side Supply Voltage
VCC
10
20
V
TA
−40
125
°C
Thermal Resistance, Junction−to−Ambient
RECOMMENDED OPERATING CONDITIONS
Parameter
Ambient Temperature
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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4
FAN7382
ELECTRICAL CHARACTERISTICS
VBIAS (VCC, VBS) = 15.0 V, TA = 25°C, unless otherwise specified. The VIN and IIN parameters are referenced to COM. The VO and IO
parameters are referenced to VS and COM and are applicable to the respective outputs HO and LO.
Symbol
Min
Typ
Max
Unit
VCC and VBS Supply Under−Voltage
Positive Going Threshold
Test Condition
VCCUV+
VBSUV+
8.2
9.2
10.0
V
VCC and VBS Supply Under−Voltage
Positive Going Threshold
VCCUV−
VBSUV−
7.6
8.7
9.6
V
VCC Supply Under−Voltage Lockout
Hysteresis
VCCUVH
VBSUVH
Parameter
Offset Supply Leakage Current
VB = VS = 600 V
ILK
Quiescent VBS Supply Current
VIN = 0 V or 5 V
IQBS
Quiescent VCC Supply Current
VIN = 0 V or 5 V
IQCC
Operating VBS Supply Current
fIN = 20 kHz, rms value
Operating VCC Supply Current
fIN = 20 kHz, rms value
0.6
V
50
mA
45
120
mA
70
180
mA
IPBS
600
mA
IPCC
600
mA
Logic “1” Input Voltage
VIH
Logic “0” input voltage
VIL
0.8
V
VOH
1.0
V
VOL
0.6
V
mA
High−Level Output Voltage, VBIAS − VO
IO = 20 mA
Low−Level Output Voltage, VO
2.9
V
Logic “1” Input Bias Current
VIN = 5 V
IIN+
10
20
Logic “0” Input Bias Current
VIN = 0 V
IIN−
1.0
2.0
Output High Short−Circuit Pulsed Current
VO = 0 V, VIN = 5 V
with PW < 10 ms
IO+
250
350
mA
Output Low Short−Circuit Pulsed Current
VO = 15 V, VIN = 0 V
with PW < 10 ms
IO−
500
650
mA
Allowable Negative VS Pin Voltage for
HIN Signal Propagation to HO
VS
−9.8
−7.0
mA
V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
DYNAMIC ELECTRICAL CHARACTERISTICS
VBIAS (VCC, VBS) = 15.0 V, VS = COM, CL = 1000 pF and, TA = 25°C, unless otherwise specified.
Parameter
Test Condition
Symbol
Min
Typ
Max
Unit
Turn−On Propagation Delay
VS = 0 V
ton
100
170
300
ns
Turn−Off Propagation Delay
VS = 0 V or 600 V
(Note 4)
toff
100
200
300
ns
Turn−On Rise Time
tr
20
60
140
ns
Turn−Off Fall Time
tf
30
80
ns
50
ns
Delay Matching, HS & LS Turn−On/Off
MT
4. This parameter guaranteed by design.
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5
FAN7382
300
300
VCC = VBS
COM = 0 V
CL = 1 nF
TA = 25°C
250
Turn−On Propagation Delay (ns)
Turn−On Propagation Delay (ns)
TYPICAL CHARACTERISTICS
High−Side
200
150
Low−Side
100
10
12
14
16
18
275
250
225
High−Side
200
175
Low−Side
150
125
100
75
50
20
VCC = VBS = 15 V
COM = 0 V
CL = 1 nF
−40 −20
0
Supply Voltage (V)
60
80
100 120
Figure 5. Turn−On Propagation Delay
vs. Temperature
300
300
VCC = VBS
COM = 0 V
CL = 1 nF
TA = 25°C
280
260
240
Turn−Off Propagation Delay (ns)
Turn−Off Propagation Delay (ns)
40
Temperature (°C)
Figure 4. Turn−On Propagation Delay
vs. Supply Voltage
High−Side
220
200
Low−Side
180
160
140
120
100
10
12
14
16
18
Turn−On Rising Time (ns)
56
54
52
Low−Side
50
48
High−Side
46
44
42
10
11
12
13 14
15
16
High−Side
225
200
Low−Side
175
150
0
20
40
60
80
100 120
Figure 7. Turn−Off Propagation Delay
vs. Temperature
VCC = VBS
COM = 0 V
CL = 1 nF
TA = 25°C
60
58
250
VCC = VBS = 15 V
COM = 0 V
CL = 1 nF
Temperature (°C)
Figure 6. Turn−Off Propagation Delay
vs. Supply Voltage
64
62
275
125
−40 −20
20
Supply Voltage (V)
Turn−On Rising Time (ns)
20
17
18 19
20
80
75
VCC = VBS = 15 V
70
COM = 0 V
65
CL = 1 nF
60
55
50
Low−Side
45
40
35
High−Side
30
25
20
15
10
5
0
−40 −20
0
20 40
60 80 100 120
Temperature (°C)
Supply Voltage (V)
Figure 9. Turn−On Rising Time
vs. Temperature
Figure 8. Turn−On Rising Time
vs. Supply Voltage
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6
FAN7382
TYPICAL CHARACTERISTICS (continued)
32
30
28
50
VCC = VBS
COM = 0 V
CL = 1 nF
TA = 25°C
High−Side
45
Turn−Off Falling Time (ns)
Turn−Off Falling Time (ns)
34
26
24
22
Low−Side
20
18
16
10
11
12
13 14
15
16
17
18 19
40
High−Side
35
30
25
Low−Side
20
15
10
−40
20
VCC = VBS = 15 V
COM = 0 V
CL = 1 nF
−20
0
Supply Voltage (V)
450
Output Sourcing Current (mA)
Turn−Off Propagation Delay (ns)
500
400
High−Side
350
300
Low−Side
250
200
150
100
440
400
High−Side
360
340
Low−Side
320
300
280
10
12
14
16
18
−40 −20
20
0
High−Side
Low−Side
400
10
12
14
60
80
100
120
850
500
300
40
Figure 13. Output Sourcing Current
vs. Temperature
VCC = VBS
COM = 0 V
LO = VCC, HO = VB
TA = 25°C
600
20
Temperature (°C)
Output Sinking Current (mA)
Output Sinking Current (mA)
700
100 120
380
Figure 12. Output Sourcing Current
vs. Supply Voltage
800
80
VCC = VBS = 15 V
COM = 0 V
LO = HO = 0 V
420
Supply Voltage (V)
900
60
Temperature (°C)
VCC = VBS
COM = 0 V
LO = HO = 0 V
TA = 25°C
550
40
Figure 11. Turn−Off Falling Tim
vs. Temperature
Figure 10. Turn−Off Falling Time
vs. Supply Voltage
600
20
16
18
750
700
High−Side
650
Low−Side
600
550
500
20
VCC = VBS = 15 V
COM = 0 V
LO = VCC, HO = VB
800
−40 −20
0
20
40
60
80
100
Temperature (°C)
Supply Voltage (V)
Figure 15. Output Sinking Current
vs. Temperature
Figure 14. Output Sinking Current
vs. Supply Voltage
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7
120
FAN7382
−4
Allowable Negative VS Voltage for
Signal Propagation to High−Side (V)
Allowable Negative VS Voltage for
Signal Propagation to High−Side (V)
TYPICAL CHARACTERISTICS (continued)
VCC = VBS
COM = 0 V
TA = 25°C
−6
−8
−10
−12
−14
−16
−18
10
12
16
14
18
20
−9.0
VCC = VBS = 15 V
COM = 0 V
−9.2
−9.4
−9.6
−9.8
−10.0
−10.2
−10.4
−40
−20
0
Supply Voltage (V)
85
80
70
65
60
20
55
5
10
15
50
45
−40 −20
20
0
48
40
30
100
120
46
44
42
40
20
38
10
0
80
VCC = 15 V
COM = 0
HIN = LIN = 0 V
50
IQBS (mA)
IQBS (mA)
50
60
52
VCC = 15 V
COM = 0 V
HIN = LIN = 0 V
TA = 25°C
60
40
Figure 19. IQCC vs. Temperature
Figure 18. IQCC vs. Supply Voltage
70
20
Temperature (°C)
Supply Voltage (V)
80
100 120
75
40
0
80
VCC = VBS = 15 V
COM = 0 V
HIN = LIN = 0 V
90
IQCC (mA)
IQCC (mA)
95
60
0
60
Figure 17. Allowable Negative VS Voltage for
Signal Propagation to High Side vs. Temperature
VBS = 15 V
COM = 0 V
HIN = LIN = 0 V
TA = 25°C
80
40
Temperature (°C)
Figure 16. Allowable Negative VS Voltage for Signal
Propagation to High Side vs. Supply Voltage
100
20
36
0
5
10
15
20
−40 −20
0
20
40
60
80
100 120
Temperature (°C)
Supply Voltage (V)
Figure 21. IQBS vs. Temperature
Figure 20. IQBS vs. Supply Voltage
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8
FAN7382
TYPICAL CHARACTERISTICS (continued)
VOH (V)
0.6
0.5
High−Side
0.60
VCC = VBS
COM = 0 V
HIN = LIN = 5 V
IL = 20 mA
TA = 25°C
0.55
0.50
VOH (V)
0.7
0.4
Low−Side
0.45
Low−Side
0.40
High−Side
0.35
0.3
0.2
VCC = VBS = 15 V
COM = 0 V
HIN = LIN = 5 V
IL = 20 mA
0.30
10
12
16
14
18
0.25
−40
20
−20
0
0.16
0.15
0.20
VOL (V)
VOL (V)
0.22
VCC = VBS
COM = 0 V
HIN = LIN = 0 V
IL = 20 mA
TA = 25°C
0.17
High−Side
0.14
0.12
0.18
0.16
100 120
Low−Side
0.12
Low−Side
0.10
10
12
14
16
18
−40 −20
20
0
40
30
60
80
100
120
Figure 25. Low−Level Output Voltage
vs. Temperature
HIN = LIN = 5 V
14
12
IN+
IN+ (mA)
25
40
16
VCC = VBS
COM = 0 V
IN = VCC or IN = 0 V
TA = 25°C
35
20
Temperature (°C)
Figure 24. Low−Level Output Voltage
vs. Supply Voltage
IN+/IN− (mA)
80
High−Side
Supply Voltage (V)
20
15
LIN
10
HIN
8
10
6
5
0
60
VCC = VBS = 15 V
COM = 0 V
HIN = LIN = 0 V
IL = 20 mA
0.14
0.13
40
Figure 23. High−Level Output Voltage
vs. Temperature
Figure 22. High−Level Output Voltage
vs. Supply Voltage
0.18
20
Temperature (°C)
Supply Voltage (V)
IN−
0
5
10
4
15
−40 −20
20
Supply Voltage (V)
0
20
40
60
80
100 120
Temperature (°C)
Figure 27. Input Bias Current
vs. Temperature
Figure 26. Input Bias Current
vs. Supply Voltage
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9
FAN7382
10.0
10.0
9.8
9.6
9.8
9.6
VSBUV+/VSBUV− (V)
VCCUV+/VCCUV− (V)
TYPICAL CHARACTERISTICS (continued)
VCCUV+
9.4
9.2
9.0
VCCUV−
8.8
8.6
8.4
8.2
8.0
−40
−20
0
20
40
60
80
100 120
Input Logic Threshold Voltage (V)
VB−to−COM = 650 V
ILK (mA)
4
3
2
1
40
60
8.4
−20
0
20
40
60
80
100 120
Figure 29. VBS UVLO Threshold Voltage
vs. Temperature
5
20
VSBUV−
8.8
8.6
Temperature (°C)
Figure 28. VCC UVLO Threshold Voltage
vs. Temperature
0
9.0
8.2
8.0
−40
Temperature (°C)
0
−40 −20
VSBUV+
9.4
9.2
80
100
120
3.4
3.2
3.0
VIH (LIN)
2.8
2.6
2.4
VIH (HIN)
2.2
2.0
VIL (LIN)
1.8
1.6
1.4
1.2 VIL (HIN)
1.0
0.8
0.6
0.4
0.2
0.0
−40 −20
0
20
VCC = VBS = 15 V
COM = 0 V
40
60
80
100 120
Temperature (°C)
Temperature (°C)
Figure 31. Input Logic Threshold Voltage
vs. Temperature
Figure 30. VB to COM Leakage Current
vs. Temperature
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10
FAN7382
TYPICAL CHARACTERISTICS (continued)
15 V
15 V
1 VCC
VB 8
4 COM
VS 6
HIN
2 HIN
HO 7
LIN
3 LIN
LO 5
100 nF
10 mF
10 mF
HIN
LIN
100 nF
1 nF
HO
LO
1 nF
Figure 33. Input / Output Timing Diagram
Figure 32. Switching Time Test Circuit
HIN
LIN
ton:
50% toff:
tr:
tf:
ton
Turn−on Delay Time
Turn−off Delay Time
Turn−on Rise Time
Turn−off Fall Time
LIN
toff
tr
HIN
50%
tf
LO
10%
90%
90%
LO
10%
MT
10%
toff−H
toff−L
ton−H
ton−L
HO
MT
HO
90%
LO
HO
Figure 35. Delay Matching Waveform Definition
Figure 34. Switching Time Waveform Definition
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11
FAN7382
ORDERING INFORMATION
Part Number
FAN7382MX (Note 5)
Operating Temperature Range
Package
Shipping†
−40°C ~125°C
SOIC8
(Pb−Free)
3000 / Tape & Reel
SOIC14 N
(Pb−Free)
3000 / Tape & Reel
FAN7382M1X (Note 5)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
5. These devices passed wave soldering test by JESD22A−111.
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12
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC8
CASE 751EG
ISSUE O
DOCUMENT NUMBER:
DESCRIPTION:
98AON13741G
SOIC8
DATE 30 SEP 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC14 N
CASE 751ER
ISSUE O
DOCUMENT NUMBER:
DESCRIPTION:
98AON13761G
SOIC14 N
DATE 31 DEC 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
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provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
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Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Email Requests to: orderlit@onsemi.com
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