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FCB110N65F

FCB110N65F

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    SOT404

  • 描述:

    MOSFET N-CH 650V 35A D2PAK

  • 数据手册
  • 价格&库存
FCB110N65F 数据手册
Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. FCB110N65F N-Channel SuperFET® II FRFET® MOSFET 650 V, 35 A, 110 mΩ Features Description • 700 V @TJ = 150°C SuperFET® II MOSFET is Fairchild Semiconductor’s brand-new high voltage super-junction (SJ) MOSFET family that is utilizing charge balance technology for outstanding low on-resistance and lower gate charge performance. • Typ. RDS(on) = 96 mΩ (Typ.) • Ultra Low Gate Charge (Typ. Qg = 98 nC) SuperFET® II FRFET® MOSFET combines a faster and more rugged intrinsic body diode performance with fast switching, • Low Effective Output Capacitance (Typ. Coss(eff.) = 464 pF) • 100% Avalanche Tested aimed at achieving better reliability and efficiency especially in resonant switching applications. • RoHS Compliant SuperFET® II FRFET® is very suitable for the switching power applications such as server/telecom power, Solar inverter, FPD TV power, computing power, lighting and industrial power applications. Applications • Telecom/Server Power Supplies • Solar Inverters • Computing Power Supplies • FPD TV Power/Lighting D D G S G D2-PAK S Absolute Maximum Ratings TC = 25oC unless otherwise noted. Symbol VDSS Drain to Source Voltage VGSS Gate to Source Voltage ID Drain Current IDM Drain Current EAS Single Pulsed Avalanche Energy IAR Avalanche Current (Note 1) 8 A EAR Repetitive Avalanche Energy (Note 1) 3.57 mJ MOSFET dv/dt (Note 3) 100 dv/dt Parameter - DC ±20 - AC ±30 - Continuous (TC = 25oC) - Pulsed (Note 1) 105 A 809 mJ (TC = 25oC) Operating and Storage Temperature Range Maximum Lead Temperature for Soldering, 1/8” from Case for 5 Seconds A (Note 2) 50 TJ, TSTG V 24 Peak Diode Recovery dv/dt Power Dissipation Unit V 35 - Continuous (TC = 100oC) PD TL FCB110N65F 650 - Derate Above 25oC V/ns 357 W 2.86 W/oC -55 to +150 o C 300 o C Thermal Characteristics Symbol RθJC RθJA Parameter FCB110N65F Thermal Resistance, Junction to Case 0.35 Thermal Resistance, Junction to Ambient (Mimimum Pad of 2-oz copper), Max. 2 Thermal Resistance, Junction to Ambient (1 in Pad of 2-oz copper), Max. ©2015 Fairchild Semiconductor Corporation FCB110N65F Rev. 1.1 Unit 1 62.5 o C/W 40 www.fairchildsemi.com FCB110N65F — N-Channel SuperFET® II FRFET® MOSFET August 2016 Part Number FCB110N65F Top Mark FCB110N65F Package D2-PAK Packing Method Tape and Reel Reel Size 330 mm Tape Width 24 mm Tape Width 800 units Electrical Characteristics TC = 25oC unless otherwise noted. Symbol Parameter Test Conditions Min. Typ. Max. Unit ID = 10 mA, VGS = 0 V, TJ = 25°C 650 - - V ID = 10 mA, VGS = 0 V, TJ = 150°C 700 - - V - 0.72 - V/oC Off Characteristics BVDSS Drain to Source Breakdown Voltage ΔBVDSS / ΔTJ Breakdown Voltage Temperature Coefficient IDSS Zero Gate Voltage Drain Current IGSS Gate to Body Leakage Current ID = 10 mA, Referenced to 25oC VDS = 650 V, VGS = 0 V - - 10 VDS = 520 V, VGS = 0 V, TC = 125oC - 110 - VGS = ±20 V, VDS = 0 V - - ±100 μA nA On Characteristics VGS(th) RDS(on) Gate Threshold Voltage VGS = VDS, ID = 3.5 mA 3 - 5 V Static Drain to Source On Resistance - 96 110 mΩ gFS Forward Transconductance VGS = 10 V, ID = 17.5 A VDS = 20 V, ID = 17.5 A - 30 - S Dynamic Characteristics - 3680 4895 pF - 110 145 pF - 0.65 - pF - 65 - pF VDS = 0 V to 400 V, VGS = 0 V - 464 - pF VDS = 380 V, ID = 17.5 A, VGS = 10 V - 98 145 nC - 20 - nC - 43 - nC - 0.7 - Ω - 31 72 ns - 21 52 ns - 89 188 ns - 5.7 21 ns Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance Coss Output Capacitance VDS = 380 V, VGS = 0 V, f = 1 MHz Coss eff. Effective Output Capacitance Qg(tot) Total Gate Charge at 10V Qgs Gate to Source Gate Charge Qgd Gate to Drain “Miller” Charge ESR Equivalent Series Resistance VDS = 100 V, VGS = 0 V, f = 1 MHz (Note 4) f = 1 MHz Switching Characteristics td(on) Turn-On Delay Time tr Turn-On Rise Time td(off) Turn-Off Delay Time tf Turn-Off Fall Time VDD = 380 V, ID = 17.5 A, VGS = 10 V, Rg = 4.7 Ω (Note 4) Drain-Source Diode Characteristics IS Maximum Continuous Drain to Source Diode Forward Current - - 35 A ISM Maximum Pulsed Drain to Source Diode Forward Current - - 100 A VSD Drain to Source Diode Forward Voltage VGS = 0 V, ISD = 17.5 A - - 1.4 V trr Reverse Recovery Time - 133 - ns Qrr Reverse Recovery Charge VGS = 0 V, ISD = 17.5 A, dIF/dt = 100 A/μs - 0.67 - μC Notes: 1. Repetitive rating: pulse width limited by maximum junction temperature. 2. IAS = 8 A, RG = 25 Ω, starting TJ = 25°C. 3. ISD ≤ 17.5 A, di/dt ≤ 200 A/μs, VDD ≤ 380 V, starting TJ = 25°C. 4. Essentially independent of operating temperature typical characteristics. ©2015 Fairchild Semiconductor Corporation FCB110N65F Rev. 1.1 2 www.fairchildsemi.com FCB110N65F — N-Channel SuperFET® II FRFET® MOSFET Package Marking and Ordering Information Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics 200 VGS = 10.0V 8.0V 100 7.0V 6.5V 6.0V 5.5V *Notes: 1. VDS = 20V 2. 250μs Pulse Test 100 ID, Drain Current[A] ID, Drain Current[A] 200 10 o 150 C 10 o 25 C o *Notes: 1. 250μs Pulse Test -55 C o 2. TC = 25 C 1 0.3 1 10 VDS, Drain-Source Voltage[V] 1 20 Figure 3. On-Resistance Variation vs. Drain Current and Gate Voltage 4 5 6 7 VGS, Gate-Source Voltage[V] 200 100 IS, Reverse Drain Current [A] 0.20 0.15 VGS = 10V 0.10 VGS = 20V 10 o 150 C 1 o 25 C 0.1 0.01 *Notes: 1. VGS = 0V o *Note: TC = 25 C 0.05 0 20 40 60 ID, Drain Current [A] 80 0.001 0.0 100 Figure 5. Capacitance Characteristics Capacitances [pF] VGS, Gate-Source Voltage [V] 10 10000 Ciss 1000 Coss 100 *Note: 1. VGS = 0V 2. f = 1MHz 10 Crss Ciss = Cgs + Cgd (Cds = shorted) Coss = Cds + Cgd Crss = Cgd 0.1 0.1 1 10 100 VDS, Drain-Source Voltage [V] ©2015 Fairchild Semiconductor Corporation FCB110N65F Rev. 1.1 2. 250μs Pulse Test 0.3 0.6 0.9 1.2 1.5 VSD, Body Diode Forward Voltage [V] 1.8 Figure 6. Gate Charge Characteristics 100000 1 8 Figure 4. Body Diode Forward Voltage Variation vs. Source Current and Temperature 0.25 RDS(ON) [Ω], Drain-Source On-Resistance 3 VDS = 130V 8 3 VDS = 325V VDS = 520V 6 4 2 0 660 *Note: ID = 17.5A 0 20 40 60 80 Qg, Total Gate Charge [nC] 100 www.fairchildsemi.com FCB110N65F — N-Channel SuperFET® II FRFET® MOSFET Typical Performance Characteristics Figure 7. Breakdown Voltage Variation vs. Temperature Figure 8. On-Resistance Variation vs. Temperature 2.5 1.10 *Notes: 1. VGS = 0V 2. ID = 10mA RDS(on), [Normalized] Drain-Source On-Resistance BVDSS, [Normalized] Drain-Source Breakdown Voltage 1.15 1.05 1.00 0.95 0.90 -100 -50 0 50 100 150 o TJ, Junction Temperature [ C] 2.0 1.5 1.0 0.5 -100 200 Figure 9. Maximum Safe Operating Area -50 0 50 100 150 o TJ, Junction Temperature [ C] 200 Figure 10. Maximum Drain Current vs. Case Temperature 40 300 100 10μs 10 ID, Drain Current [A] 100μs ID, Drain Current [A] *Notes: 1. VGS = 10V 2. ID = 17.5A 1ms DC 1 Operation in This Area is Limited by R DS(on) *Notes: o 1. TC = 25 C 0.1 30 20 10 o 2. TJ = 150 C 3. Single Pulse 0.01 0.1 1 10 100 VDS, Drain-Source Voltage [V] 0 25 1000 50 75 100 125 o TC, Case Temperature [ C] 150 Figure 11. Eoss vs. Drain to Source Voltage Switching Capability 20 EOSS, [μJ] 16 12 8 4 0 0 132 264 396 528 VDS, Drain to Source Voltage [V] ©2015 Fairchild Semiconductor Corporation FCB110N65F Rev. 1.1 660 4 www.fairchildsemi.com FCB110N65F — N-Channel SuperFET® II FRFET® MOSFET Typical Performance Characteristics (Continued) FCB110N65F — N-Channel SuperFET® II FRFET® MOSFET Typical Performance Characteristics (Continued) Figure 12. Transient Thermal Response Curve o ZθJC(t), Thermal Response [ C/W] 1 0.5 0.1 0.2 PDM 0.1 t1 0.05 0.01 0.02 o 1. ZθJC(t) = 0.35 C/W Max. 2. Duty Factor, D= t1/t2 3. TJM - TC = PDM * ZθJC(t) Single pulse 0.001 -5 10 ©2015 Fairchild Semiconductor Corporation FCB110N65F Rev. 1.1 t2 *Notes: 0.01 -4 10 -3 -2 10 10 t1, Rectangular Pulse Duration [sec] 5 -1 10 1 www.fairchildsemi.com FCB110N65F — N-Channel SuperFET® II FRFET® MOSFET IG = const. Figure 13. Gate Charge Test Circuit & Waveform VDS RG RL VDS VDD VGS VGS DUT V 10V GS 90% 10% td(on) tr t on td(off) tf t off Figure 14. Resistive Switching Test Circuit & Waveforms VGS Figure 15. Unclamped Inductive Switching Test Circuit & Waveforms ©2015 Fairchild Semiconductor Corporation FCB110N65F Rev. 1.1 6 www.fairchildsemi.com FCB110N65F — N-Channel SuperFET® II FRFET® MOSFET DUT + VDS _ I SD L Driver RG VGS VGS ( Driver ) Same Type as DUT VDD • dv/dt controlled by RG • ISD controlled by pulse period Gate Pulse Width D = -------------------------Gate Pulse Period 10V IFM , Body Diode Forward Current I SD ( DUT ) di/dt IRM Body Diode Reverse Current VDS ( DUT ) Body Diode Recovery dv/dt VDD VSD Body Diode Forward Voltage Drop Figure 16. Peak Diode Recovery dv/dt Test Circuit & Waveforms ©2015 Fairchild Semiconductor Corporation FCB110N65F Rev. 1.1 7 www.fairchildsemi.com 10.67 9.65 10.67 -A1.68 1.00 4 4 9.45 9.65 8.38 10.00 1.78 MAX 2 3 1 1.78 1.14 0.99 0.51 (2.12) 2 0.25 MAX PLASTIC BODY STUB 3.80 3 1 1.05 0.25 M 5.08 B AM LAND PATTERN RECOMMENDATION UNLESS NOTED, ALL DIMS TYPICAL 5.08 FRONT VIEW - DIODE PRODUCTS VERSION ALTERNATIVE SUPPLIER DETAIL 6.22 MIN 4 -B- 4.83 4.06 1.65 1.14 4 6.86 MIN 15.88 14.61 SEE DETAIL A 2 2 3 1 3 1 BACK VIEW - DIODE PRODUCTS VERSION ALTERNATIVE SUPPLIER DETAIL GAGE PLANE 0.74 0.33 0.25 2.79 1.78 0.25 MAX (5.38) SEATING PLANE SCALE: 2X 0.10 NOTES: UNLESS OTHERWISE SPECIFIED A) ALL DIMENSIONS ARE IN MILLIMETERS. B) REFERENCE JEDEC, TO-263, VARIATION AB. C) DIMENSIONING AND TOLERANCING PER DIMENSIONING AND TOLERANCING PER ASME Y14.5 - 2009. D) LOCATION OF THE PIN HOLE MAY VARY (LOWER LEFT CORNER, LOWER CENTER AND CENTER OF THE PACKAGE). E) LANDPATTERN RECOMMENDATION PER IPC TO254P1524X482-3N B F) FILENAME: TO263A02REV8 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com © Semiconductor Components Industries, LLC N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 www.onsemi.com 1 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative www.onsemi.com
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