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FCP260N60E

FCP260N60E

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    SOT78

  • 描述:

    MOSFET N CH 600V 15A TO-220

  • 数据手册
  • 价格&库存
FCP260N60E 数据手册
Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. FCP260N60E / FCPF260N60E N 沟道 SuperFET® II Easy-Drive MOSFET 600 V, 15 A, 260 m 特性 说明 • 650 V @ TJ = 150°C SuperFET® II MOSFET 是飞兆半导体新一代利用电荷平衡技术 实现出色低导通电阻和更低栅极电荷性能的高压超级结 (SJ) MOSFET 系列产品。这项技术专用于最小化导通损耗并提供卓越 的开关性能、dv/dt额定值和更高雪崩能量。类似地,与SuperFET II MOSFET 系列相比,SuperFET II MOSFET Easy-Drive 系列具 有略为缓慢的上升和下降时间。该系列产品型号以 “E” 作为前缀, 有助于解决 EMI 问题,设计部署更为简单。如需获得更快的开关 速 度 并 用 于 开 关 损 耗 必 须 尽 可 能 低 的 应 用 中,请 考 虑 使 用 SuperFET II MOSFET 系列。 • 典型值 RDS(on) = 220 m • 超低栅极电荷 (典型值 Qg = 48 nC) • 低有效输出电容 (典型值 Coss(eff.)= 129 pF) • 100% 经过雪崩测试 • 集成栅极电阻 • 符合 RoHS 标准 应用 • LCD / LED / PDP 电视灯光 • 光伏逆变器 • AC-DC 电源 D GD S MOSFET 最大额定值 符号 VDSS 漏极-源极电压 VGSS 栅极-源极电压 G G D S TO-220 TO-220F S TC = 25°C 除非另有说明。 参数 ID 漏极电流 FCP260N60E FCPF260N60E 600 单位 V ±20 V - DC - AC (f > 1 Hz) ±30 V - 连续 (TC = 25°C) 15 15* - 连续 (TC = 100°C) 9.5 9.5* 45 45* A A IDM 漏极电流 EAS 单脉冲雪崩能量 (说明 2) IAR 雪崩电流 (说明 1) 3.0 A EAR 重复雪崩能量 MOSFET dv/dt (说明 1) 1.56 mJ 二极管恢复 dv/dt 峰值 (说明 3) dv/dt - 脉冲 (说明 1) mJ 100 V/ns 20 (TC = 25°C) 156 36 W - 降低至 25°C 以上 1.25 0.29 W/°C PD 功耗 TJ, TSTG 工作和存储温度范围 用于焊接的最大引线温度,距离外壳 1/8",持续 5 秒 TL 292.5 -55 至 +150 °C 300 °C * 漏极电流受限于最大结温 热性能 符号 参数 FCP260N60E FCPF260N60E RJC 结至外壳热阻最大值 0.8 3.5 RJA 结至环境热阻最大值 62.5 62.5 © 2012 飞兆半导体公司 FCP260N60E / FCPF260N60E Rev. C4 1 单位 °C/W www.fairchildsemi.com FCP260N60E / FCPF260N60E — N 沟道 SuperFET® II Easy-Drive MOSFET 2014 年 2 月 器件编号 FCP260N60E 顶标 FCP260N60E 封装 TO-220 包装方法 塑料管 卷尺寸 不适用 带宽 不适用 数量 50 个 FCPF260N60E FCPF260N60E TO-220F 塑料管 不适用 不适用 50 个 电气特性 TC = 25°C 除非另有说明。 符号 参数 测试条件 最小值 典型值 最大值 单位 关断特性 VGS = 0 V, ID = 10 mA, TJ = 25°C 600 - - VGS = 0 V, ID = 10 mA, TJ = 150°C 650 - - - 0.67 - V/°C VGS = 0 V, ID = 15 A - 700 - V VDS = 480 V, VGS = 0 V - - 1 VDS = 480 V, TC = 125°C - - 10 - ±100 BVDSS 漏极-源极击穿电压 BVDSS / TJ BVDS 击穿电压温度系数 ID=10 mA,参考条件为 25°C 漏极 - 源极雪崩击穿电压 V A IDSS 零栅极电压漏极电流 IGSS 栅极 - 体漏电流 VGS = ±20 V, VDS = 0 V - VGS(th) RDS(on) 栅极阈值电压 VGS = VDS, ID = 250 A 2.5 - 3.5 V 漏极至源极静态导通电阻 - 0.22 0.26  gFS 正向跨导 VGS = 10 V, ID = 7.5 A VDS = 20 V, ID = 7.5 A - 15.5 - S - 1880 2500 pF - 1330 1770 pF - 85 130 pF - 32 - pF 129 - pF nC nA 导通特性 动态特性 Ciss Coss Crss 输入电容 输出电容 反向传输电容 VDS = 25 V, VGS = 0 V, f = 1 MHz 输出电容 VDS = 380 V, VGS = 0 V, f = 1 MHz Coss(eff.) 有效输出电容 VDS = 0 V 至 480 V, VGS = 0 V - Qg(tot) 10 V 的栅极电荷总量 VDS = 380 V, ID = 7.5 A, VGS = 10 V - 48 62 - 7.4 - nC - 17 - nC f = 1 MHz - 5.8 -  - 20 50 ns VDD = 380 V, ID = 7.5 A, VGS = 10 V, RG = 4.7  - 11 32 ns - 89 188 ns - 13 36 ns 漏极 - 源极二极管最大正向连续电流 - - 15 A 漏极 - 源极二极管最大正向脉冲电流 - - 45 A VGS = 0 V, ISD = 7.5 A - - 1.2 V VGS = 0 V, ISD = 7.5 A, dIF/dt = 100 A/s - 270 - ns - 3.6 - C Coss Qgs 栅极 - 源极栅极电荷 Qgd 栅极 - 漏极 “ 米勒 ” 电荷 ESR 等效串联电阻 (说明 4) 开关特性 td(on) 导通延迟时间 tr 开通上升时间 td(off) 关断延迟时间 tf 关断下降时间 (说明 4) 漏极 - 源极二极管特性 IS ISM VSD 漏极 - 源极二极管正向电压 trr 反向恢复时间 Qrr 反向恢复电荷 注意: 1. 重复额定值:脉冲宽度受限于最大结温。 2. IAS = 3 A, VDD = 50 V, RG = 25 ,启动 TJ = 25°C。 3. ISD  7.5 A, di/dt  200 A/s, VDD  BVDSS,启动 TJ = 25°C。 4. 本质上独立于工作温度的典型特性。 © 2012 飞兆半导体公司 FCP260N60E / FCPF260N60E Rev. C4 2 www.fairchildsemi.com FCP260N60E / FCPF260N60E — N 沟道 SuperFET® II Easy-Drive MOSFET 封装标识与定购信息 图 1. 导通区域特性 图 2. 传输特性 100 VGS = 20.0V 10.0V 8.0V 7.0V 6.0V 5.0V 4.5V 10 ID, Drain Current[A] ID, Drain Current[A] 50 1 10 o 150 C o 25 C 1 o -55 C *Notes: 1. 250s Pulse Test o 2. TC = 25 C 0.3 0.1 1 VDS, Drain to Source Voltage[V] 10 0.1 20 图 3. 导通电阻变化与漏极电流和栅极电压 4 6 VGS, Gate to Source Voltage[V] 100 IS, Reverse Drain Current [A] 0.5 0.4 VGS = 10V 0.3 VGS = 20V 0.2 o 150 C 10 o 25 C *Notes: 1. VGS = 0V o 0.1 *Note: TC = 25 C 0 10 20 30 ID, Drain Current [A] 40 2. 250s Pulse Test 1 0.2 50 图 5. 电容特性 VGS, Gate to Source Voltage [V] 1000 100 1 0.5 0.1 1.4 10 Ciss 10 0.4 0.6 0.8 1.0 1.2 VSD, Body Diode Forward Voltage [V] 图 6. 栅极电荷特性 10000 Capacitances [pF] 8 图 4. 体二极管正向电压变化与源极电流和温度 0.6 RDS(ON) [], Drain to Source On-Resistance 2 *Notes: 1. VDS = 20V 2. 250s Pulse Test Coss *Note: 1. VGS = 0V 2. f = 1MHz Ciss = Cgs + Cgd (Cds = shorted) Coss = Cds + Cgd Crss = Cgd 1 10 100 VDS, Drain to Source Voltage [V] © 2012 飞兆半导体公司 FCP260N60E / FCPF260N60E Rev. C4 Crss 6 4 2 0 600 3 VDS = 120V VDS = 300V VDS = 480V 8 *Note: ID = 7.5A 0 10 20 30 40 Qg, Total Gate Charge [nC] 50 www.fairchildsemi.com FCP260N60E / FCPF260N60E — N 沟道 SuperFET® II Easy-Drive MOSFET 典型性能特征 图 7. 击穿电压变化与温度 图 8. 导通电阻变化 vs. 温度 3.0 RDS(on), [Normalized] Drain to Source On-Resistance BVDSS, [Normalized] Drain to Source Breakdown Voltage 1.15 1.10 1.05 1.00 0.95 *Notes: 1. VGS = 0V 2. ID = 10mA 0.90 0.85 -100 -50 0 50 100 150 o TJ, Junction Temperature [ C] 1.5 1.0 *Notes: 1. VGS = 10V 2. ID = 7.5A 0.5 0.0 -100 ID, Drain Current [A] 100s 1ms 10ms 10 DC Operation in This Area is Limited by R DS(on) 10s 100s 1ms 10 10ms 1 Operation in This Area is Limited by R DS(on) o 1. TC = 25 C 0.1 o 1. TC = 25 C o 2. TJ = 150 C 3. Single Pulse o 2. TJ = 150 C 3. Single Pulse 1 10 100 VDS, Drain to Source Voltage [V] 0.01 0.1 1000 图 11. 最大漏极电流与壳体温度的关系 1 10 100 VDS, Drain to Source Voltage [V] 1000 图 12. Eoss 与漏极-源极电压的关系 16 8 12 6 EOSS, [J] ID, Drain Current [A] DC *Notes: *Notes: 8 4 2 4 0 25 200 100 10s 0.1 0.1 -50 0 50 100 150 o TJ, Junction Temperature [ C] 图 10. 最大安全操作区 (FCPF260N60E) 100 ID, Drain Current [A] 2.0 200 图 9. 最大安全工作区(FCP260N60E) 1 2.5 50 75 100 125 o TC, Case Temperature [ C] © 2012 飞兆半导体公司 FCP260N60E / FCPF260N60E Rev. C4 0 150 4 0 100 200 300 400 500 VDS, Drain to Source Voltage [V] 600 www.fairchildsemi.com FCP260N60E / FCPF260N60E — N 沟道 SuperFET® II Easy-Drive MOSFET 典型性能特征 (接上页) FCP260N60E / FCPF260N60E — N 沟道 SuperFET® II Easy-Drive MOSFET 典型性能特征 (接上页) 图 13. 瞬态热响应曲线 (FCP260N60E) ZJC (t),热响应 [oC/W] [ZJC] Thermal Response 2 1 0.5 0.2 0.1 PDM 0.1 t1 0.05 t2 *Notes: 0.02 0.01 Single pulse o 1. ZJC(t) = 0.8 C/W Max. 2. Duty Factor, D= t1/t2 3. TJM - TC = PDM * ZJC(t) 0.01 -5 10 -4 10 -3 -2 -1 10 10 Pulse Duration [sec] tRectangular 1,矩形脉冲持续时间 [ 秒 ] 10 1 图 14. 瞬态热响应曲线 (FCPF260N60E) ZJC (t),热响应 [oC/W] [Z ] Thermal Response JC 5 0.5 1 0.2 0.1 PDM 0.05 t1 0.02 0.01 Single pulse *Notes: o 0.1 0.05 -5 10 t2 1. ZJC(t) = 3.5 C/W Max. 2. Duty Factor, D= t1/t2 3. TJM - TC = PDM * ZJC(t) -4 10 -3 -2 -1 0 10 10 10 10 Pulse[ 秒 Duration [sec] t Rectangular ,矩形脉冲持续时间 ] 1 10 100 1 © 2012 飞兆半导体公司 FCP260N60E / FCPF260N60E Rev. C4 5 www.fairchildsemi.com FCP260N60E / FCPF260N60E — N 沟道 SuperFET® II Easy-Drive MOSFET IG = 常量 图 15. 栅极电荷测试电路与波形 VDS RG V 10V GS RL VDS 90% VDD VGS VGS DUT 10% td(on) tr t on td(off) tf t off 图 16. 阻性开关测试电路与波形 VGS 图 17. 非箝位感性开关测试电路与波形 © 2012 飞兆半导体公司 FCP260N60E / FCPF260N60E Rev. C4 6 www.fairchildsemi.com FCP260N60E / FCPF260N60E — N 沟道 SuperFET® II Easy-Drive MOSFET DUT + VDS _ I SD L Driver RG VGS VGS ( Driver ) Same Type as DUT VDD • dv/dt controlled by RG • ISD controlled by pulse period Gate Pulse Width D = -------------------------Gate Pulse Period 10V IFM , Body Diode Forward Current I SD ( DUT ) di/dt IRM Body Diode Reverse Current VDS ( DUT ) Body Diode Recovery dv/dt VSD VDD Body Diode Forward Voltage Drop 图 18. 二极管恢复 dv/dt 峰值测试电路与波形 © 2012 飞兆半导体公司 FCP260N60E / FCPF260N60E Rev. C4 7 www.fairchildsemi.com SUPPLIER "B" PACKAGE SHAPE 3.50 10.67 9.65 E SUPPLIER "A" PACKAGE SHAPE 3.40 2.50 16.30 13.90 IF PRESENT, SEE NOTE "D" 16.51 15.42 E 9.40 8.13 E 1 [2.46] 2 3 C 4.10 2.70 14.04 12.70 2.13 2.06 FRONT VIEWS 4.70 4.00 1.62 H 1.42 "A1" 8.65 7.59 SEE NOTE "F" 1.62 1.10 2.67 2.40 1.00 0.55 6.69 6.06 OPTIONAL CHAMFER E 14.30 11.50 NOTE "I" BOTTOM VIEW 3 0.60 0.36 SIDE VIEW 2.85 2.10 2 1 BACK VIEW NOTES: A) REFERENCE JEDEC, TO-220, VARIATION AB B) ALL DIMENSIONS ARE IN MILLIMETERS. C) DIMENSIONS COMMON TO ALL PACKAGE SUPPLIERS EXCEPT WHERE NOTED [ ]. D) LOCATION OF MOLDED FEATURE MAY VARY (LOWER LEFT CORNER, LOWER CENTER AND CENTER OF THE PACKAGE) E DOES NOT COMPLY JEDEC STANDARD VALUE. F) "A1" DIMENSIONS AS BELOW: SINGLE GAUGE = 0.51 - 0.61 DUAL GAUGE = 1.10 - 1.45 G) DRAWING FILE NAME: TO220B03REV9 H PRESENCE IS SUPPLIER DEPENDENT I) SUPPLIER DEPENDENT MOLD LOCKING HOLES IN HEATSINK. B A 10.36 9.96 B 3.28 3.08 7.00 3.40 3.20 2.66 2.42 0.70 SEE NOTE "F" SEE NOTE "F" 6.88 6.48 1 X 45° B 16.00 15.60 16.07 15.67 (3.23) B 1 2.14 3 1.47 1.24 2.96 2.56 0.90 0.70 10.05 9.45 0.50 M A 30° 0.45 0.25 2.54 B 2.54 B 4.90 4.50 NOTES: A. EXCEPT WHERE NOTED CONFORMS TO EIAJ SC91A. B DOES NOT COMPLY EIAJ STD. VALUE. C. ALL DIMENSIONS ARE IN MILLIMETERS. D. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH AND TIE BAR PROTRUSIONS. E. DIMENSION AND TOLERANCE AS PER ASME Y14.5-1994. F. OPTION 1 - WITH SUPPORT PIN HOLE. OPTION 2 - NO SUPPORT PIN HOLE. G. DRAWING FILE NAME: TO220M03REV5 0.60 0.45 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com © Semiconductor Components Industries, LLC N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 www.onsemi.com 1 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative www.onsemi.com
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