Is Now Part of
To learn more about ON Semiconductor, please visit our website at
www.onsemi.com
Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers
will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor
product management systems do not have the ability to manage part nomenclature that utilizes an underscore
(_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain
device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated
device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please
email any questions regarding the system integration to Fairchild_questions@onsemi.com.
ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number
of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right
to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON
Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON
Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s
technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA
Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended
or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out
of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor
is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
FDB0165N807L
N-Channel PowerTrench® MOSFET
80 V, 310 A, 1.6 mΩ
Features
General Description
This N-Channel MOSFET is produced using Fairchild
Semiconductor’s advance PowerTrench® process that has
been especially tailored to minimize the on-state resistance
while maintaining superior ruggedness and switching
performance for industrial applications.
Max rDS(on) = 1.6 mΩ at VGS = 10 V, ID = 36 A
Fast Switching Speed
Low Gate Charge
High Performance Trench Technology for Extremely Low
rDS(on)
Applications
High Power and Current Handling Capability
Industrial Motor Drive
Industrial Power Supply
RoHS Compliant
Industrial Automation
Battery Operated Tools
Battery Protection
Solar Inverters
UPS and Energy Inverters
Energy Storage
Load Switch
D(Pin4, tab)
4
12
3
56
7
1. Gate
2. Source/Kelvin Sense
3. Source/Kelvin Sense
4. Drain
5. Source
6. Source
7. Source
G
(Pin1)
D2-PAK
(TO263)
S(Pin2,3,5,6,7)
MOSFET Maximum Ratings TC = 25 °C unless otherwise noted.
Symbol
VDS
Drain to Source Voltage
Parameter
VGS
Gate to Source Voltage
Drain Current -Continuous
-Continuous
ID
TJ, TSTG
±20
V
(Note 5)
TC = 100°C
(Note 5)
220
(Note 4)
1780
(Note 3)
1083
Single Pulse Avalanche Energy
PD
Units
V
TC = 25°C
-Pulsed
EAS
Ratings
80
Power Dissipation
TC = 25°C
Power Dissipation
TA = 25°C
310
300
(Note 1a)
Operating and Storage Junction Temperature Range
3.8
-55 to +175
A
mJ
W
°C
Thermal Characteristics
RθJC
Thermal Resistance, Junction to Case
RθJA
Thermal Resistance, Junction to Ambient
(Note 1)
0.5
(Note 1a)
40
°C/W
Package Marking and Ordering Information
Device Marking
FDB0165N807L
Device
FDB0165N807L
©2015 Fairchild Semiconductor Corporation
FDB0165N807L Rev.C
Package
D2-PAK-7L
1
Reel Size
330mm
Tape Width
24mm
Quantity
800 units
www.fairchildsemi.com
FDB0165N807L N-Channel PowerTrench® MOSFET
December 2015
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Units
Off Characteristics
BVDSS
Drain to Source Breakdown Voltage
ID = 250 μA, VGS = 0 V
ΔBVDSS
ΔTJ
Breakdown Voltage Temperature
Coefficient
ID = 250 μA, referenced to 25 °C
IDSS
Zero Gate Voltage Drain Current
VDS = 64 V, VGS = 0 V
1
μA
IGSS
Gate to Source Leakage Current
VGS = ±20 V, VDS = 0 V
±100
nA
4
V
80
V
38
mV/°C
On Characteristics (Note 2)
VGS(th)
Gate to Source Threshold Voltage
VGS = VDS, ID = 250 μA
ΔVGS(th)
ΔTJ
Gate to Source Threshold Voltage
Temperature Coefficient
ID = 250 μA, referenced to 25 °C
rDS(on)
Static Drain to Source On Resistance
gFS
Forward Transconductance
2
2.9
-13
mV/°C
VGS = 10 V, ID = 36 A
1.2
1.6
VGS = 10 V, ID = 36 A, TJ= 150°C
2.0
2.7
VDS = 10 V, ID = 36 A
136
mΩ
S
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate Resistance
VDS = 40 V, VGS = 0 V,
f = 1 MHz
16900
23660
pF
2350
3290
pF
335
1050
pF
Ω
3.3
Switching Characteristics
td(on)
Turn-On Delay Time
tr
Rise Time
td(off)
Turn-Off Delay Time
tf
Fall Time
Qg
Total Gate Charge
Qgs
Gate to Source Gate Charge
Qgd
Gate to Drain “Miller” Charge
VDD = 40 V, ID = 36 A,
VGS = 10 V, RGEN = 6 Ω
VDD = 40 V, ID = 36 A,
VGS = 10 V
68
109
ns
104
166
ns
123
197
ns
64
102
ns
217
304
nC
75
nC
38
nC
Drain-Source Diode Characteristics
IS
Maximum Continuous Drain to Source Diode Forward Current
310
A
ISM
Maximum Pulsed Drain to Source Diode Forward Current
1780
A
VSD
Source to Drain Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
VGS = 0 V, IS = 36 A
(Note 2)
IF = 36 A, di/dt = 100 A/μs
0.8
1.2
V
85
136
ns
90
144
nC
Notes:
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins.
RθJC is guaranteed by design while RθCA is determined by the user's board design.
a) 40 °C/W when mounted on a 1 in2 pad of 2 oz copper.
b) 62.5 °C/W when mounted on a minimum pad of 2 oz copper.
2. Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0 %.
3. EAS of 1083 mJ is based on starting TJ = 25 °C, L = 0.3 mH, IAS = 85 A, VDD = 72 V, VGS = 10 V. 100% test at L = 0.1 mH, IAS = 123 A.
4. Pulsed Id please refer to Figure 10 “Forward Bias Safe Operating Area” for more details.
5. Computed continuous current limited to Max Junction Temperature only, actual continuous current will be limited by thermal & electro-mechanical application board design.
©2015 Fairchild Semiconductor Corporation
FDB0165N807L Rev.C
2
www.fairchildsemi.com
FDB0165N807L N-Channel PowerTrench® MOSFET
Electrical Characteristics TJ = 25 °C unless otherwise noted.
VGS = 10 V
VGS = 8 V
200
VGS = 7 V
VGS = 6.5 V
VGS = 6 V
100
PULSE DURATION = 80 μs
DUTY CYCLE = 0.5% MAX
0
0
1
2
3
NORMALIZED
DRAIN TO SOURCE ON-RESISTANCE
ID, DRAIN CURRENT (A)
300
VGS = 6 V
2
VGS = 6.5 V
VGS = 7 V
1
PULSE DURATION = 80 μs
DUTY CYCLE = 0.5% MAX
0
3
0
100
VDS, DRAIN TO SOURCE VOLTAGE (V)
20
rDS(on), DRAIN TO
1.6
1.4
1.2
1.0
0.8
SOURCE ON-RESISTANCE (mΩ)
NORMALIZED
DRAIN TO SOURCE ON-RESISTANCE
ID = 36 A
VGS = 10 V
IS, REVERSE DRAIN CURRENT (A)
PULSE DURATION = 80 μs
DUTY CYCLE = 0.5% MAX
ID, DRAIN CURRENT (A)
200
oC
TJ = 25 oC
TJ = -55 oC
2
3
4
5
6
10
5
TJ = 150 oC
TJ = 25 oC
4
5
6
7
8
9
300
100
VGS = 0 V
10
TJ = 175 oC
TJ = 25 oC
1
0.1
TJ = -55 oC
0.01
1E-3
0.0
7
0.2
0.4
0.6
0.8
1.0
VGS, GATE TO SOURCE VOLTAGE (V)
VSD, BODY DIODE FORWARD VOLTAGE (V)
Figure 5. Transfer Characteristics
Figure 6. Source to Drain Diode
Forward Voltage vs. Source Current
©2015 Fairchild Semiconductor Corporation
FDB0165N807L Rev.C
10
Figure 4. On-Resistance vs. Gate to
Source Voltage
VDS = 5 V
0
ID = 36 A
VGS, GATE TO SOURCE VOLTAGE (V)
Figure 3. Normalized On Resistance
vs. Junction Temperature
100
PULSE DURATION = 80 μs
DUTY CYCLE = 0.5% MAX
15
0
0.6
-75 -50 -25 0 25 50 75 100 125 150 175
TJ, JUNCTION TEMPERATURE (oC)
TJ = 175
300
Figure 2. Normalized On-Resistance
vs. Drain Current and Gate Voltage
2.0
300
200
ID, DRAIN CURRENT (A)
Figure 1. On Region Characteristics
1.8
VGS = 10 V
VGS = 8 V
3
1.2
www.fairchildsemi.com
FDB0165N807L N-Channel PowerTrench® MOSFET
Typical Characteristics TJ = 25 °C unless otherwise noted.
VGS, GATE TO SOURCE VOLTAGE (V)
10
100000
ID = 36 A
VDD = 30 V
8
Ciss
6
CAPACITANCE (pF)
VDD = 40 V
VDD = 50 V
4
10000
Coss
1000
Crss
2
0
f = 1 MHz
VGS = 0 V
0
50
100
150
200
100
0.1
250
1
Figure 7. Gate Charge Characteristics
80
Figure 8. Capacitance vs. Drain
to Source Voltage
3000
500
1000
10 μs
ID, DRAIN CURRENT (A)
IAS, AVALANCHE CURRENT (A)
10
VDS, DRAIN TO SOURCE VOLTAGE (V)
Qg, GATE CHARGE (nC)
100
TJ = 25 oC
10
TJ = 150 oC
1
0.001
0.01
0.1
1
10
100
100
1 ms
SINGLE PULSE
TJ = MAX RATED
1
RθJC = 0.5 oC/W
0.1
0.1
1000 10000
100 μs
THIS AREA IS
LIMITED BY rDS(on)
10
TC = 25 oC
10 ms
1
tAV, TIME IN AVALANCHE (ms)
100 ms/DC
CURVE BENT TO
MEASURED DATA
10
100
500
VDS, DRAIN to SOURCE VOLTAGE (V)
Figure 10. Forward Bias Safe
Operating Area
Figure 9. Unclamped Inductive
Switching Capability
5
P(PK), PEAK TRANSIENT POWER (W)
10
SINGLE PULSE
o
RθJC = 0.5 C/W
o
TC = 25 C
4
10
3
10
2
10 -5
10
-4
10
-3
-2
10
10
-1
10
1
t, PULSE WIDTH (sec)
Figure 11. Single Pulse Maximum Power Dissipation
©2015 Fairchild Semiconductor Corporation
FDB0165N807L Rev.C
4
www.fairchildsemi.com
FDB0165N807L N-Channel PowerTrench® MOSFET
Typical Characteristics TJ = 25 °C unless otherwise noted.
r(t), NORMALIZED EFFECTIVE TRANSIENT
THERMAL RESISTANCE
2
1
0.1
DUTY CYCLE-DESCENDING ORDER
D = 0.5
0.2
0.1
0.05
0.02
0.01
PDM
t1
t2
0.01
NOTES:
ZθJC(t) = r(t) x RθJC
RθJC = 0.5 oC/W
Peak TJ = PDM x ZθJC(t) + TC
Duty Cycle, D = t1 / t2
SINGLE PULSE
0.001
-5
10
-4
10
-3
-2
10
10
-1
10
1
t, RECTANGULAR PULSE DURATION (sec)
Figure 12. Junction-to-Case Transient Thermal Response Curve
©2015 Fairchild Semiconductor Corporation
FDB0165N807L Rev.C
5
www.fairchildsemi.com
FDB0165N807L N-Channel PowerTrench® MOSFET
Typical Characteristics TJ = 25 °C unless otherwise noted.
10.20
9.70
A
1.40
1.00
10.50
8.40
9.40
9.00
10.20
1.40 MAX C
3.45
0.73
1
7
0.95
0.90
0.70
(1.27) 6X
1.27 6X
7.62
0.70
C
0.50
LAND PATTERN RECOMMENDATION
0.25 A M
7.62
B
8.78
8.38
1.40
1.20
4.70
4.30
7.70 MIN
8
C
1
7
0.60
0.40
0.254
0.20 MAX
GAGE PLANE
NOTES:
C OUT OF JEDEC STANDARD VALUE.
D. DIMENSION AND TOLERANCE AS PER ASME
Y14.5-1994.
E. DIMENSIONS ARE EXCLUSIVE OF BURRS,
MOLD FLASH AND TIE BAR PROTRUSIONS.
F. LAND PATTERN RECOMMENDATION PER IPC.
TO127P1524X465-8N.
G. DRAWING FILE NAME: TO263A07REV5.
5.20
4.80
R0.50
2.84
2.44
A
A. PACKAGE CONFORMS TO JEDEC TO-263
VARIATION CB EXCEPT WHERE NOTED.
B. ALL DIMENSIONS ARE IN MILLIMETERS.
SEATING PLANE
C
15.70
15.10
0.20 B
0 - 8°
DETAIL A
SCALE 2:1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
© Semiconductor Components Industries, LLC
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
www.onsemi.com
1
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
www.onsemi.com