FDB0630N1507L

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This literature is subject to all applicable copyright laws and is not for resale in any manner. FDB0630N1507L N-Channel PowerTrench® MOSFET 150 V, 130 A, 6.4 mΩ Features General Description This N-Channel MOSFET is produced using Fairchild Semiconductor’s advance PowerTrench® process that has been especially tailored to minimize the on-state resistance while maintaining superior ruggedness and switching performance for industrial applications. „ Max rDS(on) = 6.4 mΩ at VGS = 10 V, ID = 18 A „ Fast Switching Speed „ Low Gate Charge „ High Performance Trench Technology for Extremely Low RDS(on) Applications „ High Power and Current Handling Capability „ Industrial Motor Drive „ Industrial Power Supply „ RoHS Compliant „ Industrial Automation „ Battery Operated tools „ Battery Protection „ Solar Inverters „ UPS and Energy Inverters „ Energy Storage „ Load Switch D(Pin4, tab) 4 12 3 56 7 1. Gate 2. Source/Kelvin Sense 3. Source/Kelvin Sense 4. Drain 5. Source 6. Source 7. Source G (Pin1) D2-PAK (TO263) S(Pin2,3,5,6,7) MOSFET Maximum Ratings TC = 25 °C unless otherwise noted. Symbol VDS Drain to Source Voltage Parameter VGS Gate to Source Voltage Drain Current -Continuous ID -Continuous PD TJ, TSTG Units V ±20 V TC = 25°C (Note 5) TC = 100°C (Note 5) 90 (Note 4) 720 -Pulsed EAS Ratings 150 Single Pulse Avalanche Energy (Note 3) Power Dissipation TC = 25°C Power Dissipation TA = 25°C 130 693 300 (Note 1a) Operating and Storage Junction Temperature Range 3.8 -55 to +150 A mJ W °C Thermal Characteristics RθJC Thermal Resistance, Junction to Case RθJA Thermal Resistance, Junction to Ambient (Note 1) 0.5 (Note 1a) 40 °C/W Package Marking and Ordering Information Device Marking FDB0630N1507L Device FDB0630N1507L ©2015 Fairchild Semiconductor Corporation FDB0630N1507L Rev.1.1 Package D2-PAK-7L 1 Reel Size 330mm Tape Width 24mm Quantity 800 units www.fairchildsemi.com FDB0630N1507L N-Channel PowerTrench® MOSFET September 2016 Symbol Parameter Test Conditions Min. Typ. Max. Units Off Characteristics BVDSS Drain to Source Breakdown Voltage ID = 250 μA, VGS = 0 V ΔBVDSS ΔTJ Breakdown Voltage Temperature Coefficient ID = 250 μA, referenced to 25 °C IDSS Zero Gate Voltage Drain Current VDS = 120 V, VGS = 0 V 1 μA IGSS Gate to Source Leakage Current VGS = ±20 V, VDS = 0 V ±100 nA 4 V 150 V 92 mV/°C On Characteristics VGS(th) Gate to Source Threshold Voltage VGS = VDS, ID = 250 μA ΔVGS(th) ΔTJ Gate to Source Threshold Voltage Temperature Coefficient ID = 250 μA, referenced to 25 °C -13 rDS(on) Static Drain to Source On Resistance VGS = 10 V, ID = 18 A 4.9 gFS Forward Transconductance VDS = 10 V, ID = 18 A 63 2 2.9 mV/°C 6.4 mΩ S Dynamic Characteristics Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance Rg Gate Resistance VDS = 75 V, VGS = 0 V, f = 1 MHz 7065 9895 pF 552 775 pF 27 50 pF Ω 2.5 Switching Characteristics td(on) Turn-On Delay Time tr Rise Time td(off) Turn-Off Delay Time tf Fall Time Qg Total Gate Charge Qgs Gate to Source Gate Charge Qgd Gate to Drain “Miller” Charge VDD = 75 V, ID = 18 A, VGS = 10 V, RGEN = 6 Ω VDD = 75 V, ID = 18 A, VGS = 10 V 33 52 ns 31 53 ns 60 96 ns 17 30 ns 97 135 nC 30 nC 17 nC Drain-Source Diode Characteristics IS Maximum Continuous Drain to Source Diode Forward Current 130 A ISM Maximum Pulsed Drain to Source Diode Forward Current 720 A VSD Source to Drain Diode Forward Voltage trr Reverse Recovery Time Qrr Reverse Recovery Charge VGS = 0 V, IS = 18 A (Note 2) IF = 18 A, di/dt = 100 A/μs 0.8 1.2 V 107 172 ns 229 366 nC Notes: 1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design. a) 40 °C/W when mounted on a 1 in2 pad of 2 oz copper. b) 62.5 °C/W when mounted on a minimum pad of 2 oz copper. 2. Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0 %. 3. EAS of 693 is based on starting TJ = 25 °C, L = 0.3 mH, IAS = 68 A, VDD = 135 V, VGS = 10 V. 100% test at L = 0.1 mH, IAS = 99 A. 4. Pulsed Id please refer to Figure “Forward Bias Safe Operating Area” for more details. 5. Computed continuous current limited to Max Junction Temperature only, actual continuous current will be limited by thermal & electro-mechanical application board design. ©2015 Fairchild Semiconductor Corporation FDB0630N1507L Rev.1.1 2 www.fairchildsemi.com FDB0630N1507L N-Channel PowerTrench® MOSFET Electrical Characteristics TJ = 25 °C unless otherwise noted. 3 VGS = 10 V NORMALIZED DRAIN TO SOURCE ON-RESISTANCE ID, DRAIN CURRENT (A) 200 VGS = 8 V 150 VGS = 7 V VGS = 6.5 V 100 VGS = 6 V 50 PULSE DURATION = 80 μs DUTY CYCLE = 0.5% MAX 0 0 1 2 2 1 VGS = 7 V 0 3 Figure 1. On Region Characteristics 0 50 100 ID, DRAIN CURRENT (A) rDS(on), DRAIN TO 1.5 1.0 0.5 SOURCE ON-RESISTANCE (mΩ) NORMALIZED DRAIN TO SOURCE ON-RESISTANCE 60 2.0 0.0 -75 -50 -25 0 25 50 75 100 125 150 175 TJ, JUNCTION TEMPERATURE (oC) IS, REVERSE DRAIN CURRENT (A) ID, DRAIN CURRENT (A) VDS = 5 V TJ = 175 oC oC 50 TJ = -55 oC 0 2 3 4 5 6 40 30 20 TJ = 150 oC 10 TJ = 25 oC 3 4 5 6 7 8 9 200 100 VGS = 0 V 10 TJ = 175 oC 1 TJ = 25 oC 0.1 0.01 TJ = -55 oC 0.001 0.0 7 0.2 0.4 0.6 0.8 1.0 VGS, GATE TO SOURCE VOLTAGE (V) VSD, BODY DIODE FORWARD VOLTAGE (V) Figure 5. Transfer Characteristics Figure 6. Source to Drain Diode Forward Voltage vs. Source Current ©2015 Fairchild Semiconductor Corporation FDB0630N1507L Rev.1.1 10 Figure 4. On-Resistance vs. Gate to Source Voltage PULSE DURATION = 80 μs DUTY CYCLE = 0.5% MAX TJ = 25 ID = 18 A VGS, GATE TO SOURCE VOLTAGE (V) 200 100 200 PULSE DURATION = 80 μs DUTY CYCLE = 0.5% MAX 50 0 Figure 3. Normalized On Resistance vs. Junction Temperature 150 150 Figure 2. Normalized On-Resistance vs. Drain Current and Gate Voltage ID = 18 A VGS = 10 V 2.5 VGS = 10 V VGS = 8 V PULSE DURATION = 80 μs DUTY CYCLE = 0.5% MAX VDS, DRAIN TO SOURCE VOLTAGE (V) 3.0 VGS = 6.5 V VGS = 6 V 3 1.2 www.fairchildsemi.com FDB0630N1507L N-Channel PowerTrench® MOSFET Typical Characteristics TJ = 25 °C unless otherwise noted. 10000 ID = 18 A Ciss VDD = 50 V 8 CAPACITANCE (pF) VGS, GATE TO SOURCE VOLTAGE (V) 10 VDD = 75 V 6 VDD = 100 V 4 1000 Coss 100 2 0 0 20 40 60 80 10 0.1 100 1 10 100 VDS, DRAIN TO SOURCE VOLTAGE (V) Qg, GATE CHARGE (nC) Figure 7. Gate Charge Characteristics Figure 8. Capacitance vs. Drain to Source Voltage 1000 1000 10 μs ID, DRAIN CURRENT (A) IAS, AVALANCHE CURRENT (A) Crss f = 1 MHz VGS = 0 V 100 TJ = 25 oC 10 TJ = 150 oC 1 0.001 0.01 0.1 1 100 100 μs 10 THIS AREA IS LIMITED BY rDS(on) RθJC = 0.5 oC/W 10 100 0.1 0.1 1000 1 ms SINGLE PULSE TJ = MAX RATED 1 TC = 25 oC 1 tAV, TIME IN AVALANCHE (ms) 10 ms CURVE BENT TO MEASURED DATA 10 100 ms/DC 100 1000 VDS, DRAIN to SOURCE VOLTAGE (V) Figure 10. Forward Bias Safe Operating Area Figure 9. Unclamped Inductive Switching Capability 5 P(PK), PEAK TRANSIENT POWER (W) 10 SINGLE PULSE o RθJC = 0.5 C/W o TC = 25 C 4 10 3 10 2 10 -5 10 -4 10 -3 -2 10 10 -1 10 1 t, PULSE WIDTH (sec) Figure 11. Single Pulse Maximum Power Dissipation ©2015 Fairchild Semiconductor Corporation FDB0630N1507L Rev.1.1 4 www.fairchildsemi.com FDB0630N1507L N-Channel PowerTrench® MOSFET Typical Characteristics TJ = 25 °C unless otherwise noted. r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE 2 1 0.1 DUTY CYCLE-DESCENDING ORDER D = 0.5 0.2 0.1 0.05 0.02 0.01 PDM t1 t2 0.01 NOTES: SINGLE PULSE 0.001 -5 10 -4 10 ZθJC(t) = r(t) x RθJC RθJC = 0.5 oC/W Peak TJ = PDM x ZθJC(t) + TC Duty Cycle, D = t1 / t2 -3 -2 10 10 -1 10 1 t, RECTANGULAR PULSE DURATION (sec) Figure 12. Junction-to-Case Transient Thermal Response Curve ©2015 Fairchild Semiconductor Corporation FDB0630N1507L Rev.1.1 5 www.fairchildsemi.com FDB0630N1507L N-Channel PowerTrench® MOSFET Typical Characteristics TJ = 25 °C unless otherwise noted. 10.20 9.70 A 1.40 1.00 10.50 8.40 9.40 9.00 10.20 1.40 MAX C 3.45 0.73 1 7 0.95 0.90 0.70 (1.27) 6X 1.27 6X 7.62 0.70 C 0.50 LAND PATTERN RECOMMENDATION 0.25 A M 7.62 B 8.78 8.38 1.40 1.20 4.70 4.30 7.70 MIN 8 C 1 7 0.60 0.40 0.254 0.20 MAX GAGE PLANE NOTES: C OUT OF JEDEC STANDARD VALUE. D. DIMENSION AND TOLERANCE AS PER ASME Y14.5-1994. E. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH AND TIE BAR PROTRUSIONS. F. LAND PATTERN RECOMMENDATION PER IPC. TO127P1524X465-8N. G. DRAWING FILE NAME: TO263A07REV5. 5.20 4.80 R0.50 2.84 2.44 A A. PACKAGE CONFORMS TO JEDEC TO-263 VARIATION CB EXCEPT WHERE NOTED. B. ALL DIMENSIONS ARE IN MILLIMETERS. SEATING PLANE C 15.70 15.10 0.20 B 0 - 8° DETAIL A SCALE 2:1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 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