FDBL86563_F085

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Other names and brands may be claimed as the property of others. FDBL86563-F085 N-Channel PowerTrench® MOSFET FDBL86563-F085 N-Channel PowerTrench® MOSFET 60 V, 240 A, 1.5 mΩ Features D „ Typical RDS(on) = 1.1 mΩ at VGS = 10V, ID = 80 A „ Typical Qg(tot) = 130 nC at VGS = 10V, ID = 80 A „ UIS Capability „ RoHS Compliant G „ Qualified to AEC Q101 Applications S „ Automotive Engine Control „ PowerTrain Management „ Solenoid and Motor Drivers „ Integrated Starter/Alternator „ Primary Switch for 12V Systems MOSFET Maximum Ratings TJ = 25°C unless otherwise noted. Symbol VDSS Drain-to-Source Voltage VGS ID EAS PD Parameter Ratings 60 Units V ±20 V Gate-to-Source Voltage Drain Current - Continuous (VGS=10) (Note 1) TC = 25°C 240 Pulsed Drain Current TC = 25°C See Figure 4 Single Pulse Avalanche Energy (Note 2) 614 A mJ Power Dissipation 357 W Derate Above 25oC 2.38 W/oC TJ, TSTG Operating and Storage Temperature RθJC Thermal Resistance, Junction to Case RθJA Maximum Thermal Resistance, Junction to Ambient -55 to + 175 oC 0.42 oC/W 43 oC/W (Note 3) Notes: 1: Current is limited by silicon. 2: Starting TJ = 25°C, L = 0.3mH, IAS = 64A, VDD = 60V during inductor charging and VDD = 0V during time in avalanche. 3: RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance, where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design, while RθJAis determined by the board design. The maximum rating presented here is based on mounting on a 1 in2 pad of 2oz copper. Package Marking and Ordering Information Device Marking FDBL86563 Device FDBL86563-F085 ©2015 Semiconductor Components Industries, LLC. August-2017, Rev. 2 Package MO-299A Reel Size 13" 1 Tape Width 24mm Quantity 2000 units Publication Order Number: FDBL86563-F085/D Symbol Parameter Test Conditions Min. Typ. Max. Units Off Characteristics BVDSS Drain-to-Source Breakdown Voltage IDSS Drain-to-Source Leakage Current IGSS Gate-to-Source Leakage Current ID = 250μA, VGS = 0V VDS = 60V, VGS = 0V 60 - - V - - 1 μA - - 1 mA - - ±100 nA TJ = 25oC TJ = 175oC (Note 4) VGS = ±20V On Characteristics VGS(th) RDS(on) Gate to Source Threshold Voltage Drain to Source On Resistance VGS = VDS, ID = 250μA ID = 80A, VGS= 10V 2.0 2.9 4.0 V - 1.1 1.5 mΩ - 2.1 2.9 mΩ TJ = 25oC TJ = 175oC (Note 4) Dynamic Characteristics Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance Rg Gate Resistance f = 1MHz Qg(ToT) Total Gate Charge at 10V VGS = 0 to 10V Qg(th) Threshold Gate Charge VGS = 0 to 2V Qgs Gate-to-Source Gate Charge Qgd Gate-to-Drain “Miller“ Charge VDS = 30V, VGS = 0V, f = 1MHz VDD = 48V ID = 80A - 10300 - pF - 2590 - pF - 270 - pF - 4.3 - Ω - 130 169 nC - 19 - nC - 48 - nC - 20 - nC ns Switching Characteristics ton Turn-On Time - - 160 td(on) Turn-On Delay - 30 - ns tr Rise Time - 77 - ns td(off) Turn-Off Delay - 78 - ns tf Fall Time - 57 - ns toff Turn-Off Time - - 200 ns ISD =80A, VGS = 0V - - 1.25 V ISD = 40A, VGS = 0V - - 1.2 V IF = 80A, dISD/dt = 100A/μs, VDD=48V - 94 140 ns - 131 200 nC VDD = 30V, ID = 80A, VGS = 10V, RGEN = 6Ω Drain-Source Diode Characteristics VSD Source-to-Drain Diode Voltage trr Reverse-Recovery Time Qrr Reverse-Recovery Charge Note: 4: The maximum value is specified by design at TJ = 175°C. Product is not tested to this condition in production. www.onsemi.com 2 FDBL86563-F085 N-Channel PowerTrench® MOSFET Electrical Characteristics TJ = 25°C unless otherwise noted. 1.0 0.8 0.6 0.4 0.2 0.0 VGS = 10V 350 ID, DRAIN CURRENT (A) POWER DISSIPATION MULTIPLIER 400 1.2 CURRENT LIMITED BY SILICON 300 250 200 150 100 50 0 25 50 75 100 125 150 TC, CASE TEMPERATURE(oC) 0 175 Figure 1. Normalized Power Dissipation vs. Case Temperature 25 50 75 100 125 150 175 TC, CASE TEMPERATURE(oC) 200 Figure 2. Maximum Continuous Drain Current vs. Case Temperature NORMALIZED THERMAL IMPEDANCE, ZθJC 2 DUTY CYCLE - DESCENDING ORDER 1 D = 0.50 0.20 0.10 0.05 0.02 0.01 0.1 PDM t1 t2 NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ = PDM x ZθJA x RθJA + TC SINGLE PULSE 0.01 -5 10 -4 10 -3 -2 -1 0 10 10 10 t, RECTANGULAR PULSE DURATION(s) 1 10 10 Figure 3. Normalized Maximum Transient Thermal Impedance 10000 TC = 25oC IDM, PEAK CURRENT (A) VGS = 10V FOR TEMPERATURES ABOVE 25oC DERATE PEAK CURRENT AS FOLLOWS: 1000 175 - TC I = I2 150 100 SINGLE PULSE 10 -5 10 -4 10 -3 -2 -1 10 10 10 t, RECTANGULAR PULSE DURATION(s) Figure 4. Peak Current Capability www.onsemi.com 3 0 10 1 10 FDBL86563-F085 N-Channel PowerTrench® MOSFET Typical Characteristics 2000 1000 If R = 0 tAV = (L)(IAS)/(1.3*RATED BVDSS - VDD) If R ≠ 0 tAV = (L/R)ln[(IAS*R)/(1.3*RATED BVDSS - VDD) +1] IAS, AVALANCHE CURRENT (A) ID, DRAIN CURRENT (A) 1000 100 100us 10 OPERATION IN THIS AREA MAY BE LIMITED BY rDS(on) 1 1ms 10ms 100ms SINGLE PULSE TJ = MAX RATED TC = 25oC 0.1 0.1 1 10 100 200 VDS, DRAIN TO SOURCE VOLTAGE (V) Figure 5. Forward Bias Safe Operating Area 350 250 TJ = 25oC 150 100 TJ = 175oC TJ = -55oC 50 0 2 3 4 5 6 7 VGS, GATE TO SOURCE VOLTAGE (V) 100 1000 10000 TJ = 175 oC 10 TJ = 25 oC 1 0.2 0.4 0.6 0.8 1.0 1.2 VSD, BODY DIODE FORWARD VOLTAGE (V) Figure 8. Forward Diode Characteristics 350 VGS 150 80μs PULSE WIDTH Tj=25oC 100 10 VGS = 0 V 100 0.1 0.0 ID, DRAIN CURRENT (A) ID, DRAIN CURRENT (A) 200 1 Figure 6. Unclamped Inductive Switching Capability 8 15V Top 10V 8V 7V 6V 5.5V 5V Bottom 250 0.1 NOTE: Refer to ON Semiconductor Application Notes AN7514 and AN7515 VGS 300 0.01 tAV, TIME IN AVALANCHE (ms) Figure 7. Transfer Characteristics 350 STARTING TJ = 150oC 1 0.001 IS, REVERSE DRAIN CURRENT (A) ID, DRAIN CURRENT (A) VDD = 5V 200 STARTING TJ = 25oC 10 350 PULSE DURATION = 80μs DUTY CYCLE = 0.5% MAX 300 100 50 300 15V Top 10V 8V 7V 6V 5.5V 5V Bottom 250 200 150 100 80μs PULSE WIDTH Tj=175oC 50 0 0 0 1 2 3 4 VDS, DRAIN TO SOURCE VOLTAGE (V) 5 Figure 9. Saturation Characteristics 0 1 2 3 4 VDS, DRAIN TO SOURCE VOLTAGE (V) Figure 10. Saturation Characteristics www.onsemi.com 4 5 FDBL86563-F085 N-Channel PowerTrench® MOSFET Typical Characteristics ID = 80A NORMALIZED DRAIN TO SOURCE ON-RESISTANCE rDS(on), DRAIN TO SOURCE ON-RESISTANCE (mΩ) 50 PULSE DURATION = 80μs DUTY CYCLE = 0.5% MAX 40 30 20 TJ = 175oC TJ = 25oC 10 0 2 4 6 8 VGS, GATE TO SOURCE VOLTAGE (V) 10 Figure 11. RDSON vs. Gate Voltage 2.0 1.6 1.2 0.8 ID = 80A VGS = 10V 0.4 -80 -40 0 40 80 120 160 TJ, JUNCTION TEMPERATURE(oC) 200 Figure 12. Normalized RDSON vs. Junction Temperature 1.10 VGS = VDS ID = 250μA 1.2 ID = 5mA 1.05 0.9 1.00 0.6 0.95 0.3 0.0 -80 -40 0 40 80 120 160 TJ, JUNCTION TEMPERATURE(oC) Ciss 1000 Coss Crss 100 f = 1MHz VGS = 0V 10 0.1 1 10 VDS, DRAIN TO SOURCE VOLTAGE (V) 100 Figure 15. Capacitance vs. Drain to Source Voltage -40 0 40 80 120 160 TJ, JUNCTION TEMPERATURE (oC) 200 Figure 14. Normalized Drain to Source Breakdown Voltage vs. Junction Temperature VGS, GATE TO SOURCE VOLTAGE(V) 100000 10000 0.90 -80 200 Figure 13. Normalized Gate Threshold Voltage vs. Temperature CAPACITANCE (pF) PULSE DURATION = 80μs DUTY CYCLE = 0.5% MAX NORMALIZED DRAIN TO SOURCE BREAKDOWN VOLTAGE NORMALIZED GATE THRESHOLD VOLTAGE 1.5 2.4 10 ID = 80A VDD = 30V 8 VDD =24V VDD = 36V 6 4 2 0 0 30 60 90 120 Qg, GATE CHARGE(nC) 150 Figure 16. Gate Charge vs. Gate to Source Voltage www.onsemi.com 5 FDBL86563-F085 N-Channel PowerTrench® MOSFET Typical Characteristics ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. 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