FDC6325L

DATA SHEET www.onsemi.com Integrated Load Switch FDC6325L 1 TSOT23 6−Lead CASE 419BL General Description This device is particularly suited for compact power management in portable electronic equipment where 2.5 V to 8 V input and 1.8 A output current capability are needed. This load switch integrates a small N−Channel power MOSFET (Q1) which drives a large P−Channel power MOSFET (Q2) in one tiny SUPERSOTt−6 package. MARKING DIAGRAM XXX MG G Features 1 • VDROP = 0.2 V @ VIN = 5 V, IL = 1.5 A, R(ON) = 0.13 W • • VDROP = 0.2 V @ VIN = 3.3 V, IL = 1.2 A, R(ON) = 0.16 W VDROP = 0.2 V @ VIN = 2.5 V, IL = 1 A, R(ON) = 0.18 W SUPERSOTt−6 Package Design Using Copper Lead Frame for Superior Thermal and Electrical Capabilities This is a Pb−Free Device ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Symbol Parameter Ratings Unit VIN Input Voltage Range 2.8 − 8 V VON/OFF On/Off Voltage Range 1.5 − 8 V Continuous (Note 1) 1.8 A Pulsed (Notes 1 & 3) 5 IL PD TJ, TSTG ESD Load Current Maximum Power Dissipation (Note 2) Operating and Storage Temperature Range Electrostatic Discharge Rating MIL−STD−883D Human Body Model (100 pF / 1500 W) 0.7 W −55 to 150 °C 6 kV THERMAL CHARACTERISTICS Symbol Parameter Ratings Unit RqJA Thermal Resistance, Junction−to−Ambient (Note 2) 180 °C/W RqJC Thermal Resistance, Junction−to−Case (Note 2) 60 °C/W March, 2022 − Rev. 5 PINOUT Vin,R1 4 ON/OFF 5 1 3 Vout,C1 2 Vout,C1 1 R2 Q2 Q1 R1,C1 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. VIN = 8 V, VON/OFF = 8 V, TA = 25°C 2. RqJA is the sum of the junction−to−case and case−to−ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RqJC is guaranteed by design while RqCA is determined by the user’s board design. © Semiconductor Components Industries, LLC, 1998 XXX = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) 6 (See Application Circuit) EQUIVALENT CIRCUIT VDROP + IN − OUT ON/OFF ORDERING INFORMATION See detailed ordering and shipping information on page 2 of this data sheet. Publication Order Number: FDC6325L/D FDC6325L ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Parameter Symbol Conditions Min Typ Max Unit 1 mA V OFF CHARACTERISTICS IFL Forward Leakage Current VIN = 8 V, VON/OFF = 0 V ON CHARACTERISTICS (Note 3) VDROP R(ON) Conduction Voltage Drop Q2 − Static On−Resistance VIN = 5 V, VON/OFF = 3.3 V, IL = 1.5 A 0.15 0.2 VIN = 3.3 V, VON/OFF = 3.3 V, IL = 1.2 A 0.145 0.2 VIN = 2.5 V, VON/OFF = 3.3 V, IL = 1 A 0.13 0.2 VGS = −5 V, ID = −1.8 A 0.115 0.13 VGS = −3.3 V, ID = −1.6 A 0.13 0.16 0.155 0.18 VGS = −2.5 V, ID = −1.5 A IL Load Current VDROP = 0.13 V, VIN = 5 V, VON/OFF = 3.3 V 1 VDROP = 0.16 V, VIN = 3.3 V, VON/OFF = 3.3 V 1 VDROP = 0.2 V, VIN = 2.5 V, VON/OFF = 3.3 V 1 W A Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Pulse Test: Pulse Width ≤ 300 ms, Duty cycle ≤ 2.0 %. ORDERING INFORMATION Device Device Marking Package Type Shipping† FDC6325L .325 TSOT−23−6 (Pb−free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. FDC6325L Load Switch Application Q2 IN OUT C1 R1 Ci ON/OFF Q1 Co LOAD R2 Figure 1. Application Circuit External Component Recommendation For Co £ 1 mF applications: First select R2, 100 − 1 kW, for Slew Rate control. C1 £ 1000 pF can be added in addition to R2 for further In−rush current control. Then select R1 such that R1/R2 ratio maintains between 10 − 100. R1 is required to turn Q2 off. For SPICE simulation, users can download a “FDC6325L.MOD” Spice model from onsemi Web Site at www.onsemi.com www.onsemi.com 2 FDC6325L TYPICAL ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) 0.5 0.5 0.4 TA = 125°C VDROP, (V) VDROP, (V) 0.4 0.3 TA = 25°C 0.2 VIN = 5 V VON/OFF = 1.5 − 8 V PW = 300 ms, D ≤ 2% 0.1 0 0 1 2 3 TA = 125°C 0.3 TA = 25°C 0.2 VIN = 3.3 V VON/OFF = 1.5 − 8 V PW = 300 ms, D ≤ 2% 0.1 0 4 0 1 2 IL, (A) 4 Figure 2. Conduction Voltage Drop Variation with Load Current 0.5 0.6 VDROP, (V) / RON, (W) Figure 1. Conduction Voltage Drop Variation with Load Current 0.4 VDROP, (V) 3 IL, (A) TA = 125°C 0.3 TA = 25°C 0.2 VIN = 2.5 V VON/OFF = 1.5 − 8 V PW = 300 ms, D ≤ 2% 0.1 0 0 1 2 3 IL = 1 A VON/OFF = 1.5 − 8 V PW = 300 ms, D ≤ 2% 0.5 0.4 0.3 TA = 125°C 0.2 0.1 TA = 25°C 0 1 4 2 IL, (A) r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE Figure 3. Conduction Voltage Drop Variation with Load Current 3 VIN, (V) 4 5 Figure 4. On−Resistance Variation with Input Voltage 1 0.5 D = 0.5 0.2 0.2 0.1 0.05 0.02 0.01 RθJA  (t) = r(t) * RθJA RθJA = See Note 2 0.1 P(pk) 0.05 t1 0.02 0.01 t2 TJ − TA = P * R θJA (t) Single Pulse Duty Cycle, D = t 1 / t2 0.005 0.00001 0.0001 0.001 0.01 0.1 1 10 100 300 t 1, TIME (s) Figure 5. Transient Thermal Response Curve Note: Thermal characterization performed using the conditions described in Note 2. Transient thermal response will change depending on the circuit board design. SUPERSOT is a trademark of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. www.onsemi.com 3 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSOT23 6−Lead CASE 419BL ISSUE A 1 SCALE 2:1 DATE 31 AUG 2020 GENERIC MARKING DIAGRAM* XXX MG G 1 XXX = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Some products may not follow the Generic Marking. DOCUMENT NUMBER: DESCRIPTION: 98AON83292G TSOT23 6−Lead Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. 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