November 1998
FDC6329L
Integrated Load Switch
General Description
Features
VDROP=0.2V @ VIN=5V, IL=2.8A. R(ON) = 0.07Ω VDROP=0.2V
@ VIN=2.5V, IL=1.9A. R(ON) = 0.105Ω.
This device is particularly suited for compact power
management in portable electronic equipment where
2.5V to 8V input and 2.5A output current capability are
needed. This load switch integrates a small N-Channel
power MOSFET (Q1) which drives a large P-Channel
power MOSFET (Q2) in one tiny SuperSOTTM-6
package.
Control MOSFET (Q1) includes Zener protection for ESD
ruggedness (>6KV Human Body Model).
High performance trench technology for extremely low
on-resistance.
SuperSOTTM-6 package design using copper lead frame for
superior thermal and electrical capabilities.
SOT-23
SuperSOTTM-6
SuperSOTTM-8
SO-8
SOIC-16
SOT-223
EQUIVALENT CIRCUIT
V IN , R1
9
.32
3
4
VOUT , C1
Q2
VON/OFF
5
2
VOUT , C1
1
R2
Q1
R1 , C1
+
IN
6
V DROP
-
OUT
O N / O FF
pin 1
TM
SuperSOT -6
See Application Circuit
Absolute Maximum Ratings
Symbol
TA = 25°C unless otherwise noted
Parameter
VIN
Input Voltage Range
VON/OFF
On/Off Voltage Range
IL
Load Current
(Note 1)
- Continuous
(Note 2)
- Pulsed
FDC6329L
Units
2.5 - 8
V
1.5 - 8
V
2.5
A
10
PD
Maximum Power Dissipation
TJ,TSTG
Operating and Storage Temperature Range
ESD
Electrostatic Discharge Rating MIL-STD-883D Human Body
Model (100pf/1500Ohm)
(Note 2)
0.7
W
-55 to 150
°C
6
kV
THERMAL CHARACTERISTICS
RθJA
Thermal Resistance, Junction-to-Ambient
(Note 2)
180
°C/W
RθJC
Thermal Resistance, Junction-to-Case
(Note 2)
60
°C/W
FDC6329L Rev.C
Electrical Characteristics (T
Symbol
A
Parameter
= 25°C unless otherwise noted)
Conditions
Min
Typ
Max
Units
1
µA
0.2
V
OFF CHARACTERISTICS
IFL
Forward Leakage Current
VIN = 8 V, VON/OFF = 0 V
ON CHARACTERISTICS (Note 3)
VDROP
Conduction Voltage
R(ON)
Q2 - Static On-Resistance
IL
Load Current
VIN = 5 V, VON/OFF = 3.3 V, IL = 2.8 A
0.12
VIN = 2.5 V, VON/OFF = 3.3 V, IL = 1.9 A
0.14
0.2
VGS = -5 V, ID = -2.5 A
0.047
0.07
VGS = -2.5 V, ID = -2.0 A
0.073
0.105
VDROP = 0.2 V, VIN = 5 V, VON/OFF = 3.3 V
2.8
VDROP = 0.2 V, VIN = 2.5V, VON/OFF = 3.3 V
1.9
Ω
A
Notes:
1. Range of Vin can be up to 8V, but R1 and R2 must be scaled such that VGS of Q2 does not exceed -8V.
2.
RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by
design while RθCA is determined by the user's board design.
3. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.
FDC6329L Load Switch Application
External Component Recommendation:
For applications where Co ≤ 1µF.
For slew rate control, select R2 in the range of 1k - 4.7kΩ .
For additional in-rush current control, C1 ≤ 1000pF can be added.
Select R1 so that the R1/R2 ratio ranges from 10 - 100. R1 is required to turn Q2 off.
FDC6329L Rev.C
Typical Electrical Characteristics (TA = 25 OC unless otherwise noted )
0.2
0.2
V IN = 5V
VON/OFF = 1.5 - 8V
PW =300us, D≤ 2%
TJ = 125°C
0.15
0.15
VDROP , (V)
VDROP ,(V)
TJ = 125°C
0.1
T = 25°C
J
0.1
0.05
0.05
0
T = 25°C
J
0
0
0.6
1.2
1.8
2.4
3
V IN = 2.5V
VON/OFF = 1.5 - 8V
PW =300us, D≤ 2%
0
0.6
1.2
1.8
2.4
3
I L , (A)
I L , (A)
Figure 1. Conduction Voltage Drop
Variation with Load Current.
Figure 2. Conduction Voltage Drop
Variation with Load Current.
0.2
I L = 1A
VON/OFF = 1.5 - 8V
PW =300us, D≤ 2%
R (ON) ,(Ohm)
0.16
0.12
0.08
T = 125°C
J
0.04
25°C
0
1
2
3
4
5
VIN , (V)
r(t), NORMALIZED EFFECTIVE
TRANSIENT THERMAL RESISTANCE
Figure 3. On-Resistance Variation
with Input Voltage.
1
0.5
D = 0.5
0.2
0.2
0.1
0.05
0.02
0.01
RθJA (t) = r(t) * R θJA
RθJA = See Note 2
0.1
P(pk)
0.05
t1
0.02
0.01
t2
TJ - TA = P * R θJA(t)
Duty Cycle, D = t 1/ t 2
Single Pulse
0.005
0.00001
0.0001
0.001
0.01
0.1
1
10
100
300
t 1, TIME (sec)
Figure 4. Transient Thermal Response Curve.
Thermal characterization performed using the conditions described in Note 2.
Transient thermal response will change depending on the circuit board design.
FDC6329L Rev.C
SuperSOTTM-6 Tape and Reel Data and Package Dimensions
SSOT-6 Packaging
Configuration: Figure 1.0
Customize Label
Antistatic Cover Tape
Conductive Embossed
Carrier Tape
F63TNR
Label
631
Packaging Option
Packaging type
Standard
(no flow code)
TNR
Qty per Reel/Tube/Bag
3,000
Reel Size
631
631
D87Z
SSOT-6 Unit Orientation
TNR
10,000
7” Dia
13”
184x187x47
343x343x64
Max qty per Box
9,000
20,000
Weight per unit (gm)
0.0158
0.0158
Weight per Reel (kg)
0.1440
0.4700
Box Dimension (mm)
631
Pin 1
SSOT-6 Packaging Information
343mm x 342mm x 64mm
Intermediate box for D87Z Option
F63TNR Label
Note/Comments
F63TNR
Label
F63TNR Label sample
184mm x 184mm x 47mm
Pizza Box for Standard Option
F63TNR
Label
LOT: CBVK741B019
QTY: 3000
FSID: FDC633N
SPEC:
D/C1: D9842
D/C2:
Trailer
SSOT-6 Tape Leader
Configuration: Figure 2.0
QTY1:
QTY2:
SPEC REV:
CPN:
QARV:
(F63TNR)2
Carrier Tape
Cover Tape
1998 Fairchild Semiconductor Corporation
Trailer Tape
160mm minimum
Components
Leader Tape
390mm minimum
December 1998, Rev. B
SuperSOTTM-6 Tape and Reel Data and Package Dimensions, continued
SSOT-6 Embossed Carrier Tape
Configuration: Figure 3.0
P0
D0
T
E1
F
K0
Wc
W
E2
B0
Tc
A0
D1
P1
User Direction of Feed
Dimensions are in millimeter
Pkg type
A0
B0
SSOT-6
(8mm)
3.23
+/-0.10
3.18
+/-0.10
W
8.0
+/-0.3
D0
D1
E1
E2
1.55
+/-0.05
1.00
+/-0.125
1.75
+/-0.10
F
6.25
min
3.50
+/-0.05
P1
P0
4.0
+/-0.1
4.0
+/-0.1
K0
T
1.37
+/-0.10
0.255
+/-0.150
Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481
rotational and lateral movement requirements (see sketches A, B, and C).
Wc
0.06
+/-0.02
0.5mm
maximum
20 deg maximum
Typical
component
cavity
center line
B0
5.2
+/-0.3
Tc
0.5mm
maximum
20 deg maximum component rotation
Typical
component
center line
Sketch A (Side or Front Sectional View)
A0
Component Rotation
Sketch C (Top View)
Component lateral movement
Sketch B (Top View)
SSOT-6 Reel Configuration: Figure 4.0
Component Rotation
W1 Measured at Hub
Dim A
Max
Dim A
max
See detail AA
Dim N
7” Diameter Option
B Min
Dim C
See detail AA
W3
13” Diameter Option
Dim D
min
W2 max Measured at Hub
DETAIL AA
Dimensions are in inches and millimeters
Tape Size
Reel
Option
Dim A
Dim B
0.059
1.5
512 +0.020/-0.008
13 +0.5/-0.2
0.795
20.2
2.165
55
0.331 +0.059/-0.000
8.4 +1.5/0
0.567
14.4
0.311 – 0.429
7.9 – 10.9
0.059
1.5
512 +0.020/-0.008
13 +0.5/-0.2
0.795
20.2
4.00
100
0.331 +0.059/-0.000
8.4 +1.5/0
0.567
14.4
0.311 – 0.429
7.9 – 10.9
8mm
7” Dia
7.00
177.8
8mm
13” Dia
13.00
330
Dim C
Dim D
Dim N
Dim W1
Dim W2
Dim W3 (LSL-USL)
December 1998, Rev. B
SuperSOTTM-6 Tape and Reel Data and Package Dimensions, continued
SuperSOT-6 (FS PKG Code 31, 33)
1:1
Scale 1:1 on letter size paper
Dimensions shown below are in:
inches [millimeters]
Part Weight per unit (gram): 0.0158
1998 Fairchild Semiconductor Corporation
September 1998, Rev. A
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
ACEx™
CoolFET™
CROSSVOLT™
E2CMOSTM
FACT™
FACT Quiet Series™
FAST®
FASTr™
GTO™
HiSeC™
ISOPLANAR™
MICROWIRE™
POP™
PowerTrench™
QS™
Quiet Series™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
TinyLogic™
UHC™
VCX™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
2. A critical component is any component of a life
support device or system whose failure to perform can
systems which, (a) are intended for surgical implant into
be reasonably expected to cause the failure of the life
the body, or (b) support or sustain life, or (c) whose
support device or system, or to affect its safety or
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
effectiveness.
reasonably expected to result in significant injury to the
user.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or
In Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Obsolete
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
