FDC6901L

FDC6901L Integrated Load Switch Features General Description Three Programmable Slew Rates This device is particularly suited for compact power management. In portable electronic equipment where 2.5V to 6V input capability is needed. This load switch integrates a Slew Rate Control Driver that drives a P-Channel Power MOSFET in one tiny SuperSOTTM-6 package. The integrated slew rate control driver is specifically designed to control the turn on of the P-Channel MOSFET in order to limit the inrush current in battery switching applications with high capacitance loads. For turn-off, the IC pulls the MOSFET gate up quickly. Reduces Inrush Current Minimizes EMI Normal Turn-Off Speed Low-Power CMOS Operates Over Wide Voltage Range High Performance Trench Technology for Extremely low RDS(ON) RoHS Compliant Applications Load switch Power management Pin 1 SuperSOTTM-6 Package Marking and Ordering Information Device Marking Device Reel Size Tape Width Quantity .901 FDC6901L 7” 8mm 3000 units ©2007 Fairchild Semiconductor Corporation FDC6901L Rev. D 1 www.fairchildsemi.com FDC6901L Integrated Load Switch February 2008 FDC6901L Integrated Load Switch Pin Configuration GND 4 3 LOGIC IN GATE 5 2 SLEW DRAIN 6 1 SOURCE/VDD Absolute Maximum Ratings Parameter Min. Max. Unit Supply Voltage -0.5 10 V DC Input Voltage (Logic Inputs) -0.7 9 V -55 150 °C Power Dissipation Storage Junction Temperature Thermal Resistance, Junction to Ambient 180 °C/W Thermal Resistance, Junction to Case 60 °C/W Recommended Operating Range Parameter Min. Max. Unit Supply Voltage 2.7 6 V Operating Junction Temperature -55 150 °C Electrical Characteristics TA = 25°C unless otherwise noted Parameter Symbol Conditions Min. Typ. Max. Units Logic Levels Logic High Input Voltage VIH VDD = 2.7V to 6.0V Logic Low Input Voltage VIL VDD = 2.7V to 6.0V 70% VDD V 25% VDD V Off Characteristics - Slew Rate Control Driver Supply Input Breakdown Voltage BVDG IDG = 10 A, VIN = 0V, VSLEW = 0V 9 V Slew Input Breakdown Voltage BVSLEW ISLEW = 10 A, VIN = 0V 9 V Logic Input Breakdown Voltage BVIN IIN = 10 A, VSLEW = 0V 9 V Supply Input Leakage Current IRDG VDG = 8V, VIN = 0V, VSLEW = 0V 100 nA Slew Input Leakage Current IRSLEW VSLEW = 8V, VIN = 0V 100 nA Logic Input Leakage Current IRIN VIN = 8V, VSLEW = 0V 100 nA 100 nA Off Characteristics - Slew Rate Control Driver + P-Channel MOSFET MOSFET Breakdown Voltage BVDSS ID = -250 A MOSFET Leakage Current IDSS VR = 16V 9 V On Characteristics - Slew Rate Control Driver Slew Pin = Open Output/Gate Current FDC6901L Rev. D IG ID = -250 A 2 90 A Slew Pin = GND 1 A Slew Pin = VDD 10 nA www.fairchildsemi.com TA = 25°C unless otherwise noted Parameter Symbol Conditions Min. Typ. Max. Units On Characteristics - P-Channel MOSFET Gate Threshold Voltage Static Drain-Source On Resistance VGS(th) RDS(ON) VDS = VGS, ID = -250 A -1 -1.5 V VGS = -4.5V, ID = -1.5A -0.6 120 145 m VGS = -2.5V, ID = -1.2A 170 210 m On Characteristics - Slew Rate Control Driver + P-Channel MOSFET Dropout Voltage VDROP Load Switch On Resistance RON Load Current ILOAD VDD = 6V, VIN = 2.5V to 6V, IL = 1.5A 160 300 mV VDD = 6V, VIN = 2.5V to 6V, IL = 1.2A 130 300 mV VDD = 6V, VIN = 2.5V to 6V, IL = 1.5A 105 180 m VDD = 6V, VIN = 2.5V to 6V, IL = 1.2A 110 210 m VGS = 2.5 V, VDS = 6 V 3 A P-Channel Switching Times (VSUPPLY = 5.5V, VDD = 5.5V, Logic IN = 5.5V, ILOAD = 1.5A) Delay On Time VOUT Rise Time Output Slew Rate tdON tR dv/dt = Open 6.2 s Slew Pin = GND 42 s = VDD 115 s = Open 6.75 s Slew Pin = GND 124 s = VDD 162 s = Open 600 V/ms Slew Pin = GND 41 V/ms 24 V/ms = VDD FDC6901L Rev. D 3 www.fairchildsemi.com FDC6901L Integrated Load Switch Electrical Characteristics Cont. 450 VDD = 6V VIN = 2.55V to 6V VDD = 6V VIN = 2.55V to 6V 400 200 Dropout Voltage, VDrop (mV) Dropout Voltage, VDrop (mV) 220 IL = 1.5A 180 160 IL = 1.2A 140 120 350 300 250 200 o TJ = 125 C 150 o TJ = 25 C 100 50 100 -50 -25 0 25 50 75 100 125 0 150 0 1 o Junction Temperature, C Figure 1. Dropout Voltage vs. Temperature (SLEW = OPEN) IL = 1.2A 130 180 On-Resistance, RON (mΩ) Dropout Voltage, VDrop (mV) VDD = 6V VIN = 2.55V to 6V ILOAD = 1A 160 o TJ = 125 C 140 120 3 Figure 2. Dropout Voltage vs. Load Current (SLEW = OPEN) 140 200 o TJ = 25 C IL = 1.5A 120 110 100 90 80 100 2.5 3 3.5 4 -50 4.5 -25 0 100 125 200 On-Resistance, RON (mΩ) 1 o TJ = 125 C 0.1 o TJ = 25 C 150 ILOAD = 1A 180 160 TJ = 125oC 140 120 TJ = 25oC 100 0.1 1 2.5 10 3 3.5 4 4.5 Input Voltage, VDD (V) Load Current, Amps (A) Figure 5. On Resistance vs. Load Current (SLEW = OPEN) FDC6901L Rev. D 75 Figure 4. On Resistance vs. Temperature (SLEW = OPEN) VDD = 6V VIN = 2.55V to 6V 0.01 0.01 50 Junction Temperature, C Figure 3. Dropout Voltage vs. Input Voltage (SLEW = OPEN) 10 25 o Input Voltage, VDD (V) On Resistance, RON (Ω) 2 Load Current, Amps (A) Figure 6. On Resistance vs. Input Voltage (SLEW = OPEN) 4 www.fairchildsemi.com FDC6901L Integrated Load Switch Typical Characteristics 160 7.5 Slew = Open Vdd=Vin=5.5V 7.0 120 time, µsecs time, microseconds (µs) Slew = Gnd Vdd=Vin=5.5V 140 6.5 trise 6.0 tdon 5.5 trise 100 80 tdon 60 40 20 5.0 0 10 20 30 40 0 50 0 Load Resistance, ohms (Ω) 10 20 30 40 50 Load Resistance, ohms (Ω) Figure 7. Switching Time vs. Load Resistance (SLEW = OPEN) Figure 8. Switching Time vs. Load Resistance (SLEW = GROUND) 200 7.5 Slew = Vdd Vdd=Vin=5.5V Slew = Open Vdd=Vin=5.5V 7.0 150 time, ( µsec) time, microseconds (µs) 175 tris 125 trise 6.5 tdon 6.0 tdon 100 5.5 75 5.0 0 10 20 30 40 50 0.0 0.5 1.0 1.5 2.0 2.5 Load Current, Amps (A) Load Resistance, ohms (Ω) Figure 10. Switching Time vs. Load Current (SLEW = OPEN) Figure 9. Switching Time vs. Load Resistance (SLEW = VDD) 160 Slew = Gnd Vdd=Vin=5.5V 140 Slew = Vdd Vdd=Vin=5.5V 175 trise time, microseconds (µs) time, µsec 120 200 100 80 60 tdon 20 0.5 1.0 1.5 2.0 tdon 75 2.5 0.0 Load Current, Amps (A) 0.5 1.0 1.5 2.0 2.5 Load Current, Amps (A) Figure 11. Switching Time vs. Load Current (SLEW = GROUND) FDC6901L Rev. D 125 100 40 0.0 trise 150 Figure 12. Switching Time vs. Load Current (SLEW = VDD) 5 www.fairchildsemi.com FDC6901L Integrated Load Switch Typical Characteristics FDC6901L Integrated Load Switch Dimensional Outline and Pad Layout FDC6901L Rev. D 6 www.fairchildsemi.com TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. ACEx® Build it Now™ CorePLUS™ CROSSVOLT™ CTL™ Current Transfer Logic™ EcoSPARK® EZSWITCH™ * ™ FPS™ FRFET® Global Power ResourceSM Green FPS™ Green FPS™ e-Series™ GTO™ i-Lo™ IntelliMAX™ ISOPLANAR™ MegaBuck™ MICROCOUPLER™ MicroFET™ MicroPak™ MillerDrive™ Motion-SPM™ OPTOLOGIC® OPTOPLANAR® ® Fairchild® Fairchild Semiconductor® FACT Quiet Series™ FACT® FAST® FastvCore™ FlashWriter® * ® PDP-SPM™ Power220® POWEREDGE® Power-SPM™ PowerTrench® Programmable Active Droop™ QFET® QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ SMART START™ SPM® STEALTH™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SupreMOS™ SyncFET™ ® The Power Franchise® TinyBoost™ TinyBuck™ TinyLogic® TINYOPTO™ TinyPower™ TinyPWM™ TinyWire™ μSerDes™ UHC® Ultra FRFET™ UniFET™ VCX™ * EZSWITCH™ and FlashWriter® are trademarks of System General Corporation, used under license by Fairchild Semiconductor. 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Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild Semiconductor. The datasheet is printed for reference information only. Rev. I33 © 2008 Fairchild Semiconductor Corporation www.fairchildsemi.com