FDD8444
®
N-Channel PowerTrench MOSFET
40V, 50A, 5.2mΩ
Features
Applications
Typ rDS(on) = 4mΩ at VGS = 10V, ID = 50A
Automotive Engine Control
Typ Qg(10) = 89nC at VGS = 10V
Powertrain Management
Low Miller Charge
Solenoid and Motor Drivers
Low Qrr Body Diode
Electronic Transmission
UIS Capability (Single Pulse/ Repetitive Pulse)
Distributed Power Architecture and VRMs
Qualified to AEC Q101
Primary Switch for 12V Systems
A
REE I
DF
M ENTATIO
LE
N
MP
LE
RoHS Compliant
©2006 Fairchild Semiconductor Corporation
FDD8444 Rev. 1.
1
www.fairchildsemi.com
FDD8444 N-Channel PowerTrench® MOSFET
March 2015
Symbol
VDSS
Drain to Source Voltage
VGS
Parameter
Gate to Source Voltage
Drain Current Continuous (VGS = 10V)
ID
(Note 1)
PD
Units
V
±20
V
145
Continuous (VGS = 10V, with RθJA = 52oC/W)
20
Pulsed
EAS
Ratings
40
A
Figure 4
Single Pulse Avalanche Energy
(Note 2)
535
mJ
Power Dissipation
153
W
Derate above 25oC
1.02
W/oC
TJ, TSTG Operating and Storage Temperature
-55 to +175
o
0.98
oC/W
52
oC/W
C
Thermal Characteristics
RθJC
RθJA
Thermal Resistance, Junction to Case
2
Thermal Resistance, Junction to Ambient TO-252, 1in copper pad area
Package Marking and Ordering Information
Device Marking
FDD8444
Device
FDD8444
Package
TO-252AA
Reel Size
13”
Tape Width
16mm
Quantity
2500 units
Electrical Characteristics TJ = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
40
-
-
-
V
-
1
-
-
250
VGS = ±20V
-
-
±100
nA
VGS = VDS, ID = 250μA
2
2.5
4
V
ID = 50A, VGS= 10V
-
4
5.2
ID = 50A, VGS= 10V,
TJ = 175oC
-
7.2
9.4
VDS = 25V, VGS = 0V,
f = 1MHz
-
6195
-
pF
-
585
-
pF
pF
Off Characteristics
BVDSS
Drain to Source Breakdown Voltage
IDSS
Zero Gate Voltage Drain Current
IGSS
Gate to Source Leakage Current
ID = 250μA, VGS = 0V
VDS = 32V
VGS = 0V
TJ = 150oC
μA
On Characteristics
VGS(th)
rDS(on)
Gate to Source Threshold Voltage
Drain to Source On Resistance
mΩ
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
-
332
-
RG
Gate Resistance
f = 1MHz
-
1.9
-
Ω
Qg(TOT)
Total Gate Charge at 10V
VGS = 0 to 10V
-
89
116
nC
nC
Qg(5)
Total Gate Charge at 5V
VGS = 0 to 5V
Qg(TH)
Threshold Gate Charge
VGS = 0 to 2V
Qgs
Gate to Source Gate Charge
Qgs2
Gate Charge Threshold to Plateau
Qgd
Gate to Drain “Miller“ Charge
FDD8444 Rev. 1.
2
VDD = 20V
ID = 50A
Ig = 1.0mA
43
56
-
11
14.3
nC
-
23
-
nC
-
11
-
nC
-
20
-
nC
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FDD8444 N-Channel PowerTrench® MOSFET
MOSFET Maximum Ratings TC = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Switching Characteristics
ton
Turn-On Time
-
-
135
ns
td(on)
Turn-On Delay Time
-
12
-
ns
tr
Turn-On Rise Time
-
78
-
ns
td(off)
Turn-Off Delay Time
-
48
-
ns
tf
Turn-Off Fall Time
-
15
-
ns
toff
Turn-Off Time
-
-
95
ns
ISD = 50A
-
0.9
1.25
ISD = 25A
-
0.8
1.0
VDD = 20V, ID = 50A
VGS = 10V, RGS = 2Ω
Drain-Source Diode Characteristics
VSD
Source to Drain Diode Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
IF = 50A, dIF/dt = 100A/μs
V
-
39
51
ns
-
45
59
nC
Notes:
1: Package current limitation is 50A.
2: Starting TJ = 25oC, L = 0.67mH, IAS = 40A
This product has been designed to meet the extreme test conditions and environment demanded by the automotive industry. For
a copy of the requirements, see AEC Q101 at: http://www.aecouncil.com/
All Fairchild Semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems
certification.
FDD8444 Rev. 1.
3
www.fairchildsemi.com
FDD8444 N-Channel PowerTrench® MOSFET
Electrical Characteristics TJ = 25oC unless otherwise noted
160
POWER DISSIPATION MULIPLIER
1.2
ID, DRAIN CURRENT (A)
1.0
VGS = 10V
CURRENT LIMITED
BY PACKAGE
140
120
0.8
100
0.6
0.4
0.2
0.0
80
60
40
20
0
25
50
75
100
125
150
TC, CASE TEMPERATURE(oC)
0
25
175
50
75
100
125
150
175
TC, CASE TEMPERATURE(oC)
Figure 1. Normalized Power Dissipation vs Case
Temperature
Figure 2. Maximum Continuous Drain Current vs
Case Temperature
2
DUTY CYCLE - DESCENDING ORDER
NORMALIZED THERMAL
IMPEDANCE, ZθJC
1
D = 0.50
0.20
0.10
0.05
0.02
0.01
0.1
PDM
t1
t2
NOTES:
DUTY FACTOR: D = t1/t2
PEAK TJ = PDM x ZθJC x RθJC + TC
0.01
-5
10
SINGLE PULSE
-4
-3
10
-2
-1
0
10
10
10
t, RECTANGULAR PULSE DURATION(s)
1
10
10
Figure 3. Normalized Maximum Transient Thermal Impedance
2000
VGS = 10V
IDM, PEAK CURRENT (A)
1000
TC = 25oC
TRANSCONDUCTANCE
MAY LIMIT CURRENT
IN THIS REGION
FOR TEMPERATURES
ABOVE 25oC DERATE PEAK
CURRENT AS FOLLOWS:
175 - TC
I = I25
150
100
SINGLE PULSE
10
-5
10
-4
10
-3
-2
-1
10
10
10
t, RECTANGULAR PULSE DURATION(s)
0
10
1
10
Figure 4. Peak Current Capability
FDD8444 Rev. 1.
4
www.fairchildsemi.com
FDD8444 N-Channel PowerTrench® MOSFET
Typical Characteristics
500
10us
IAS, AVALANCHE CURRENT (A)
ID, DRAIN CURRENT (A)
1000
100
100us
10
CURRENT LIMITED
BY PACKAGE
1
0.1
OPERATION IN THIS
AREA MAY BE
LIMITED BY rDS(on)
1
1ms
SINGLE PULSE
TJ = MAX RATED
10ms
TC = 25oC
100
STARTING TJ = 25oC
10
STARTING TJ = 150oC
DC
10
VDS, DRAIN TO SOURCE VOLTAGE (V)
If R = 0
tAV = (L)(IAS)/(1.3*RATED BVDSS - VDD)
If R ≠ 0
tAV = (L/R)ln[(IAS*R)/(1.3*RATED BVDSS - VDD) +1]
1
0.01
100
0.1
1
10
100
1000
tAV, TIME IN AVALANCHE (ms)
NOTE: Refer to Fairchild Application Notes AN7514 and AN7515
Figure 5. Forward Bias Safe Operating Area
100
100
PULSE DURATION = 80μs
DUTY CYCLE = 0.5% MAX
80
VDD = 5V
TJ = 175oC
60
TJ = 25oC
40
TJ = -55oC
20
0
2.0
2.5
3.0
3.5
4.0
4.5
80
VGS = 4V
20
0
0.0
5.0
10
PULSE DURATION = 80μs
DUTY CYCLE = 0.5% MAX
8
6
o
2
TJ = 25 C
4
5
6
7
8
9
VGS, GATE TO SOURCE VOLTAGE (V)
10
Figure 9. Drain to Source On-Resistance
Variation vs Gate to Source Voltage
FDD8444 Rev. 1.
0.6
0.9
1.2
1.5
Figure 8. Saturation Characteristics
TJ = 175oC
4
0.3
VDS, DRAIN TO SOURCE VOLTAGE (V)
NORMALIZED
DRAIN TO SOURCE ON-RESISTANCE
rDS(on), DRAIN TO SOURCE
ON-RESISTANCE (mΩ)
12
VGS = 4.5V
40
Figure 7. Transfer Characteristics
ID = 50A
VGS = 5V
60
VGS, GATE TO SOURCE VOLTAGE (V)
14
PULSE DURATION = 80μs
DUTY CYCLE = 0.5% MAX
VGS = 10V
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
Figure 6. Unclamped Inductive Switching
Capability
1.8
1.6
PULSE DURATION = 80μs
DUTY CYCLE = 0.5% MAX
1.4
1.2
1.0
0.8
0.6
-80
ID = 50A
VGS = 10V
0
40
80
120
160
-40
TJ, JUNCTION TEMPERATURE(oC)
200
Figure 10. Normalized Drain to Source On
Resistance vs Junction Temperature
5
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FDD8444 N-Channel PowerTrench® MOSFET
Typical Characteristics
1.2
1.15
NORMALIZED GATE
THRESHOLD VOLTAGE
1.1
1.10
1.0
0.9
1.05
0.8
1.00
0.7
0.6
0.95
0.5
0.4
-80
-40
0
40
80
120
160
TJ, JUNCTION TEMPERATURE(oC)
0.90
-80
200
10000
Ciss
Coss
1000
Crss
f = 1MHz
VGS = 0V
100
0.1
1
10
VDS, DRAIN TO SOURCE VOLTAGE (V)
40
Figure 13. Capacitance vs Drain to Source
Voltage
FDD8444 Rev. 1.
-40
0
40
80
120
160
TJ, JUNCTION TEMPERATURE (oC)
200
Figure 12. Normalized Drain to Source
Breakdown Voltage vs Junction Temperature
VGS, GATE TO SOURCE VOLTAGE(V)
Figure 11. Normalized Gate Threshold Voltage vs
Junction Temperature
CAPACITANCE (pF)
ID = 250μA
NORMALIZED DRAIN TO SOURCE
BREAKDOWN VOLTAGE
VGS = VDS
ID = 250μA
10
ID = 50A
VDD = 15V
8
VDD = 20V
6
VDD = 25V
4
2
0
0
20
40
60
Qg, GATE CHARGE(nC)
80
100
Figure 14. Gate Charge vs Gate to Source Voltage
6
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FDD8444 N-Channel PowerTrench® MOSFET
Typical Characteristics
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®
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Quiet Series
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SMART START
Solutions for Your Success
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Sync-Lock™
®*
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Advance Information
Formative / In Design
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
Definition
Datasheet contains the design specifications for product development. Specifications may change
in any manner without notice.
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild
Semiconductor reserves the right to make changes at any time without notice to improve design.
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make
changes at any time without notice to improve the design.
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.
The datasheet is for reference information only.
Rev. I76
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