FDI9406-F085

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Other names and brands may be claimed as the property of others. FDI9406-F085 N-Channel PowerTrench® MOSFET FDI9406-F085 N-Channel PowerTrench® MOSFET 40 V, 110 A, 2.2 mΩ Features D „ Typ RDS(on) = 1.73mΩ at VGS = 10V, ID = 80A „ Typ Qg(tot) = 107nC at VGS = 10V, ID = 80A „ UIS Capability G „ RoHS Compliant „ Qualified to AEC Q101 Applications S TO-262AB „ Automotive Engine Control „ Powertrain Management FDI SERIES „ Solenoid and Motor Drivers „ Electronic Steering „ Integrated Starter/Alternator „ Distributed Power Architectures and VRM „ Primary Switch for 12V Systems MOSFET Maximum Ratings TJ = 25°C unless otherwise noted Symbol VDSS Drain-to-Source Voltage VGS ID EAS PD Parameter Gate-to-Source Voltage Ratings 40 Units V ±20 V Drain Current - Continuous (VGS=10) (Note 1) TC = 25°C 110 Pulsed Drain Current TC = 25°C See Figure 4 Single Pulse Avalanche Energy (Note 2) A 174 mJ Power Dissipation 176 W Derate above 25oC 1.18 W/oC TJ, TSTG Operating and Storage Temperature RθJC Thermal Resistance, Junction to Case RθJA Maximum Thermal Resistance, Junction to Ambient -55 to + 175 oC 0.85 oC/W 43 oC/W (Note 3) Package Marking and Ordering Information Device Marking FDI9406 Device FDI9406-F085 Package TO-262AB Reel Size Tube Tape Width N/A Quantity 50 units Notes: 1: Current is limited by bondwire configuration. 2: Starting TJ = 25°C, L = 0.045mH, IAS = 88A, VDD = 40V during inductor charging and VDD = 0V during time in avalanche. 3: RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθJAis determined by the user's board design. The maximum rating presented here is based on mounting on a 1 in2 pad of 2oz copper. 2013 ON Semiconductor Components Industries, LLC August-2017, Rev 3 Product Order Number: FDI9406-F085/D Symbol Parameter Test Conditions Min. Typ. Max. Units Off Characteristics BVDSS Drain-to-Source Breakdown Voltage IDSS Drain-to-Source Leakage Current IGSS Gate-to-Source Leakage Current ID = 250μA, VGS = 0V VDS = 40V, VGS = 0V 40 - - V - - 1 μA TJ = 25oC TJ = 175oC(Note 4) - - 1 mA - - ±100 nA 2.0 2.83 4.0 V - 1.73 2.2 mΩ - 2.86 3.2 mΩ VGS = ±20V On Characteristics VGS(th) RDS(on) Gate-to-Source Threshold Voltage Drain-to-Source On Resistance VGS = VDS, ID = 250μA ID = 80A, VGS= 10V TJ = 25oC TJ = 175oC(Note 4) Dynamic Characteristics Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance Rg Gate Resistance f = 1MHz Qg(ToT) Total Gate Charge at 10V VGS = 0 to 10V Qg(th) Threshold Gate Charge VGS = 0 to 2V Qgs Gate-to-Source Gate Charge Qgd Gate-to-Drain “Miller“ Charge - VDS = 25V, VGS = 0V, f = 1MHz VDD = 32V ID = 80A - 7710 - pF - 2015 - pF - 140 - pF - 2.7 - Ω - 107 138 nC - 14 19 nC - 33 - nC 18 - nC Switching Characteristics ton Turn-On Time - - 160 ns td(on) Turn-On Delay - 32 - ns tr Rise Time td(off) Turn-Off Delay - 81 - ns - 50 - ns tf toff Fall Time - 23 - ns Turn-Off Time - - 93 ns VDD = 20V, ID = 80A, VGS = 10V, RGEN = 6Ω Drain-Source Diode Characteristics VSD Source-to-Drain Diode Voltage ISD = 80A, VGS = 0V - - 1.25 V trr Reverse-Recovery Time - 85 110 ns Qrr Reverse-Recovery Charge IF = 80A, dISD/dt = 100A/μs, VDD=32V - 122 160 nC Note: 4: The maximum value is specified by design at TJ = 175°C. Product is not tested to this condition in production. www.onsemi.com 2 FDI9406-F085 N-Channel PowerTrench® MOSFET Electrical Characteristics TJ = 25°C unless otherwise noted 300 1.0 250 ID, DRAIN CURRENT (A) POWER DISSIPATION MULTIPLIER 1.2 0.8 0.6 0.4 0.2 0.0 0 25 50 75 100 125 150 TC, CASE TEMPERATURE(oC) NORMALIZED THERMAL IMPEDANCE, ZθJC 1 0.1 VGS = 10V CURRENT LIMITED BY SILICON 200 150 100 50 0 175 Figure 1. Normalized Power Dissipation vs. Case Temperature CURRENT LIMITED BY PACKAGE 25 50 75 100 125 150 175 TC, CASE TEMPERATURE(oC) 200 Figure 2. Maximum Continuous Drain Current vs. Case Temperature DUTY CYCLE - DESCENDING ORDER D = 0.50 0.20 0.10 0.05 0.02 0.01 PDM t1 t2 NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ = PDM x ZθJA x RθJA + TC SINGLE PULSE 0.01 -5 10 -4 10 -3 -2 -1 0 10 10 10 t, RECTANGULAR PULSE DURATION(s) 1 10 10 Figure 3. Normalized Maximum Transient Thermal Impedance 1000 IDM, PEAK CURRENT (A) VGS = 10V 100 TC = 25oC FOR TEMPERATURES ABOVE 25oC DERATE PEAK CURRENT AS FOLLOWS: 175 - TC I = I2 150 SINGLE PULSE 10 -5 10 -4 10 -3 -2 -1 10 10 10 t, RECTANGULAR PULSE DURATION(s) Figure 4. Peak Current Capability www.onsemi.com 3 0 10 1 10 FDI9406-F085 N-Channel PowerTrench® MOSFET Typical Characteristics 1000 IAS, AVALANCHE CURRENT (A) ID, DRAIN CURRENT (A) 1000 100 100us 10 OPERATION IN THIS AREA MAY BE LIMITED BY rDS(on) 1 0.1 1 1ms 10ms 100ms SINGLE PULSE TJ = MAX RATED TC = 25oC 10 VDS, DRAIN TO SOURCE VOLTAGE (V) TJ = 175oC 150 TJ = 25oC 100 TJ = -55oC 50 3 STARTING TJ = 150oC 0.01 0.1 1 10 100 1000 tAV, TIME IN AVALANCHE (ms) NOTE: Refer to ON Semiconductor Application Notes AN7514 and AN7515 Figure 6. Unclamped Inductive Switching Capability 4 5 VGS, GATE TO SOURCE VOLTAGE (V) 100 VGS = 0 V TJ = 175 oC TJ = 25 oC 10 1 0.0 6 0.2 0.4 0.6 0.8 1.0 1.2 VSD, BODY DIODE FORWARD VOLTAGE (V) Figure 7. Transfer Characteristics Figure 8. Forward Diode Characteristics 350 350 300 VGS 250 200 150 5V 15V Top 10V 8V 7V 6V 5.5V 5V Bottom 100 50 0 0.0 ID, DRAIN CURRENT (A) ID, DRAIN CURRENT (A) 10 1 1E-3 IS, REVERSE DRAIN CURRENT (A) ID, DRAIN CURRENT (A) VDD = 5V 200 0 STARTING TJ = 25oC 300 PULSE DURATION = 80μs DUTY CYCLE = 0.5% MAX 250 100 100 Figure 5. Forward Bias Safe Operating Area 300 If R = 0 tAV = (L)(IAS)/(1.3*RATED BVDSS - VDD) If R ≠ 0 tAV = (L/R)ln[(IAS*R)/(1.3*RATED BVDSS - VDD) +1] 80μs PULSE WIDTH Tj=25oC 300 250 200 100 50 0.4 0.8 1.2 1.6 2.0 VDS, DRAIN TO SOURCE VOLTAGE (V) Figure 9. Saturation Characteristics www.onsemi.com 4 5V 150 0 0.0 VGS 15V 5.5V Top 10V 8V 7V 6V 5.5V 5V Bottom 80μs PULSE WIDTH Tj=175oC 0.4 0.8 1.2 1.6 VDS, DRAIN TO SOURCE VOLTAGE (V) Figure 10. Saturation Characteristics 2.0 FDI9406-F085 N-Channel PowerTrench® MOSFET Typical Characteristics ID = 80A 1.8 PULSE DURATION = 80μs DUTY CYCLE = 0.5% MAX NORMALIZED DRAIN TO SOURCE ON-RESISTANCE rDS(on), DRAIN TO SOURCE ON-RESISTANCE (mΩ) 20 1.6 16 1.4 12 TJ = 25oC 8 1.2 TJ = 175oC 1.0 4 0 ID = 80A VGS = 10V 0.8 2 4 6 8 VGS, GATE TO SOURCE VOLTAGE (V) 10 0.6 -80 Figure 11. RDSON vs. Gate Voltage NORMALIZED DRAIN TO SOURCE BREAKDOWN VOLTAGE NORMALIZED GATE THRESHOLD VOLTAGE 0.8 0.6 0.4 -40 0 40 80 120 160 TJ, JUNCTION TEMPERATURE(oC) 200 Figure 13. Normalized Gate Threshold Voltage vs. Temperature Ciss 1000 Coss 100 f = 1MHz VGS = 0V Crss 1 10 VDS, DRAIN TO SOURCE VOLTAGE (V) 100 Figure 15. Capacitance vs. Drain to Source Voltage www.onsemi.com 5 ID = 1mA 1.1 1.0 0.9 0.8 -80 -40 0 40 80 120 160 TJ, JUNCTION TEMPERATURE (oC) 200 Figure 14. Normalized Drain to Source Breakdown Voltage vs. Junction Temperature VGS, GATE TO SOURCE VOLTAGE(V) 10000 10 0.1 200 1.2 VGS = VDS ID = 250μA 1.0 0.2 -80 -40 0 40 80 120 160 TJ, JUNCTION TEMPERATURE(oC) Figure 12. Normalized RDSON vs. Junction Temperature 1.2 CAPACITANCE (pF) PULSE DURATION = 80μs DUTY CYCLE = 0.5% MAX 10 ID = 80A VDD = 16V 8 VDD = 20V VDD = 24V 6 4 2 0 0 20 40 60 80 Qg, GATE CHARGE(nC) 100 120 Figure 16. Gate Charge vs. Gate to Source Voltage FDI9406-F085 N-Channel PowerTrench® MOSFET Typical Characteristics ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 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