FDMS8333L

FDMS8333L

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    PowerTDFN8

  • 描述:

    此 N 沟道 MOSFET 专用于提高 DC-DC 转换器的总能效以及最大程度降低其开关节点噪声,可以使用同步开关 PWM 控制器,也可以使用传统开关 PWM 控制器。它经过了优化,可实现低门极电荷、...

  • 数据手册
  • 价格&库存
FDMS8333L 数据手册
Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. FDMS8333L N-Channel PowerTrench® MOSFET 40 V, 76 A, 3.1 mΩ Features General Description „ Max rDS(on) = 3.1 mΩ at VGS = 10 V, ID = 22 A This N-Channel MOSFET has been designed specifically to improve the overall efficiency and to minimize switch node ringing of DC/DC converters using either synchronous or conventional switching PWM controllers. It has been optimized for low gate charge, low rDS(on), fast switching speed and body diode reverse recovery performance. „ Max rDS(on) = 4.3 mΩ at VGS = 4.5 V, ID = 19 A „ Advanced Package and Silicon combination for low rDS(on) and high efficiency „ Next generation enhanced engineered for soft recovery body diode technology, Applications „ MSL1 robust package design „ OringFET / Load Switching „ 100% UIL tested „ Synchronous rectification „ RoHS Compliant „ DC-DC Conversion Bottom Top Pin 1 S Pin 1 D D D S S G D S D S D S D G D Power 56 MOSFET Maximum Ratings TA = 25 °C unless otherwise noted Symbol VDS Drain to Source Voltage Parameter VGS Gate to Source Voltage Drain Current ID -Continuous TC = 25 °C -Continuous TA = 25 °C -Pulsed Single Pulse Avalanche Energy EAS PD TJ, TSTG Power Dissipation TC = 25 °C Power Dissipation TA = 25 °C Ratings 40 Units V ±20 V 76 (Note 1a) 22 (Note 4) 250 (Note 3) 216 69 (Note 1a) Operating and Storage Junction Temperature Range 2.5 -55 to +150 A mJ W °C Thermal Characteristics RθJC Thermal Resistance, Junction to Case RθJA Thermal Resistance, Junction to Ambient 1.8 (Note 1a) 50 °C/W Package Marking and Ordering Information Device Marking FDMS8333L Device FDMS8333L ©2013 Fairchild Semiconductor Corporation FDMS8333L Rev. C3 Package Power 56 1 Reel Size 13 ’’ Tape Width 12 mm Quantity 3000 units www.fairchildsemi.com FDMS8333L N-Channel PowerTrench® MOSFET December 2014 Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BVDSS Drain to Source Breakdown Voltage ID = 250 μA, VGS = 0 V ΔBVDSS ΔTJ Breakdown Voltage Temperature Coefficient ID = 250 μA, referenced to 25 °C IDSS Zero Gate Voltage Drain Current VDS = 32 V, VGS = 0 V 1 μA IGSS Gate to Source Leakage Current VGS = ±20 V, VDS = 0 V ±100 nA 3.0 V 40 V 22 mV/°C On Characteristics VGS(th) Gate to Source Threshold Voltage VGS = VDS, ID = 250 μA ΔVGS(th) ΔTJ Gate to Source Threshold Voltage Temperature Coefficient ID = 250 μA, referenced to 25 °C VGS = 10 V, ID = 22 A 2.4 3.1 rDS(on) Static Drain to Source On Resistance VGS = 4.5 V, ID = 19 A 3.3 4.3 VGS = 10 V, ID = 22 A, TJ = 125 °C 3.6 4.7 VDS = 5 V, ID = 22 A 120 gFS Forward Transconductance 1.0 1.8 -6 mV/°C mΩ S Dynamic Characteristics Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance Rg Gate Resistance VDS = 20 V, VGS = 0 V, f = 1 MHz 0.1 3245 4545 pF 840 1175 pF 32 55 pF 0.7 2.1 Ω Switching Characteristics td(on) Turn-On Delay Time 14 25 ns tr Rise Time 4.7 10 ns td(off) Turn-Off Delay Time 33 53 ns tf Fall Time 4.2 10 ns nC VDD = 20 V, ID = 22 A, VGS = 10 V, RGEN = 6 Ω Qg Total Gate Charge VGS = 0 V to 10 V 46 64 Qg Total Gate Charge 22 31 Qgs Gate to Source Charge VGS = 0 V to 4.5 V VDD = 20 V, ID = 22 A Qgd Gate to Drain “Miller” Charge nC 8.8 nC 5.5 nC Drain-Source Diode Characteristics VSD Source to Drain Diode Forward Voltage trr Reverse Recovery Time Qrr Reverse Recovery Charge VGS = 0 V, IS = 1.9 A (Note 2) 0.7 1.2 VGS = 0 V, IS = 22 A (Note 2) 0.8 1.3 IF = 22 A, di/dt = 100 A/μs V 38 61 ns 20 32 nC Notes: 1. RθJA is determined with the device mounted on a 1 in2 pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. RθJC is guaranteed by design while RθCA is determined by the user's board design. b. 125 °C/W when mounted on a minimum pad of 2 oz copper. a. 50 °C/W when mounted on a 1 in2 pad of 2 oz copper SS SF DS DF G SS SF DS DF G 2. Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0%. 3. EAS of 216 mJ is based on starting TJ = 25 °C; N-ch: L = 3 mH, IAS = 12 A, VDD = 40 V, VGS = 10 V. 100% test at L = 0.1 mH, IAS = 38 A. 4. Pulsed Id limited by junction temperature, td
FDMS8333L 价格&库存

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FDMS8333L
  •  国内价格
  • 1+6.72186
  • 5+6.04968
  • 25+5.37749
  • 26+4.62128
  • 70+4.36921

库存:2995