FDZ4010

FDZ4010 Integrated Load Switch Features General Description The FDZ4010 is a 10 mA high side Pch MOSFET switch that can be controlled by two enable signals. It is an AND function switch activated by asserting both enable signals high. Input voltage range operates from 2 V to 5 V to align with the requirement of portable devices power requirement. FDZ4010 is uniquely designed for optimized low power dissipation and precise driver requirement. FDZ4010 comes in a tiny 0.8 mm X 1.2 mm WLCSP, 6 bumps, with 0.4 mm pitch. Input Voltage Range from 2 V to 5 V 10 mA output current UItra Thin and Small Package WL-CSP 0.8 X 1.2 mm2, Height 0.5 mm RoHS Compliant Application Smart Phone / Table Accessory TOP View BOTTOM View 6 Balls, 0.8 X 1.2 mm2 WL-CSP Package Marking and Ordering Information Part Number Device Marking Ball Pitch Package Reel Size Tape Width Quantity FDZ4010 Z5 0.4 mm 0.8 mm x 1.2 mm WL-CSP, 6 Bumps 7 ’’ 8 mm 3000 For Fairchild’s definition of Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html ©2013 Fairchild Semiconductor Corporation FDZ4010 Rev.C4 1 www.fairchildsemi.com FDZ4010 July 2013 FDZ4010 Application Diagram VIN IN EN1 EN2 OUT FDZ4010 VOUT GND Figure 1. Typical Application Block Diagram IN OUT Output Discharge EN1 CONTROL BLOCK EN2 R EN RE N GND Figure 2. Functional Block Diagram Truth Table VIN (2 V to 5 V) YES YES EN1 HIGH LOW EN2 HIGH LOW PCH MOSFET Status ON OFF VOUT Status VIN LOW YES YES HIGH LOW LOW HIGH OFF OFF LOW LOW Table 1. Truth Table for OUT Status ©2013 Fairchild Semiconductor Corporation FDZ4010 Rev.C4 2 www.fairchildsemi.com FDZ4010 Pin Configuration A A1 A2 A2 A1 A B B1 B2 B2 B1 B C C1 C2 C2 C1 C 1 2 2 1 Top View Bottom View Figure 3. Pin Assignments Pin Definitions Pin # A1 Name IN A2 OUT B1, C1 B2 C2 GND EN1 EN2 Description Input of the Pch MOSFET Switch Output of the Pch MOSFET Switch. Internally, this pin is pulled down through an output discharge FET to Ground when EN pins are low and VIN is present. Ground ON/OFF control input, Active High. ON/OFF control input, Active High. ©2013 Fairchild Semiconductor Corporation FDZ4010 Rev.C4 3 www.fairchildsemi.com Characteristics Min. -0.3 -0.3 VIN, VOUT to GND VEN1,VEN2 to GND Continuous Output Current Junction Temperature (TJ) Storage Temperature Range (TSTG) Thermal Resistance, Junction to Ambient ( Electrostatic Discharge -65 JA) (Note 1b) Human Body Model, ANSI/ESDA/ JEDEC JS-001-2012 Charged Device Model, JESD22C101 Max. 6 6 Unit V V 20 150 150 312 mA o C o C °C/W 5 kV 2 Recommended Operating Conditions Characteristics IN Voltage OUT Current, VIN = 3.3 V , VEN1 = VEN2 = 3.3 V EN1, EN2 Voltage Operating Temperature Range Symbol VIN Min. 2 IOUT VEN1 ,VEN2 Max. 5 Unit V 10 mA 5 -40 85 V oC Notes: 1. R JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting suface of the drain pins. R JC is guaranteed by design while R CA is determined by the user’s board design. a. 115 °C/W when mounted on a 1 in2 pad of 2 oz copper. b. 312 °C/W when mounted on a minimum pad of 2 oz copper. OUTS OUTF INS INF OUTS OUTF INS INF ©2013 Fairchild Semiconductor Corporation FDZ4010 Rev.C4 4 www.fairchildsemi.com FDZ4010 Absolute Maximum Ratings Symbol Parameter VIH Input High Voltage, EN1, EN2 VIH Input High Voltage, EN1, EN2 VIL Input Low Voltage, EN1, EN2 REN Pull Down Resistance at EN1, EN2 CEN Input Capacitance of EN1, EN2 RDS(ON) On-Resistance of Pch MOSFET IQ Quiescent Current ISD Shutdown Current ton tr toff ROUT Pull Down Resistance at OUT Pin Turn-On Time Turn-On Rise Time Turn-Off Time tf Turn-Off Fall Time Test Conditions VIN = 2.5 V to 5 V and across temperature range VIN = 2 V and across temperature range VIN = 2 V to 5 V and across temperature range VEN1 = VEN2 = 1 V and across temperature range f = 1 MHz and across temperature range (Note 2) IOUT = 10 mA, VIN = 2 V to 5 V VIN = 5 V, VEN1 = VEN2 = 5 V, VOUT floating (IOUT = 0), Across temperature range VIN = 3.3 V, VEN1 = VEN2 = 0 V, VOUT floating (IOUT = 0), Across temperature range VIN = 3.3 V, VEN1 = 825 mV & VEN2 = 425 mV, VEN1 = 425 mV & VEN2 = 825 mV, VOUT floating (IOUT = 0), Across temperature range VEN1 = VEN2 = 0 V Load Impedance, VIN = 3.3 V, CL = 50 pF, RL = 500 VEN1 = VEN2 = 0 V to 2.3 V, (500 ns rise time) Min Typ Max Units 1.375 V 1.525 V 0.95 70 100 V 130 k 10 pF 1.5 1 500 A 1 A 10 A 1.3 1 0.95 2 2 k s s s s Notes: 2. Guaranteed by characterization and design Figure 4. Timing Diagram ©2013 Fairchild Semiconductor Corporation FDZ4010 Rev.C4 5 www.fairchildsemi.com FDZ4010 Electrical Characteristics VIN = 2 V to 5 V, TJ = 25 oC , unless otherwise noted FDZ4010 Typical Characteristics (Continued) 350 400 VEN1 = VEN2 = VIN VIN = 5.0 V 350 V = Floating OUT SUPPLY CURRENT ( A) SUPPLY CURRENT ( A) VEN1 = VEN2 = 5.0 V 300 250 200 -50 -25 0 25 50 75 300 250 200 150 100 2.0 100 TA = 25 oC 2.5 3.0 o Figure 5. Quiescent Current vs Temperature SHUTDOWN CURRENT ( A) SHUTDOWN CURRENT (nA) VEN1 = 0 V VEN2 = 0 V VIN = 3.3 V 40 20 -25 0 25 50 75 VEN2 = 0 V 6 TA = 25 oC 4 2 2.0 100 o 2.5 3.0 TJ, JUNCTION TEMPERATURE ( C) 4.0 4.5 5.0 Figure 8. Shutdown Current vs Supply Voltage 4 VEN1 = 425 mV VEN1 = 825 mV VEN2 = 825 mV SHUTDOWN CURRENT ( A) SHUTDOWN CURRENT ( A) 3.5 SUPPLY VOLTAGE (V) Figure 7. Shutdown Current vs Temperature VIN = 3.3 V 3 2 1 -50 5.0 8 VEN1 = 0 V 4 4.5 Figure 6. Quiescent Current vs Supply Voltage 80 0 -50 4.0 SUPPLY VOLTAGE (V) TJ, JUNCTION TEMPERATURE ( C) 60 3.5 -25 0 25 50 75 3 VIN = 3.3 V 2 1 -50 100 -25 0 25 50 75 100 TJ, JUNCTION TEMPERATURE (oC) TJ, JUNCTION TEMPERATURE (oC) Figure 9. Shutdown Current vs Temperature ©2013 Fairchild Semiconductor Corporation FDZ4010 Rev.C4 VEN2 = 425 mV Figure 10. Shutdown Current vs Temperature 6 www.fairchildsemi.com FDZ4010 Typical Characteristics (Continued) 1.4 VIN = VEN2 = 3.3 V EN1 INPUT LOGIC VOLTAGE (V) EN1 INPUT LOGIC VOLTAGE (V) 1.4 1.3 1.2 VIL VIH 1.1 1.0 -50 -25 0 25 50 75 1.3 VIN = VEN2 1.2 VIL VIH 1.1 1.0 2.0 100 TA = 25 oC 2.5 o TJ, JUNCTION TEMPERATURE ( C) Figure 11. EN1 Logic Voltage vs Temperature 1.4 VIN = VEN1 = 3.3 V 1.3 1.2 VIL VIH 1.1 1.0 -50 -25 0 25 50 3.5 75 VIN = VEN1 1.2 VIL VIH 1.1 1.0 2.0 100 2.5 3.0 3.5 4.0 4.5 5.0 SUPPLY VOLTAGE (V) Figure 13. EN2 Logic Voltage vs Temperature Figure 14. EN2 Logic Voltage vs Supply Voltage (VIN) 400 500 VEN1 = VEN2 = 3.3 V VEN1 = VEN2 = VIN STATIC DRAIN TO SOURCE ON RESISTANCE (m ) VIN = 3.3 V STATIC DRAIN TO SOURCE ON RESISTANCE (m ) 5.0 1.3 TJ, JUNCTION TEMPERATURE ( C) IOUT = 10 mA 300 250 -50 4.5 TA = 25 oC o 350 4.0 Figure 12. EN1 Logic Voltage vs Supply Voltage (V IN) EN2 INPUT LOGIC VOLTAGE (V) EN2 INPUT LOGIC VOLTAGE (V) 1.4 3.0 SUPPLY VOLTAGE (V) -25 0 25 50 75 TJ, JUNCTION TEMPERATURE ( C) 400 350 300 2.5 3.0 3.5 4.0 4.5 5.0 SUPPLY VOLTAGE (V) Figure15. Static Drain to Source ON Resistance vs Temperature ©2013 Fairchild Semiconductor Corporation FDZ4010 Rev.C4 TA = 25 oC 250 2.0 100 o IOUT = 10 mA 450 Figure 16. Static Drain to Source ON Resistance vs Supply Voltage 7 www.fairchildsemi.com FDZ4010 Typical Characteristics (Continued) 5.8 6.0 FUNC: Cp-Rp FREQ: 1 MHz LEVEL: 100 mV EN2 CAPACITANCE (pF) EN1 CAPACITANCE (pF) 6.0 5.6 5.4 5.2 5.0 -50 -25 0 25 50 75 5.6 5.4 5.2 5.0 -50 100 TJ, JUNCTION TEMPERATURE (oC) -25 0 25 50 75 100 TJ, JUNCTION TEMPERATURE (oC) Figure 17. EN1 Capacitance vs Temperature ©2013 Fairchild Semiconductor Corporation FDZ4010 Rev.C4 FUNC: Cp-Rp FREQ: 1 MHz LEVEL: 100 mV 5.8 Figure 18. EN2 Capacitance vs Temperature 8 www.fairchildsemi.com FDZ4010 Typical Characteristics (Continued) VEN1 VIN VOUT Figure 19. Turn-On Time (VIN = 3.3 V, VEN2 = 2.3 V, timescale = 40 us/div) VEN1= 0 to 2.3 V, COUT = 50 pF, RL= 500 VEN1 VOUT VIN Figure 20. Turn-Off Time (VIN = 3.3 V, VEN2 = 2.3 V, timescale = 40 us/div) VEN1= 2.3 to 0 V, COUT = 50 pF, RL= 500 ©2013 Fairchild Semiconductor Corporation FDZ4010 Rev.C4 9 www.fairchildsemi.com FDZ4010 Typical Characteristics (Continued) VIN Figure 21. VIN Ramp Up and Down (VIN = 0 to 4.8 V (6100 V/sec), timescale = 400 us/div) EN1 and EN2 are floating(Internally GND), COUT = 50 pF, RL= 500 VIN Figure 22. VIN Ramp Up and Down (EN1 = EN2 = VIN = 0 to 4.8 V (6100 V/sec), COUT = 50 pF, RL= 500 ©2013 Fairchild Semiconductor Corporation FDZ4010 Rev.C4 , timescale = 400 us/div) 10 www.fairchildsemi.com FDZ4010 Application Information IN V IN OF F/ ON 2V ~ 5V C IN = 0.1 uF OF F/O N EN1 EN2 FDZ4010 V OU T O UT G ND CL= 50 pF RL= 500O (Optional) Figure 23. Typical Application Circuit Input Voltage Input Voltage (VIN) is set from 2 V to 5 V. Input Capacitor To prevent the input voltage being pulled below the minimum operating voltage, a reservoir capacitor can be connected from IN to GND. 0.1 F ceramic type is suitable. Enable/Shutdown Operation To turn on the switch, both the EN pins need to be asserted high. To ensure proper operation, Enable signals must be able to swing above and below the specified turn-on/off voltage threshold described in the Electrical Charateristics table under VIL and VIH for the selected input voltage. Power up Sequence Turn on input voltage (VIN) within range from 2 V to 5 V then turn on EN1 or/and EN2 signal. VOUT status changed by EN1 or/and EN2 signal input and defined the status in Table 1 Truth Table. ©2013 Fairchild Semiconductor Corporation FDZ4010 Rev.C4 11 www.fairchildsemi.com FDZ4010 Dimensional Outline and Pad Layout Product-Specific Dimensions Product D E X Y FDZ4010 1.16 mm 0.76 mm 0.18 mm 0.18 mm ©2013 Fairchild Semiconductor Corporation FDZ4010 Rev.C4 12 www.fairchildsemi.com FDZ4010 TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. 2Cool™ Sync-Lock™ FPS™ ® AccuPower™ F-PFS™ ®* ® ® ® FRFET AX-CAP * PowerTrench SM Global Power Resource PowerXS™ BitSiC™ TinyBoost™ Green Bridge™ Build it Now™ Programmable Active Droop™ TinyBuck™ CorePLUS™ Green FPS™ QFET® TinyCalc™ CorePOWER™ QS™ Green FPS™ e-Series™ TinyLogic® Gmax™ CROSSVOLT™ Quiet Series™ TINYOPTO™ GTO™ CTL™ RapidConfigure™ TinyPower™ IntelliMAX™ Current Transfer Logic™ ™ TinyPWM™ ® ISOPLANAR™ DEUXPEED TinyWire™ Marking Small Speakers Sound Louder Saving our world, 1mW/W/kW at a time™ Dual Cool™ TranSiC® and Better™ EcoSPARK® SignalWise™ TriFault Detect™ EfficentMax™ MegaBuck™ SmartMax™ TRUECURRENT®* MICROCOUPLER™ SMART START™ ESBC™ SerDes™ MicroFET™ Solutions for Your Success™ ® MicroPak™ SPM® MicroPak2™ STEALTH™ Fairchild® UHC® MillerDrive™ SuperFET® Fairchild Semiconductor® Ultra FRFET™ SuperSOT™-3 MotionMax™ FACT Quiet Series™ UniFET™ mWSaver™ SuperSOT™-6 FACT® VCX™ OptoHiT™ SuperSOT™-8 FAST® ® ® VisualMax™ OPTOLOGIC SupreMOS FastvCore™ ® VoltagePlus™ OPTOPLANAR SyncFET™ FETBench™ XS™ tm *Trademarks of System General Corporation, used under license by Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used here in: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. ANTI-COUNTERFEITING POLICY Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website, www.Fairchildsemi.com, under Sales Support. Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Fairchild’s full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative / In Design Datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. No Identification Needed Full Production Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. Obsolete Not In Production Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only. Rev. I64 ©2013 Fairchild Semiconductor Corporation FDZ4010 Rev.C4 13 www.fairchildsemi.com