Ultrafast Rectifier
60 A, 600 V
FFH60UP60S,
FFH60UP60S3
Description
The FFH60UP60S, FFH60UP60S3 is an ultrafast diode with low
forward voltage drop and rugged UIS capability. This device is
intended for use as freewheeling and clamping diodes in a variety of
switching power supplies and other power switching applications. It is
specially suited for use in switching power supplies and industrial
applications as welder and UPS application.
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PIN ASSIGNMENTS
3. Anode
Features
•
•
•
•
Ultrafast Recovery, trr = 80 ns (@ IF = 60 A)
Max Forward Voltage, VF = 1.7 V (@ TC = 25°C)
Avalanche Energy Rated
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Backside Metal
Connected to Cathode
1
3
TO−247−2LD
CASE 340CL
Applications
•
•
•
•
1., 3. Anode
General Purpose
SMPS, Welder, UPS
Free−wheeling Diode for Motor Application
Power Switching Circuits
1. Cathode
2. Cathode
Backside Metal
Connected to Cathode
1
2
3
TO−247−3LD
CASE 340CK
MARKING DIAGRAM
$Y&Z&3&K
FFH
60UP60S
$Y
&Z
&3
&K
FFH60UP60Sx
$Y&Z&3&K
FFH
60UP60S3
= ON Semiconductor Logo
= Assembly Plant Code
= Numeric Date Code
= Lot Code
= Specific Device Code
ORDERING INFORMATION
See detailed ordering and shipping information on page 2 of
this data sheet.
© Semiconductor Components Industries, LLC, 2018
February, 2020 − Rev. 2
1
Publication Order Number:
FFH60UP60S/D
FFH60UP60S, FFH60UP60S3
ABSOLUTE MAXIMUM RATINGS (TC = 25°C unless otherwise noted)
Parameter
Symbol
Value
Unit
VRRM
Peak Repetitive Reverse Voltage
600
V
VRWM
Working Peak Reverse Voltage
600
V
DC Blocking Voltage
600
V
VR
IF(AV)
Average Rectified Forward Current @ TC = 93°C
60
A
IFSM
Non−repetitive Peak Surge Current
60 Hz Single Half−Sine Wave
600
A
−65 to +175
°C
TJ, TSTG
Operating and Storage Temperature Range
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Symbol
RqJC
Parameter
Maximum Thermal Resistance, Junction to Case
Value
Unit
0.7
°C/W
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)
Symbol
Parameter
VF (Note 1)
IF = 60 A
IR (Note 1)
VR = 600 V
trr
IF = 60 A, diF/dt = 200 A/ms,
VR = 390 V
WAVL
Min
Typ
Max
Unit
TC = 25°C
−
1.4
1.7
V
TC = 125°C
−
1.3
−
TC = 25°C
−
−
100
TC = 125°C
−
−
500
TC = 25°C
−
60
80
TC = 125°C
−
138
−
50
−
−
Avalanche Energy (L = 40 mH)
mA
ns
mJ
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. Pulse: Test Pulse Width = 300 ms, Duty Cycle = 2%
ORDERING INFORMATION
Part Number
Device Marking
Package
Shipping
FFH60UP60S
FFH60UP60S
TO−247−2LD
(Pb-Free / Halogen Free)
450 Units / Tube
FFH60UP60S3
FFH60UP60S3
TO−247−3LD
(Pb-Free / Halogen Free)
450 Units / Tube
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2
FFH60UP60S, FFH60UP60S3
TEST CIRCUIT AND WAVEFORM
VGE Amplitude and
RG Control dlF/dt
t1 and t2 Control IF
L
DUT CURRENT
SENSE
RG
VGE
t1
+
VDD
−
IGBT
t2
Figure 1. Diode Reverse Recovery Test Circuit and Waveform
L = 40 mH
R < 0.1 W
VDD = 50 V
EAVL = 1/2LI2 [VR(AVL) / (VR(AVL) − VDD)]
Q1 = IGBT (BVCES > DUT VR(AVL))
L
Q1
CURRENT
SENSE
DUT
VAVL
R
+
VDD
IL
IL
I V
VDD
−
t0
t1
Figure 2. Unclamped Inductive Switching Test Circuit & Waveform
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3
t2
t
FFH60UP60S, FFH60UP60S3
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 3. Typical Forward Voltage Drop
vs. Forward Current
Figure 4. Typical Reverse Current vs. Reverse
Voltage
Figure 5. Typical Junction Capacitance
Figure 6. Typical Reverse Recovery Time vs. diF/dt
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4
FFH60UP60S, FFH60UP60S3
Figure 7. Typical Reverse Recovery Current vs.
diF/dt
Figure 8. Forward Current Derating Curve
Figure 9. Transient Thermal Response Curve
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5
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TO−247−3LD SHORT LEAD
CASE 340CK
ISSUE A
A
DATE 31 JAN 2019
A
E
P1
P
A2
D2
Q
E2
S
B
D
1
2
D1
E1
2
3
L1
A1
L
b4
c
(3X) b
0.25 M
(2X) b2
B A M
DIM
(2X) e
GENERIC
MARKING DIAGRAM*
AYWWZZ
XXXXXXX
XXXXXXX
XXXX = Specific Device Code
A
= Assembly Location
Y
= Year
WW = Work Week
ZZ
= Assembly Lot Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
DOCUMENT NUMBER:
DESCRIPTION:
98AON13851G
TO−247−3LD SHORT LEAD
A
A1
A2
b
b2
b4
c
D
D1
D2
E
E1
E2
e
L
L1
P
P1
Q
S
MILLIMETERS
MIN NOM MAX
4.58 4.70 4.82
2.20 2.40 2.60
1.40 1.50 1.60
1.17 1.26 1.35
1.53 1.65 1.77
2.42 2.54 2.66
0.51 0.61 0.71
20.32 20.57 20.82
13.08
~
~
0.51 0.93 1.35
15.37 15.62 15.87
12.81
~
~
4.96 5.08 5.20
~
5.56
~
15.75 16.00 16.25
3.69 3.81 3.93
3.51 3.58 3.65
6.60 6.80 7.00
5.34 5.46 5.58
5.34 5.46 5.58
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TO−247−2LD
CASE 340CL
ISSUE A
DATE 03 DEC 2019
GENERIC
MARKING DIAGRAM*
AYWWZZ
XXXXXXX
XXXXXXX
XXXX
A
Y
WW
ZZ
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Assembly Lot Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
DOCUMENT NUMBER:
DESCRIPTION:
98AON13850G
TO−247−2LD
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
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1
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