FFPF30UA60S

FFPF30UA60S UItrafast II Diode 30 A, 600V Description The FFPF30UA60S is a ultrafast II diode with low forward voltage drop. This device is intended for use as freewheeling and clamping diodes in a variety of switching power supplies and other power switching applications. It is specially suited for use in switching power supplies and industrial application. www.onsemi.com Features • • • • • 1 1. Cathode Ultrafast Recovery, tRR = 90 ns (@ IF = 30 A) Max Forward Voltage, VF = 2.2 V (@ TC = 25°C) 600 V Reverse Voltage and High Reliability Avalanche Energy Rated This Device is Pb−Free and is RoHS Compliant 2 2. Anode Applications • Boost Diode in PFC and SMPS • Welder, UPS and Motor Control Application 1 ABSOLUTE MAXIMUM RATINGS TO−220, 2−Lead CASE 221AS TC = 25°C unless otherwise noted Rating Unit VRRM Peak Repetitive Reverse Voltage Parameter 600 V VRWM Working Peak Reverse Voltage 600 V IF(AV) Average Rectified Forward Current @ TC = 43°C 30 A IFSM Non−repetitive Peak Surge Current 60Hz Single Half−Sine Wave 180 A − 65 to +175 °C Symbol TJ, TSTG Operating Junction and Storage Temperature 2 MARKING DIAGRAM Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. $Y&Z&3&K F30UA60S $Y &Z&3 &K F30UA60S = ON Semiconductor Logo = Data Code (Year & Week) = Lot = Specific Device Code ORDERING INFORMATION See detailed ordering and shipping information on page 2 of this data sheet. © Semiconductor Components Industries, LLC, 2009 May, 2019 − Rev. 3 1 Publication Order Number: FFPF30UA60S/D FFPF30UA60S THERMAL CHARACTERISTICS TC = 25°C unless otherwise noted Parameter Symbol RθJC Maximum Thermal Resistance, Junction to Case Max. Unit 2.5 °C/W PACKAGE MARKING AND ORDERING INFORMATION Part Number Top Mark Package Packing Method Reel Size Tape Width Quantity FFPF30UA60S F30UA60S TO−220F−2L Tube N/A N/A 50 ELECTRICAL CHARACTERISTICS TC = 25°C unless otherwise noted Conditions Parameter Min. Typ. Max. Unit VF (Note 1) IF = 30 A IF = 30 A TC = 25°C TC = 125°C − − − − 2.2 2.0 V IR (Note 1) VR = 600 V VR = 600 V TC = 25°C TC = 125°C − − − − 100 150 mA − − − − − − 90 8 360 ns A nC 20 − − mJ tRR IRR QRR WAVL IF = 30 A, diF/dt = 200 A/μs TC = 25°C Avalanche Energy ( L = 40 mH) Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. Pulse: Test Pulse Width = 300 ms, Duty Cycle = 2% Test Circuit and Waveforms Figure 1. Diode Reverse Recovery Test Circuit & Waveform Figure 2. Unclamped Inductive Switching Test Circuit & Waveform www.onsemi.com 2 FFPF30UA60S TYPICAL PERFORMANCE CHARACTERISTICS 100 TC = 25°C TC = 125°C 10 Reverse Current, IR [mA] Forward Current, IF [A] 100 TC = 75°C 1 0.0 0.5 1.0 1.5 2.0 TC = 125°C 10 1 TC = 75°C 0.1 TC = 25°C 0.01 0.001 100 2.5 200 Forward Voltage, VF [V] 500 600 Figure 4. Typical Reverse Current vs. Reverse Voltage 200 200 Reverse Recovery Time, tRR [ns] Typical Capacitance at 0 V = 205 pF Capacitance, CJ [pF] 400 Reverse Voltage, VR [V] Figure 3. Typical Forward Voltage Drop vs. Forward Current 150 100 50 0 0.1 1 10 IF = 30 A 160 TC = 125°C TC = 75°C 120 80 40 100 TC = 25°C 100 200 300 400 500 Reverse Voltage, VR [V] diF/dt [A/ms] Figure 5. Typical Junction Capacitance Figure 6. Typical Reverse Recovery Time vs. diF/dt 40 15 TC = 125°C Average Forward Current, IF(AV) [A] Reverse Recovery Current, IRR [A] 300 TC = 75°C 10 TC = 25°C 5 0 IF = 30 A 100 200 300 400 30 20 10 0 500 25 50 75 100 125 150 175 Case Temperature, TC [°C] diF/dt [A/ms] Figure 7. Typical Reverse Recovery Current vs. diF/dt Figure 8. Forward Current Derating Curve www.onsemi.com 3 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TO−220 Fullpack, 2−Lead / TO−220F−2FS CASE 221AS ISSUE O DOCUMENT NUMBER: DESCRIPTION: 98AON67438E DATE 29 FEB 2012 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. TO−220 FULLPACK, 2−LEAD / TO−220F−2FS PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 www.onsemi.com 1 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative