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onsemi and and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or
subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi
product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without
notice. The information herein is provided “as-is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality,
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liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws,
regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/
or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application
by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized
for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for
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subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative
Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others.
Silicon Carbide Schottky
Diode
650 V, 6 A
FFSM0665B
Silicon Carbide (SiC) Schottky Diodes use a completely new
technology that provides superior switching performance and higher
reliability compared to Silicon. No reverse recovery current,
temperature independent switching characteristics, and excellent
thermal performance sets Silicon Carbide as the next generation of
power semiconductor. System benefits include highest efficiency,
faster operating frequency, increased power density, reduced EMI, and
reduced system size and cost.
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VRRM
IF
650 V
6.0 A
Features
•
•
•
•
•
•
•
Max Junction Temperature 175°C
Avalanche Rated 24.5 mJ
High Surge Current Capacity
Positive Temperature Coefficient
Ease of Paralleling
No Reverse Recovery / No Forward Recovery
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
5. Cathode 3, 4. Anode
1, 2. Floating
Schottky Diode
Pin1
5
Applications
4
• General Purpose
• SMPS, Solar Inverter, UPS
• Power Switching Circuits
3
21
PQFN 8y8, 2P
CASE 483AP
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Peak Repetitive Reverse Voltage
Single Pulse Avalanche Energy (TJ = 25°C,
IL(pk) = 9.9 A, L = 0.5 mH, V = 50 V)
Continuous Rectified Forward
Current
TC < 154
Non−Repetitive Peak Forward
Surge Current
TC = 25°C,
tP = 10 ms
Symbol
Value
Unit
VRRM
650
V
EAS
24.5
mJ
IF
6.0
A
TC < 135
Power Dissipation
IFM
A
292
262
TC = 25°C
tP = 8.3 ms
IFSM
TC = 25°C
Ptot
TC = 150°C
Operating Junction and Storage Temperature
Range
$Y
FFSM
0665B
&Z&K&3
9.1
TC = 150°C,
tP = 10 ms
Non−Repetitive Forward Surge
Current (Half−Sine Pulse)
MARKING DIAGRAM
28
A
75
W
12.5
TJ, Tstg
$Y
FFSM0665B
&Z
&3
&K
= ON Semiconductor Logo
= Specific Device Code
= Assembly Plant Code
= Numeric Date Code
= Lot Code
ORDERING INFORMATION
−55 to
+175
°C
See detailed ordering and shipping information on page 2 of
this data sheet.
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE
Parameter
Thermal Resistance, Junction−to−Case
© Semiconductor Components Industries, LLC, 2019
July, 2020 − Rev. 0
Symbol
Value
Unit
RqJC
2.0
°C/W
1
Publication Order Number:
FFSM0665B/D
FFSM0665B
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
IF = 6.0 A, TJ = 25°C
1.43
1.7
V
IF = 6.0 A, TJ = 125°C
1.62
IF = 6.0 A, TJ = 175°C
1.69
VR = 650 V, TJ = 25°C
0.5
40
mA
VR = 650 V, TJ = 125°C
1.0
80
VR = 650 V, TJ = 175°C
2.0
160
ON CHARACTERISTICS
VF
IR
Forward Voltage
Reverse Current
CHARGES, CAPACITANCES & GATE RESISTANCE
QC
Total Capacitive Charge
Ctot
VC = 400 V
16
nC
VR = 1 V, f = 100 kHz
259
pF
VR = 200 V, f = 100 kHz
29
VR = 400 V, f = 100 kHz
22
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
PART MARKING AND ORDERING INFORMATION
Part Number
Top Mark
Package
Packing Method†
Quantity
FFSM0665B
FFSM0665B
PQFN 8X8, 2P
(Halogen Free)
Tape & Reel
3000 units
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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2
FFSM0665B
TYPICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
1.E−06
TJ = −55o C
10
TJ = 25 o C
TJ = 75 o C
8
I R , REVERSE CURRENT (A)
IF , FORWARD CURRENT (A)
12
TJ = 175 o C
TJ = 125o C
6
4
2
0
0
0.5
1.0
1.5
2.0
2.5
1.E−07
TJ = 175 o C
TJ = 75 o C
TJ = 25 o C
TJ = −55o C
1.E−09
3.0
TJ = 125o C
1.E−08
0
100
V F , FORWARD VOLTAGE (V)
500
600 650
100
P TOT , POWER DISSIPATION (W)
IF , PEAK FORWARD CURRENT (A)
400
Figure 2. Reverse Characteristics
100
80
D = 0.1
60
D = 0.2
D = 0.3
40
D = 0.5
20
D = 0.7
25
50
D=1
75
100
125
150
80
60
40
20
0
175
25
TC , CASE TEMPERATURE ( oC)
50
75
100
125
150
175
TC , CASE TEMPERATURE ( o C)
Figure 3. Current Derating
Figure 4. Power Derating
25
1000
20
CAPACITANCE (pF)
Q C , CAPACITIVE CHARGE (nC)
300
V R , REVERSE VOLTAGE (V)
Figure 1. Forward Characteristics
0
200
15
10
5
0
0
100
200
300
400
500
100
10
600 650
V R , REVERSE VOLTAGE (V)
0.1
1
10
100
V R , REVERSE VOLTAGE (V)
Figure 5. Capacitive Charge vs. Reverse
Voltage
Figure 6. Capacitance vs. Reverse Voltage
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3
650
FFSM0665B
TYPICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
E C , CAPACITIVE ENERGY ( mJ)
6
5
4
3
2
1
0
0
100
200
300
400
500
600 650
V R , REVERSE VOLTAGE (V)
r(t), NORMALIZED EFFECTIVE TRANSIENT
THERMAL RESISTANCE
Figure 7. Capacitance Stored Energy
2
1
DUTY CYCLE−DESCENDING ORDER
D=0.5
0.1
D=0.2
D=0.1
D=0.05
0.01
0.001
D=0.02
D=0.01
SINGLE PULSE
0.000001
0.00001
0.0001
0.001
t, RECTANGULAR PULSE DURATION (sec)
Figure 8. Junction−to−Case Transient Thermal Response
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4
0.01
0.1
FFSM0665B
PACKAGE DIMENSIONS
PQFN4 8X8, 2P
CASE 483AP
ISSUE O
www.onsemi.com
5
FFSM0665B
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Email Requests to: orderlit@onsemi.com
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Phone: 011 421 33 790 2910
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6
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