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FFSP1065B

FFSP1065B

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    TO220-2

  • 描述:

    SIC DIODE TO220 650V

  • 详情介绍
  • 数据手册
  • 价格&库存
FFSP1065B 数据手册
FFSP1065B Silicon Carbide Schottky Diode 650 V, 10 A Silicon Carbide (SiC) Schottky Diodes use a completely new technology that provides superior switching performance and higher reliability compared to Silicon. No reverse recovery current, temperature independent switching characteristics, and excellent thermal performance sets Silicon Carbide as the next generation of power semiconductor. System benefits include highest efficiency, faster operating frequency, increased power density, reduced EMI, and reduced system size and cost. www.onsemi.com ELECTRICAL CONNECTION Features • • • • • • • Max Junction Temperature 175°C Avalanche Rated 49 mJ High Surge Current Capacity Positive Temperature Coefficient Ease of Paralleling No Reverse Recovery / No Forward Recovery These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 1. Cathode 1 Applications 2. Anode 2 TO−220−2LD CASE 340BB • General Purpose • SMPS, Solar Inverter, UPS • Power Switching Circuit MARKING DIAGRAM ABSOLUTE MAXIMUM RATINGS (TC = 25°C, Unless otherwise specified) Symbol VRRM EAS IF IF, Max IF, SM Ptot Parameter Value Unit Peak Repetitive Reverse Voltage 650 V Single Pulse Avalanche Energy (Note 1) 49 mJ Continuous Rectified Forward Current @ TC < 139°C 10 A Continuous Rectified Forward Current @ TC < 135°C 11 Non−Repetitive Peak Forward Surge Current TC = 25°C, 10 ms 650 TC = 150°C, 10 ms 570 Non−Repetitive Forward Surge Current Half−Sine Pulse, tp = 8.3 ms 45 A Power Dissipation TC = 25°C 75 W TC = 150°C 12.5 TJ, TSTG Operating and Storage Temperature Range A $Y&Z&3&K FFSP 1065B $Y &Z &3 &K FFSP1065B = ON Semiconductor Logo = Assembly Plant Code = Numeric Date Code = Lot Code = Specific Device Code ORDERING INFORMATION −55 to +175 °C See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. 1. EAS of 49 mJ is based on starting TJ = 25°C, L = 0.5 mH, IAS = 14 A, V = 50 V. © Semiconductor Components Industries, LLC, 2019 September, 2019 − Rev. 0 1 Publication Order Number: FFSP1065B/D FFSP1065B THERMAL CHARACTERISTICS Symbol Parameter RθJC Thermal Resistance, Junction to Case, Max. Ratings Unit 2.0 °C/W PACKAGE MARKING AND ORDERING INFORMATION Part Number Top Mark Package Packing Method Reel Size Tape Width Quantity FFSP1065B FFSP1065B TO220 Tube N/A N/A 50 Units ELECTRICAL CHARACTERISTICS TC = 25°C unless otherwise noted Parameter Typ. Max. Unit IF = 10 A, TC = 25°C 1.38 1.7 V IF = 10 A, TC = 125°C 1.6 2.0 IF = 10 A, TC = 175°C 1.72 2.4 VR = 650 V, TC = 25°C 0.5 40 VR = 650 V, TC = 125°C 1.0 80 VR = 650 V, TC = 175°C 2.0 160 Total Capacitive Charge V = 400 V 25 nC Total Capacitance VR = 1 V, f = 100 kHz 421 pF VR = 200 V, f = 100 kHz 46 VR = 400 V, f = 100 kHz 35 Symbol VF IR QC C Forward Voltage Reverse Current Test Conditions www.onsemi.com 2 Min. mA FFSP1065B TYPICAL CHARACTERISTICS TJ = 25°C Unless Otherwise Noted 20 −5 10 TJ = 25°C 15 IR, REVERSE CURRENT (A) IF, FORWARD CURRENT (A) TJ = −55°C TJ = 175°C TJ = 125°C 10 TJ = 75°C 5 0 −6 10 TJ = 175°C −7 10 TJ = 125°C 10 TJ = 25°C 1 2 10 3 300 400 500 600 650 VF, FORWARD VOLTAGE (V) VR, REVERSE VOLTAGE (V) Figure 1. Forward Characteristics Figure 2. Reverse Characteristics PTOT, POWER DISSIPATION (W) IF, PEAK FORWARD CURRENT (A) 200 80 D = 0.1 80 D = 0.2 60 D = 0.3 40 D = 0.5 20 D = 0.7 0 25 D=1 50 75 100 125 150 60 40 20 0 25 175 50 75 100 125 150 175 TC, CASE TEMPERATURE (5C) TC, CASE TEMPERATURE (5C) Figure 3. Current Derating Figure 4. Power Dissipation 1000 40 30 CAPACITANCE (pF) QC, CAPACITANCE CHARGE (nC) TJ = −55°C −9 0 100 20 10 0 TJ = 75°C −8 0 100 200 300 400 500 100 10 0.1 600 650 1 10 100 650 VR, REVERSE VOLTAGE (V) VR, REVERSE VOLTAGE (V) Figure 5. Capacitance Charge vs. Reverse Voltage Figure 6. Capacitance vs. Reverse Voltage www.onsemi.com 3 FFSP1065B TYPICAL CHARACTERISTICS TJ = 25°C Unless Otherwise Noted (continued) EC, CAPACITIVE ENERGY (mJ) 10 8 6 4 2 0 0 100 200 300 400 500 600 650 VR, REVERSE VOLTAGE (V) r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE Figure 7. Capacitance Stored Energy 2 1 DUTY CYCLE−DESCENDING ORDER D = 0.5 0.1 D = 0.2 D = 0.1 0.01 D = 0.05 D = 0.02 D = 0.01 SINGLE PULSE 0.001 −6 10 −5 10 −4 −3 10 10 −2 10 t, RECTANGULAR PULSE DURATION (sec) Figure 8. Junction−to−Case Transient Thermal Response Curve TEST CIRCUIT AND WAVEFORMS L = 0.5 mH Figure 9. Unclamped Inductive Switching Test Circuit & Waveform www.onsemi.com 4 −1 10 1 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TO−220−2LD CASE 340BB ISSUE O 4.09 3.50 0.36 M 10.67 9.65 A B A M B 3.43 2.54 7° 3° 5° 3° 1 2 8.89 6.86 1.40 0.51 16.51 14.22 9.40 8.38 DATE 31 AUG 2016 6.86 5.84 5° 3° 16.15 15.75 13.40 12.19 6.35 MAX 0.60 MAX C 14.73 13.60 1.65 1.25 1.91 0.61 0.33 2.54 5.08 2.92 2.03 1.02 0.38 0.36 M 5° 3° 5° 3° 4.80 4.30 DOCUMENT NUMBER: DESCRIPTION: 98AON13832G TO−220−2LD C A B NOTES: A. PACKAGE REFERENCE: JEDEC TO220,ISSUE K, VARIATION AC,DATED APRIL 2002. B. ALL DIMENSIONS ARE IN MILLIMETERS. C. DIMENSION AND TOLERANCE AS PER ASME Y14.5−2009. D. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH AND TIE BAR PROTRUSIONS. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative
FFSP1065B
物料型号:FFSP1065B

器件简介: - 这是一种650V、10A的碳化硅(SiC)肖特基二极管。 - 碳化硅技术提供了比硅更优越的开关性能和更高的可靠性。 - 该二极管没有反向恢复电流,具有温度无关的开关特性和出色的热性能。 - 系统优势包括最高效率、更快的运行频率、增加的功率密度、减少的电磁干扰(EMI)和减小的系统尺寸及成本。

引脚分配: - 1. 阴极 - 2. 阳极

参数特性: - 最大结温:175°C - 雪崩额定值:49 mJ - 高浪涌电流容量 - 正温度系数 - 易于并联 - 无反向恢复/无正向恢复 - 这些设备是无铅、无卤素/无溴化物自由,符合RoHS标准

功能详解: - 适用于一般用途、开关电源(SMPS)、太阳能逆变器、不间断电源(UPS)的功率开关电路。

应用信息: - 适用于一般用途、SMPS、太阳能逆变器、UPS功率开关电路。

封装信息: - 封装类型:TO-220-2LD - 封装标记:FFSP1065B - 包装方法:管装 - 卷带宽度:N/A - 每卷数量:50单位

电气特性(在25°C下,除非另有说明): - 正向电压(VF):在10A、25°C时,典型值为1.38V至1.7V - 反向电流(IR):在650V、25°C时,典型值为0.5A至40A - 总电容电荷(Qc):在400V时,典型值为25nC - 总电容(C):在1V、100kHz时,典型值为421pF

热特性: - 最大结到外壳的热阻(ReJC):2.0°C/W

机械案例轮廓和封装尺寸: - 遵循JEDEC TO220标准,尺寸和公差按照ASME Y14.5-2009标准。

版权和免责声明: - ON Semiconductor保留随时更改任何产品的权利,不保证产品适用于任何特定用途,不承担因产品应用或使用引起的任何责任。

订购信息: - 详细的订购和运输信息在数据手册的第2页的封装尺寸部分中提供。

测试电路和波形: - 提供了无缓冲感性开关测试电路和波形图。

典型特性图表: - 提供了正向特性、反向特性、电流降额、功耗、电容电荷与反向电压、电容与反向电压、存储电容能量与反向电压、结到外壳瞬态热响应曲线等图表。

机械案例轮廓和封装尺寸图: - 提供了TO-220-2LD封装的机械案例轮廓和尺寸图。

版权和商标信息: - ON Semiconductor及其相关名称、商标和品牌是Semiconductor Components Industries, LLC dba ON Semiconductor或其子公司在美国和/或其他国家的注册和/或普通法商标。

技术支持和订购信息: - 提供了北美技术支持、欧洲、中东和非洲技术支持的联系方式,以及文献履行的电子邮件请求地址。

公司声明: - ON Semiconductor声明其产品不适用于作为生命支持系统或任何FDA 3类医疗设备或外国司法管辖区具有相同或类似分类的医疗设备的关键组件,也不适用于任何旨在植入人体的设备。如果购买者购买或使用ON Semiconductor产品用于任何此类非预期或未经授权的应用,购买者应赔偿并使ON Semiconductor及其官员、员工、子公司、关联公司和分销商免受所有索赔、成本、损害和费用以及合理的律师费用,这些索赔、成本、损害和费用直接或间接地与此类非预期或未经授权的使用相关的人身伤害或死亡索赔有关,即使此类索赔声称ON Semiconductor在设计或制造部件方面存在疏忽。
FFSP1065B 价格&库存

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FFSP1065B
  •  国内价格 香港价格
  • 1+29.829461+3.58055
  • 50+16.3270850+1.95981
  • 100+14.94283100+1.79365
  • 500+12.48108500+1.49816
  • 1000+12.019331000+1.44273

库存:628

FFSP1065B
  •  国内价格
  • 50+11.18281
  • 100+10.95904
  • 200+10.74032

库存:764

FFSP1065B
  •  国内价格
  • 2+18.46926
  • 14+17.91741
  • 26+17.37568

库存:764

FFSP1065B

库存:764