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FGA3060ADF

FGA3060ADF

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    TO-3P-3

  • 描述:

    IGBT600V60A176WTO-3PN

  • 详情介绍
  • 数据手册
  • 价格&库存
FGA3060ADF 数据手册
Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. FGA3060ADF 600 V, 30 A Field Stop Trench IGBT Features General Description o • Maximum Junction Temperature : TJ = 175 C This ADF IGBT series adopted Field Stop Trench 3rd generation IGBT which offer extreme low Vce(sat) and much faster switching characteristics for outstanding efficiency. And this kind of technology is fully optimized to variety PFC (Power Factor Correction) topology ; Single boost, Multi channel interleaved etc with over 20KHz switching performance. TO3P package provide Super Low thermal resistance for much wider SOA for system stability. • Positive Temperaure Co-efficient for Easy Parallel Operating • High Current Capability • Low Saturation Voltage: VCE(sat) = 1.8 V(Typ.) @ IC = 30 A • 100% of the Parts Tested for ILM(1) • High Input Impedance • Fast Switching • Tighten Parameter Distribution Applications • RoHS Compliant • PFC topology for Home appliance : Single Boost , Multi channel Interleaved etc. C G G C TO-3PN E E Absolute Maximum Ratings Symbol VCES VGES IC Description FGA3060ADF Unit Collector to Emitter Voltage 600 V Gate to Emitter Voltage  20 V  30 V Collector Current @ TC = 25oC 60 A o Transient Gate to Emitter Voltage Collector Current @ TC = 100 C 30 A ILM (1) Pulsed Collector Current @ TC = 25oC 90 A ICM (2) Pulsed Collector Current 90 A 3 A 1.5 A 6 A W IF (3) IFM (2) PD Diode Forward Current @ TC = 25oC Diode Forward Current o @ TC = 100 C Pulsed Diode Maximum Forward Current o Maximum Power Dissipation @ TC = 25 C 176 Maximum Power Dissipation @ TC = 100oC 88 W TJ Operating Junction Temperature -55 to +175 o Tstg Storage Temperature Range -55 to +175 o C TL Maximum Lead Temp. for soldering Purposes, 1/8” from case for 5 seconds 300 o C C Notes: 1. VCC = 400 V, VGE = 15 V, IC = 90 A, RG = 120  Inductive Load. 2. Repetitive rating: Pulse width limited by max. junction temperature. 3. The purpose of diode is protection for negative voltage. ©2015 Fairchild Semiconductor Corporation FGA3060ADF Rev. 1.0 1 www.fairchildsemi.com FGA3060ADF — 600 V, 30 A Field Stop Trench IGBT July 2015 Symbol Parameter FGA3060ADF Unit o RJC(IGBT) Thermal Resistance, Junction to Case, Max. 0.85 RJC(Diode) Thermal Resistance, Junction to Case, Max. 5 oC/W C/W RJA Thermal Resistance, Junction to Ambient, Max. 40 oC/W Package Marking and Ordering Information Part Number Top Mark Package Packing Method Reel Size Tape Width Quantity FGA3060ADF FGA3060ADF TO-3PN Tube - - 30 Electrical Characteristics of the IGBT Symbol Parameter TC = 25°C unless otherwise noted Test Conditions Min. Typ. Max. Unit 600 - - V - 0.52 - V/oC Off Characteristics BVCES Collector to Emitter Breakdown Voltage VGE = 0 V, IC = 1 mA BVCES TJ Temperature Coefficient of Breakdown Voltage ICES Collector Cut-Off Current VCE = VCES, VGE = 0 V - - 250 A IGES G-E Leakage Current VGE = VGES, VCE = 0 V - - ±400 nA IC = 30 mA, VCE = VGE IC = 1 mA, Reference to 25oC On Characteristics VGE(th) VCE(sat) G-E Threshold Voltage Collector to Emitter Saturation Voltage 4.1 5.6 7.6 V IC = 30 A, VGE = 15 V - 1.8 2.3 V IC = 30 A, VGE = 15 V, TC = 175oC - 2.4 - V - 1072 - pF VCE = 30 V, VGE = 0 V, f = 1MHz - 36 - pF - 13 - pF - 12 - ns Dynamic Characteristics Cies Input Capacitance Coes Output Capacitance Cres Reverse Transfer Capacitance Switching Characteristics td(on) Turn-On Delay Time tr Rise Time - 19.2 - ns td(off) Turn-Off Delay Time - 42.4 - ns tf Fall Time Eon Turn-On Switching Loss Eoff Turn-Off Switching Loss - 165 - uJ Ets Total Switching Loss - 1125 - uJ td(on) Turn-On Delay Time - 12.8 - ns tr Rise Time - 27.2 - ns td(off) Turn-Off Delay Time tf Fall Time Eon Turn-On Switching Loss Eoff Turn-Off Switching Loss Ets Total Switching Loss ©2015 Fairchild Semiconductor Corporation FGA3060ADF Rev. 1.0 VCC = 400 V, IC = 30 A, RG = 6 , VGE = 15 V, Inductive Load, TC = 25oC VCC = 400 V, IC = 30 A, RG = 6 , VGE = 15 V, Inductive Load, TC = 175oC 2 - 7.2 - ns - 960 - uJ - 46.4 - ns - 12.8 - ns - 1430 - uJ - 310 - uJ - 1740 - uJ www.fairchildsemi.com FGA3060ADF — 600 V, 30 A Field Stop Trench IGBT Thermal Characteristics Symbol Parameter Qg Total Gate Charge Qge Gate to Emitter Charge Qgc Gate to Collector Charge Test Conditions VCE = 400 V, IC = 30 A, VGE = 15 V Electrical Characteristics of the Diode Symbol Parameter VFM Diode Forward Voltage Erec Reverse Recovery Energy trr Diode Reverse Recovery Time Qrr Diode Reverse Recovery Charge ©2015 Fairchild Semiconductor Corporation FGA3060ADF Rev. 1.0 (Continued) Min. Typ. Max Unit - 37.4 - nC - 7.2 - nC - 15 - nC Unit TC = 25°C unless otherwise noted Test Conditions IF = 3 A Min. Typ. Max TC = 25oC - 1.6 2.3 TC = 175oC - 1.4 - TC = 175oC - 29.7 - 25oC T = IF = 3 A, dIF/dt = 200 A/s, C o T VR = 400 V C = 175 C 3 - 26 - - 153 - TC = 25oC - 35 - TC = 175oC - 305 - V uJ ns nC www.fairchildsemi.com FGA3060ADF — 600 V, 30 A Field Stop Trench IGBT Electrical Characteristics of the IGBT Figure 1. Typical Output Characteristics 90 o TC = 25 C 10V 60 45 VGE = 8V 45 0 1 2 3 4 5 Collector-Emitter Voltage, VCE [V] 0 6 Common Emitter VGE = 15V o TC = 25 C o TC = 175 C 60 45 30 15 0 1 2 3 4 Collector-Emitter Voltage, VCE [V] 5 Common Emitter VGE = 15V 3 60A 30A 2 IC = 15A Figure 6. Saturation Voltage vs. VGE 20 Common Emitter Common Emitter o o Collector-Emitter Voltage, VCE [V] TC = 25 C 16 12 IC = 15A 8 30A 60A 4 4 8 12 16 Gate-Emitter Voltage, VGE [V] ©2015 Fairchild Semiconductor Corporation FGA3060ADF Rev. 1.0 6 1 -100 -50 0 50 100 150 200 o Collector-Emitter Case Temperature, TC [ C] Figure 5. Saturation Voltage vs. VGE 20 1 2 3 4 5 Collector-Emitter Voltage, VCE [V] Figure 4. Saturation Voltage vs. Case Temperature at Variant Current Level Collector-Emitter Voltage, VCE [V] Collector Current, IC [A] 0 4 75 Collector-Emitter Voltage, VCE [V] VGE = 8V 30 90 0 10V 15 Figure 3. Typical Saturation Voltage Characteristics 0 12V 60 15 0 15V 75 12V 30 20V o TC = 175 C Collector Current, IC [A] Collector Current, IC [A] 90 20V 15V 75 Figure 2. Typical Output Characteristics TC = 175 C 16 12 30A 8 IC = 15A 4 0 20 4 60A 4 8 12 16 Gate-Emitter Voltage, VGE [V] 20 www.fairchildsemi.com FGA3060ADF — 600 V, 30 A Field Stop Trench IGBT Typical Performance Characteristics Figure 7. Capacitance Characteristics Figure 8. Gate charge Characteristics 15 10000 Common Emitter Gate-Emitter Voltage, VGE [V] Capacitance [pF] o Cies 1000 100 Coes Common Emitter VGE = 0V, f = 1MHz o 300V 9 10 Collector-Emitter Voltage, VCE [V] 3 30 Figure 9. Turn-on Characteristics vs. Gate Resistance 0 8 16 24 Gate Charge, Qg [nC] 40 1000 tr td(on) 10 td(off) Switching Time [ns] Switching Time [ns] 32 Figure 10. Turn-off Characteristics vs. Gate Resistance 100 Common Emitter VCC = 400V, VGE = 15V IC = 30A 100 tf Common Emitter VCC = 400V, VGE = 15V IC = 30A 10 o o TC = 25 C TC = 25 C o o TC = 175 C TC = 175 C 5 400V 6 0 1 VCC = 200V Cres TC = 25 C 10 TC = 25 C 12 0 10 20 30 40 50 60 Gate Resistance, RG [] 70 1 80 Figure 11. Switching Loss vs. Gate Resistance 0 10 20 30 40 50 60 Gate Resistance, RG [] 70 80 Figure 12. Turn-on Characteristics vs. Collector Current 300 5000 Switching Time [ns] Switching Loss [uJ] 100 Eon 1000 Eoff Common Emitter VCC = 400V, VGE = 15V IC = 30A 10 td(on) Common Emitter VGE = 15V, RG = 6 o o TC = 25 C TC = 25 C 100 o o TC = 175 C TC = 175 C 50 tr 0 10 20 30 40 50 60 Gate Resistance, RG [] ©2015 Fairchild Semiconductor Corporation FGA3060ADF Rev. 1.0 1 70 80 0 15 30 45 60 75 90 Collector Current, IC [A] 5 www.fairchildsemi.com FGA3060ADF — 600 V, 30 A Field Stop Trench IGBT Typical Performance Characteristics Figure 13. Turn-off Characteristics vs. Collector Current Figure 14. Switching Loss vs. Collector Current 10000 300 Eon 100 10 Switching Loss [uJ] Switching Time [ns] td(off) tf Common Emitter VGE = 15V, RG = 6 1000 Eoff 100 Common Emitter VGE = 15V, RG = 6 o TC = 25 C o TC = 25 C o TC = 175 C o 1 TC = 175 C 0 15 30 45 60 Collector Current, IC [A] 10 75 0 90 15 30 45 60 75 90 Collector Current, IC [A] Figure 15. Load Current Vs. Frequency Figure 16. SOA Characteristics 100 150 Square Wave o 10s VGE = 15/0V, RG = 6 Collector Current, Ic [A] Collector Current, [A] TJ
FGA3060ADF
物料型号:FGA3060ADF

器件简介:FGA3060ADF是一款600V,30A的Field Stop Trench IGBT,采用第三代IGBT技术,具有极低的饱和压降和快速开关特性,适用于多种PFC拓扑。

引脚分配:文档中未明确列出引脚分配,但通常TO-3PN封装的IGBT有3个引脚:集电极(C)、发射极(E)和栅极(G)。

参数特性: - 最大结温:TJ = 175°C - 正温度系数,便于并联操作 - 高电流能力 - 低饱和电压:VCE(sat) = 1.8V(典型值) @ IC = 30A - 100%测试脉冲集电极电流:ILM - 高输入阻抗 - 快速开关 - 紧密的参数分布 - 符合RoHS标准

功能详解:FGA3060ADF IGBT适用于家电的PFC拓扑,如单升压、多通道交错等。

应用信息:适用于家电的PFC拓扑,包括单升压和多通道交错等。

封装信息:TO-3PN封装,提供超低热阻,为系统稳定性提供更宽的安全工作区(SOA)。

电气特性包括但不限于: - 关断特性:如集电极-发射极击穿电压(BVCES)、集电极截止电流(ICES)等 - 开启特性:如G-E阈值电压(VGE(th))、集电极-发射极饱和电压(VCE(sat))等 - 动态特性:如输入电容(Cies)、输出电容(Coes)、反向传输电容(Cres) - 开关特性:如开通延迟时间(td(an))、上升时间、关断延迟时间(td(of))、下降时间等

热特性包括: - 最大结到外壳热阻(ReJc(IGBT))、二极管结到外壳热阻(Rec(Diode))、结到环境热阻(ROJA)
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