FGB40N60SM

FGB40N60SM

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    SOT404

  • 描述:

    FGB40N60SM

  • 数据手册
  • 价格&库存
FGB40N60SM 数据手册
FGB40N60SM 600 V, 40 A Field Stop IGBT Features General Description • Maximum Junction Temperature : TJ =175oC Using novel field stop IGBT technology, Fairchild’s new series of field stop 2nd generation IGBTs offer the optimum performance for welder and PFC applications where low conduction and switching losses are essential. • Positive Temperaure Co-efficient for Easy Parallel Operating • High Current Capability • Low Saturation Voltage: VCE(sat) = 1.9 V(Typ.) @ IC = 40 A • High Input Impedance • Fast Switching • Tighten Parameter Distribution • RoHS Compliant • IR Reflow Only Applications • Welder, PFC C C COLLECTOR (FLANGE) G TO-263AB/D2-PAK G E E Absolute Maximum Ratings Symbol VCES VGES IC ICM (1) PD Description Ratings Unit Collector to Emitter Voltage 600 V Gate to Emitter Voltage ± 20 V Transient Gate to Emitter Voltage Collector Current @ TC = 25oC Collector Current @ TC = 100oC Pulsed Collector Current o ± 30 V 80 A 40 A 120 A Maximum Power Dissipation @ TC = 25 C 349 W Maximum Power Dissipation @ TC = 100oC 174 W TJ Operating Junction Temperature -55 to +175 o Tstg Storage Temperature Range -55 to +175 oC TL Maximum Lead Temp. for soldering Purposes, 1/8” from case for 5 seconds 300 o C C Notes: 1: Repetitive rating: Pulse width limited by max. junction temperature ©2011 Fairchild Semiconductor Corporation FGB40N60SM Rev. C2 1 www.fairchildsemi.com FGB40N60SM — 600 V, 40 A Field Stop IGBT September 2013 Symbol Parameter Typ. Max. Unit RθJC(IGBT) Thermal Resistance, Junction to Case - 0.43 oC/W RθJA Thermal Resistance, Junction to Ambient - 62.5 o C/W Package Marking and Ordering Information Device Marking FGB40N60SM Device FGB40N60SM Package Tape Width Quantity - - 50 TO-263AB(D -PAK) Electrical Characteristics of the IGBT Symbol Reel Size 2 Parameter TC = 25°C unless otherwise noted Test Conditions Min. Typ. Max. Unit 600 - - V Off Characteristics BVCES Collector to Emitter Breakdown Voltage VGE = 0V, IC = 250μA ΔBVCES ΔTJ Temperature Coefficient of Breakdown Voltage VGE = 0V, IC = 250μA - 0.6 - V/oC ICES Collector Cut-Off Current VCE = VCES, VGE = 0V - - 250 μA IGES G-E Leakage Current VGE = VGES, VCE = 0V - - ±400 nA 3.5 4.5 6.0 V On Characteristics VGE(th) G-E Threshold Voltage IC = 250μA, VCE = VGE IC = 40A, VGE = 15V - 1.9 2.3 V VCE(sat) Collector to Emitter Saturation Voltage IC = 40A, VGE = 15V, TC = 175oC - 2.1 - V - 1880 - pF Dynamic Characteristics Cies Input Capacitance Coes Output Capacitance Cres Reverse Transfer Capacitance VCE = 30V, VGE = 0V, f = 1MHz - 180 - pF - 50 - pF Switching Characteristics td(on) Turn-On Delay Time - 12 16 ns tr Rise Time - 20 28 ns td(off) Turn-Off Delay Time - 92 120 ns tf Fall Time - 13 17 ns Eon Turn-On Switching Loss - 0.87 1.30 mJ Eoff Turn-Off Switching Loss - 0.26 0.34 mJ VCC = 400V, IC = 40A, RG = 6Ω, VGE = 15V, Inductive Load, TC = 25oC Ets Total Switching Loss - 1.13 1.64 mJ td(on) Turn-On Delay Time - 15 - ns tr Rise Time - 22 - ns td(off) Turn-Off Delay Time - 116 - ns tf Fall Time Eon Turn-On Switching Loss Eoff Turn-Off Switching Loss - 0.60 - mJ Ets Total Switching Loss - 1.57 - mJ ©2011 Fairchild Semiconductor Corporation FGB40N60SM Rev. C2 VCC = 400V, IC = 40A, RG = 6Ω, VGE = 15V, Inductive Load, TC = 175oC 2 - 16 - ns - 0.97 - mJ www.fairchildsemi.com FGB40N60SM — 600 V, 40 A Field Stop IGBT Thermal Characteristics Symbol Qg Parameter (Continued) Test Conditions Total Gate Charge Qge Gate to Emitter Charge Qgc Gate to Collector Charge ©2011 Fairchild Semiconductor Corporation FGB40N60SM Rev. C2 VCE = 400V, IC = 40A, VGE = 15V 3 Min. Typ. Max Unit - 119 180 nC - 13 20 nC - 58 90 nC www.fairchildsemi.com FGB40N60SM — 600 V, 40 A Field Stop IGBT Electrical Characteristics of the IGBT Figure 1. Typical Output Characteristics 120 o TC = 25 C 20V 15V 120 TC = 175 C Collector Current, IC [A] 80 60 VGE = 8V 60 20 0 0 2 4 Collector-Emitter Voltage, VCE [V] 0 6 Figure 3. Typical Saturation Voltage Characteristics 2 4 Collector-Emitter Voltage, VCE [V] 6 Figure 4. Saturation Voltage vs. Case Temperature at Variant Current Level 3.0 120 Collector-Emitter Voltage, VCE [V] Common Emitter VGE = 15V 100 Collector Current, IC [A] VGE = 8V 40 0 o TC = 25 C o TC = 175 C 80 60 40 20 0 1 2 3 Collector-Emitter Voltage, VCE [V] Common Emitter VGE = 15V 80A 2.5 2.0 40A 1.5 IC = 20A 1.0 25 0 4 Figure 5. Saturation Voltage vs. VGE 50 75 100 125 150 o Case Temperature, TC [ C] 175 Figure 6. Saturation Voltage vs. VGE 20 20 Common Emitter Common Emitter o TC = 25 C Collector-Emitter Voltage, VCE [V] Collector-Emitter Voltage, VCE [V] 10V 80 20 16 12 8 40A 80A 4 IC = 20A 0 12V 100 10V 40 20V 15V o 12V 100 Collector Current, IC [A] Figure 2. Typical Output Characteristics o TC = 175 C 16 12 8 80A 4 40A IC = 20A 0 4 8 12 16 Gate-Emitter Voltage, VGE [V] ©2011 Fairchild Semiconductor Corporation FGB40N60SM Rev. C2 4 20 4 8 12 16 Gate-Emitter Voltage, VGE [V] 20 www.fairchildsemi.com FGB40N60SM — 600 V, 40 A Field Stop IGBT Typical Performance Characteristics Figure 7. Capacitance Characteristics Figure 8. Gate charge Characteristics 15 4000 Common Emitter Common Emitter VGE = 0V, f = 1MHz Gate-Emitter Voltage, VGE [V] o o TC = 25 C Capacitance [pF] 3000 Cies 2000 1000 Coes TC = 25 C 400V 12 VCC = 200V 300V 9 6 3 Cres 0 0.1 0 1 10 Collector-Emitter Voltage, VCE [V] 0 30 Figure 9. Turn-on Characteristics vs. Gate Resistance 40 80 Gate Charge, Qg [nC] Figure 10. Turn-off Characteristics vs. Gate Resistance 1000 100 tr td(off) Switching Time [ns] Switching Time [ns] 120 td(on) 10 Common Emitter VCC = 400V, VGE = 15V IC = 40A 100 tf Common Emitter VCC = 400V, VGE = 15V IC = 40A 10 o TC = 25 C o TC = 25 C o TC = 175 C o TC = 175 C 1 1 0 10 20 30 40 Gate Resistance, RG [Ω] 50 0 10 20 30 40 50 Gate Resistance, RG [Ω] Figure 11. Switching Loss vs. Gate Resistance Figure 12. Turn-on Characteristics vs. Collector Current 1000 5 Common Emitter VGE = 15V, RG = 6Ω o Switching Time [ns] Switching Loss [mJ] TC = 25 C Eon 1 Eoff Common Emitter VCC = 400V, VGE = 15V IC = 40A o 100 TC = 175 C tr 10 td(on) o TC = 25 C o TC = 175 C 0.1 0 10 20 30 40 Gate Resistance, RG [Ω] ©2011 Fairchild Semiconductor Corporation FGB40N60SM Rev. C2 1 20 50 30 40 50 60 70 80 Collector Current, IC [A] 5 www.fairchildsemi.com FGB40N60SM — 600 V, 40 A Field Stop IGBT Typical Performance Characteristics Figure 13. Turn-off Characteristics vs. Collector Current Figure 14. Switching Loss vs. Collector Current 6 1000 Switching Loss [mJ] Switching Time [ns] td(off) 100 tf 10 Common Emitter VGE = 15V, RG = 6Ω Eon 1 Eoff Common Emitter VGE = 15V, RG = 6Ω o o TC = 25 C TC = 25 C o o TC = 175 C TC = 175 C 1 20 30 40 50 60 70 0.1 20 80 30 Collector Current, IC [A] Figure 15. Load Current Vs. Frequency 50 60 70 80 Figure 16. SOA Characteristics 300 100 Vcc = 600 V Load Current : peak of square wave Duty cycle : 50% 80 100μs o 70 Tc = 100 C Power Dissipation : 174W 60 50 o Tc = 100 C 40 10μs 100 Collector Current, Ic [A] 90 Collector Current, IC [A] 40 Collector Current, IC [A] 30 20 1ms 10 ms 10 DC 1 *Notes: 0.1 o 1. TC = 25 C o 2. TJ = 175 C 3. Single Pulse 10 0.01 0 1k 10k 100k Switching Frequency, f [Hz] 1 1M 10 100 Collector-Emitter Voltage, VCE [V] 1000 Figure 17. Transient Thermal Impedance of IGBT Thermal Response [Zthjc] 1 0.5 0.1 0.01 0.2 0.1 0.05 0.02 0.01 single pulse PDM t1 t2 Duty Factor, D = t1/t2 Peak Tj = Pdm x Zthjc + TC 0.001 -5 10 -4 10 -3 -2 10 10 -1 10 0 10 Rectangular Pulse Duration [sec] ©2011 Fairchild Semiconductor Corporation FGB40N60SM Rev. C2 6 www.fairchildsemi.com FGB40N60SM — 600 V, 40 A Field Stop IGBT Typical Performance Characteristics FGB40N60SM — 600 V, 40 A Field Stop IGBT Mechanical Dimensions Figure 18. TO-263 2L (D2PAK) - 2LD,TO263, SURFACE MOUNT Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TT263-002 Dimensions in Millimeters ©2011 Fairchild Semiconductor Corporation FGB40N60SM Rev. C2 7 www.fairchildsemi.com TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. 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DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are 2. A critical component in any component of a life support, device, or intended for surgical implant into the body or (b) support or sustain system whose failure to perform can be reasonably expected to life, and (c) whose failure to perform when properly used in cause the failure of the life support device or system, or to affect its accordance with instructions for use provided in the labeling, can be safety or effectiveness. reasonably expected to result in a significant injury of the user. ANTI-COUNTERFEITING POLICY Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com, under Sales Support. Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Advance Information Formative / In Design Preliminary First Production No Identification Needed Full Production Obsolete Not In Production Definition Datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only. Rev. I68 © Fairchild Semiconductor Corporation www.fairchildsemi.com
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