FGPF30N30

FGPF30N30

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    SOT78

  • 描述:

    FGPF30N30

  • 详情介绍
  • 数据手册
  • 价格&库存
FGPF30N30 数据手册
FGPF30N30 300V, 30A PDP IGBT Features General Description • High Current Capability Employing Unified IGBT Technology, Fairchild's PDP IGBTs provides low conduction and switching loss. FGPF30N30 offers the optimum solution for PDP applications where low-condution loss is essential. • Low saturation voltage: VCE(sat) =1.4V @ IC = 20A • High Input Impedance • Fast switching • RoHS Complaint Application . PDP System TO-220F 1 1.Gate 2.Collector 3.Emitter Absolute Maximum Ratings Symbol Description VCES Collector-Emitter Voltage FGPF30N30 Units 300 V ± 30 V 80 A @ TC = 25oC 46 W @ TC = 100oC 18.5 VGES Gate-Emitter Voltage IC pulse(1) Pulsed Collector Current @ TC = 25oC PD Maximum Power Dissipation Maximum Power Dissipation W TJ Operating Junction Temperature -55 to +150 o Tstg Storage Temperature Range -55 to +150 oC TL Maximum Lead Temp. for soldering Purposes, 1/8” from case for 5 seconds o 300 C C Thermal Characteristics Symbol RθJC(IGBT) RθJA Parameter Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Ambient Typ. Max. -- 2.7 -- 62.5 Units o C/W oC/W Notes: (1)Repetitive test , pluse width = 100usec , Duty = 0.1 * Ic_pluse limited by max Tj ©2006 Fairchild Semiconductor Corporation FGPF30N30 Rev. A 1 www.fairchildsemi.com FGPF30N30 300V, 30A PDP IGBT February 2009 Device Marking Device Package Packaging Type FGPF30N30 FGPF30N30TU TO-220F Rail / Tube Electrical Characteristics T C Symbol Max Qty Qty per Tube per Box 50ea - = 25oC unless otherwise noted Parameter Test Conditions Min. Typ. Max. Units Off Characteristics BVCES Collector-Emitter Breakdown Voltage VGE = 0V, IC = 250uA 300 -- -- V ∆BVCES/ ∆TJ Temperature Coefficient of Breakdown Voltage VGE = 0V, IC = 250uA -- 0.6 -- V/oC ICES Collector Cut-Off Current VCE = VCES, VGE = 0V -- -- 100 uA IGES G-E Leakage Current VGE = VGES, VCE = 0V -- -- ± 250 nA 2.5 4.0 5.0 V On Characteristics VGE(th) VCE(sat) G-E Threshold Voltage Collector to Emitter Saturation Voltage IC = 250uA, VCE = VGE IC =10A, VGE = 15V -- 1.2 1.5 V IC =20A, VGE = 15V -- 1.4 -- V IC = 30A, VGE = 15V TC = 25oC -- 1.8 -- V IC = 30A, VGE = 15V TC = 125oC -- 1.9 -- V -- 685 -- pF VCE = 30V, VGE = 0V f = 1MHz -- 95 -- pF -- 30 -- pF Dynamic Characteristics Cies Input Capacitance Coes Output Capacitance Cres Reverse Transfer Capacitance Switching Characteristics td(on) Turn-On Delay Time tr Rise Time td(off) Turn-Off Delay Time tf Fall Time td(on) Turn-On Delay Time tr Rise Time td(off) Turn-Off Delay Time tf Fall Time Qg Total Gate Charge Qge Gate-Emitter Charge Qgc Gate-Collector Charge VCC = 200 V, IC = 20A RG = 20Ω, VGE = 15V Resistive Load, TC = 25oC VCC = 200 V, IC = 20A RG = 20Ω, VGE = 15V Resistive Load, TC = 125oC VCE = 200 V, IC = 20A VGE = 15V 2 FGPF30N30 Rev. A -- 10 -- ns -- 44 -- ns -- 76 -- ns -- 180 300 ns -- 10 - ns -- 46 -- ns -- 82 -- ns -- 270 -- ns -- 39 -- nC -- 6 -- nC -- 16 -- nC www.fairchildsemi.com FGPF30N30 300V, 30A PDP IGBT Package Marking and Ordering Information FGPF30N30 300V, 30A PDP IGBT Typical Performance CharacteristicsTypical Saturation VoltageCharacteristics Figure 1. Typical Output Characteristics 80 80 o o TC = 25 C 20V 12V 15V 10V 60 50 40 30 VGE = 8V 20 12V 15V 10V 60 50 40 VGE = 8V 30 20 10 10 0 0 0 2 4 6 8 Collector-Emitter Voltage, VCE [V] 0 10 Figure 3. Saturation Voltage 2 4 6 8 Collector-Emitter Voltage, VCE [V] 10 Figure 4. Transfer Characteristics 80 80 Common Emitter VCE = 20V Common Emitter VGE = 15V o o TC = 25 C 60 Collector Current,IC [A] Collector Current, IC [A] TC = 125 C 20V 70 Collector Current, IC [A] 70 Collector Current, IC [A] Figure 2. Typical Output Characteristics o TC = 125 C 40 20 T C = 25 C 60 T = 125oC C 40 20 0 0 0 2 4 Collector-Emitter Voltage, VCE [V] 0 6 Figure 5. Saturation Voltage vs. Case Temperature at Variant Current Level 2 4 6 8 10 12 14 Gate-Emitter Voltage,VGE [V] 16 Figure 6. Saturation Voltage vs.VGE 20 2.0 Collector-Emitter Voltage, VCE [V] Collector-Emitter Voltage, VCE [V] Common Emitter 30A 1.5 20A 10A 1.0 Common Emitter VGE = 15V 0.5 25 50 75 100 o Case Temperature, TC [ C] C 12 20A 8 IC = 10A 4 30A 0 0 125 3 FGPF30N30 Rev. A o T = 25 C 16 4 8 12 16 Gate-Emitter Voltage, VGE [V] 20 www.fairchildsemi.com (Continued) Figure 7. Saturation Voltage vs.VGE Figure 8. Capacitance Characteristics 20 2500 Common Emitter 12 8 Coes 100 Cres 30A 4 Common Emitter VGE = 0V, f = 1MHz 20A o TC = 25 C IC = 10A 0 0 10 4 8 12 16 Gate-Emitter Voltage, VGE [V] 0 20 Figure 9. Gate Charge Characteristics 5 10 15 20 25 Collector-Emitter Voltage, VCE [V] 200 100 Common Emitter RL = 10Ω 50us o TC = 25 C 12 100us Collector Current, Ic [A] 200V Vcc = 100V 9 6 3 0 0 8 16 24 Gate Charge, Qg [nC] 32 1ms 10 DC Operation 1 Single Nonrepetitive o Pulse Tc=25 C Curves must be derated linearly with increase in temperature 0.1 0.01 0.1 40 Figure 11. Turn-On Characteristics vs. Gate Resistance 1 10 100 Collector-Emitter Voltage, V CE [V] 1000 Figure 12. Turn Off Characteristics vs. Gate Resistance 1000 100 Switching Time [ns] tr Switching Time [ns] 30 Figure 10. SOA Characteristics 15 Gate-Emitter Voltage, VGE [V] Cies 1000 C Capacitance [pF] Collector-Emitter Voltage, VCE [V] o T = 125 C 16 FGPF30N30 300V, 30A PDP IGBT Typical Performance Characteristics td(on) 10 Common Emitter VCC = 200V, VGE = 15V IC = 20A tf td(off) 100 Common Emitter V CC = 200V, V GE = 15V IC = 20A o TC = 25 C o T C = 25 C o TC = 125 C o T C = 125 C 10 1 0 20 40 60 80 Gate Resistance, RG [Ω ] 0 100 20 30 40 50 60 70 Gate Resistance, R G [ Ω ] 4 FGPF30N30 Rev. A 10 www.fairchildsemi.com FGPF30N30 300V, 30A PDP IGBT Typical Performance Characteristics (Continued) Figure 13. Turn-On Characteristics vs. Collector Current Figure 14. Turn-Off Characteristics vs. Collector Current 500 Common Emitter VGE = 15V, RG = 20Ω 100 tf o TC = 25 C tr o Switching Time [ns] Switching Time [ns] TC = 125 C td(on) 100 td(off) Common Emitter VGE = 15V, RG = 20Ω 10 o T C = 25 C o T C = 125 C 5 10 15 20 25 5 30 10 15 20 25 30 Collector Current, IC [A] Collector Current, IC [A] Figure 15. Switching Loss vs Gate Resistance Figure 16. Switching Loss vs Collector Current 1000 500 Eoff Switching Loss [uJ] Switching Loss [uJ] Eon Eon 100 Common Emitter VCC = 200V, VGE = 15V IC = 20A 100 Eoff 10 Common Emitter VGE = 15V, RG = 20Ω o o T C = 25 C TC = 25 C o o T C = 125 C TC = 125 C 10 0 10 20 30 40 50 Gate Resistance, RG [Ω ] 60 1 70 0 5 10 15 20 25 30 Collector Current, IC [A] Figure 17. Transient Thermal Impedance of IGBT Thermal Response [Zthjc] 10 1 0 .5 0 .2 0 .1 0 .1 0 .0 5 0 .0 2 Pdm 0 .0 1 s in g le p u ls e t1 0 .0 1 t2 Duty factor D = t1 / t2 Peak Tj = Pdm × Zthjc + TC 1 E -3 1 E -5 1 E -4 1 E -3 0 .0 1 0 .1 1 10 R e c t a n g u la r P u ls e D u r a t i o n [ s e c ] 5 FGPF30N30 Rev. A www.fairchildsemi.com 3.30 ±0.10 10.16 ±0.20 2.54 ±0.20 ø3.18 ±0.10 (7.00) (1.00x45°) 15.87 ±0.20 15.80 ±0.20 6.68 ±0.20 (0.70) 0.80 ±0.10 0° (3 9.75 ±0.30 MAX1.47 ) #1 +0.10 0.50 –0.05 2.54TYP [2.54 ±0.20] 2.54TYP [2.54 ±0.20] 9.40 ±0.20 6 FGPF30N30 Rev. A 2.76 ±0.20 4.70 ±0.20 0.35 ±0.10 www.fairchildsemi.com FGPF30N30 300V, 30A PDP IGBT TO-220F The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. FACT Quiet Series™ GlobalOptoisolator™ GTO™ HiSeC™ I2C™ i-Lo™ ImpliedDisconnect™ IntelliMAX™ ISOPLANAR™ LittleFET™ MICROCOUPLER™ MicroFET™ MicroPak™ MICROWIRE™ MSX™ MSXPro™ Across the board. Around the world.™ The Power Franchise® Programmable Active Droop™ ACEx™ ActiveArray™ Bottomless™ Build it Now™ CoolFET™ CROSSVOLT™ DOME™ EcoSPARK™ E2CMOS™ EnSigna™ FACT™ FAST® FASTr™ FPS™ FRFET™ OCX™ OCXPro™ OPTOLOGIC® OPTOPLANAR™ PACMAN™ POP™ Power247™ PowerEdge™ PowerSaver™ PowerTrench® QFET® QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ RapidConnect™ µSerDes™ ScalarPump™ SILENT SWITCHER® SMART START™ SPM™ Stealth™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TCM™ TinyBoost™ TinyBuck™ TinyPWM™ TinyPower™ TinyLogic® TINYOPTO™ TruTranslation™ UHC™ UniFET™ UltraFET® VCX™ Wire™ DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I20 7 FGPF30N30 Rev. A www.fairchildsemi.com FGPF30N30 300V, 30A PDP IGBT TRADEMARKS
FGPF30N30
物料型号:FGPF30N30

器件简介: - 300V, 30A PDP IGBT - 采用统一IGBT技术,提供低导通和开关损耗 - 适用于需要低导通损耗的PDP应用

引脚分配: - 1. Gate(栅极) - 2. Collector(集电极) - 3. Emitter(发射极)

参数特性: - 绝对最大额定值包括300V的集-射极电压,80A的脉冲集电极电流等 - 热特性包括2.7°C/W的结到外壳的热阻等

功能详解: - 包括电气特性,如关断特性(BVCES、ICES等)、导通特性(VGE(th)、VCE(sat)等) - 动态特性(Cies、Coes、Cres等) - 开关特性(td(an)、td(off)、Qg等)

应用信息:PDP系统

封装信息: - TO-220F封装 - 器件标记、封装、包装类型、每管数量、每箱最大数量
FGPF30N30 价格&库存

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