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FIN1028 — 3.3V LVDS 2-Bit High-Speed Differential
Receiver
Features
Description
Greater than 400Mbs Data Rate
This dual receiver is designed for high-speed
interconnects utilizing Low Voltage Differential Signaling
(LVDS) technology. The receiver translates LVDS
levels, with a typical differential input threshold of
100mV, to LVTTL signal levels. LVDS provides low EMI
at ultra-low power dissipation, even at high frequencies.
This device is ideal for high-speed transfer of clock and
data signals.
Meets or Exceeds the TIA/EIA-644 LVDS Standard
Power Supply Operation: 3.3V
Maximum Differential Pulse Skew: 0.4ns
Maximum Propagation Delay: 2.5ns
Low-Power Dissipation
Power-Off Protection
Fail-Safe Protection for Open-Circuit, Shorted, and
Terminated Conditions
The FIN1028 can be paired with its companion driver,
the FIN1027, or any other LVDS driver.
Flow-through Pinout Simplifies PCB Layout
Ordering Information
Part Number
Operating
Temperature Range
FIN1028M
-40 to +85°C
FIN1028MX
-40 to +85°C
Package
Packing
Method
RoHS
8-Lead Small Outline Package (SOIC)
JEDEC MS-012, 0.150 inch Narrow
Tube
RoHS
8-Lead Small Outline Package (SOIC)
JEDEC MS-012, 0.150 inch Narrow
Tape and Reel
Eco Status
For Fairchild’s definition of “green” Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.
© 2018 Semiconductor Components Industries, LLC
FI1028 • Rev. 2
www.onsemi.com
FIN1028 — 3.3V LVDS 2-Bit High-Speed Differential Receiver
November 2018
FIN1028 — 3.3V LVDS 2-Bit High-Speed Differential Reciever
Pin Configuration
Figure 1. SOIC Pin Assignments (Top View)
Pin Definitions
Pin #
Name
Description
1
RIN1-
Inverting LVDS Input
2
RIN1+
Non-Inverting LVDS Input
3
RIN2+
Non-Inverting LVDS Input
4
RIN2-
Inverting LVDS Input
5
GND
Ground
6
ROUT2
LVTTL Data Output
7
ROUT1
LVTTL Data Output
8
VCC
Power Supply
Function Table
Inputs
Outputs
RIN+
RIN-
ROUT
LOW
HIGH
LOW
LOW
HIGH
HIGH
Fail-Safe Conditions
(1)
HIGH
Note:
1. Fail-safe=open, shorted, terminated.
© 2018 Semiconductor Components Industries, LLC
FIN1028 • Rev. 2
www.onsemi.com
2
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device
reliability. The absolute maximum ratings are stress ratings only.
Symbol
VCC
RINx+, RINx-
Parameter
Min.
Max.
Unit
Supply Voltage
-0.5
4.6
V
DC Input Voltage
-0.5
4.7
V
ROUTx
DC Output Voltage
-0.5
6.0
V
IO
DC Output Current
16
mA
TSTG
+150
°C
TJ
Maximum Junction Temperature
+150
°C
TL
Lead Temperature, Soldering 10 Seconds
+260
°C
Human Body Model, JESD22-A114
≥6500
Machine Model, JESD22-A115
≥300
ESD
Storage Temperature Range
-65
V
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
Parameter
Max.
Unit
3.0
3.6
V
0
VCC
V
Magnitude of Differential Voltage
100
VCC
mV
VIC
Common-Mode Input Voltage
0.05
2.35
V
TA
Operating Temperature
-40
+85
°C
VCC
Supply Voltage
VIN
Input Voltage
⏐VID⏐
© 2018 Semiconductor Components Industries, LLC
FIN1028 • Rev. 2
Min.
www.onsemi.com
3
FIN1028 — 3.3V LVDS 2-Bit High-Speed Differential Reciever
Absolute Maximum Ratings
Typical values are at TA=25°C and with VCC=3.3V. Over-supply voltage and operating temperature ranges, unless
otherwise noted.
Symbol
VTH
Parameter
Conditions
Differential Input Threshold HIGH
Min.
Typ.
Figure 2, Table 1
Max.
Units
100
mV
VTL
Differential Input Threshold LOW
Figure 2, Table 1
IIN
Input Current
VIN=0V or VCC
±20
µA
Power-off Input Current
VCC=0V, VIN=0V or 3.6V
±20
µA
II(OFF)
IOH=-100µA
-100
mV
VCC-0.2
VOH
Output HIGH Voltage
VOL
Output LOW Voltage
VIK
Input Clamp Voltage
IIK=-18mA
ICC
Power Supply Current
RIN+=1V and RIN-=1.4V or
RIN+=1.4V and RIN-=1V
CIN
Input Capacitance
4
pF
Output Capacitance
6
pF
COUT
IOH=-8mA
V
2.4
IOL=100µA
0.2
IOL=8mA
0.5
-1.5
V
V
9
mA
DC Electrical Characteristics
Typical values are at TA=25°C and with VCC=3.3V. Over-supply voltage and operating temperature ranges, unless
otherwise noted.
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Units
tPLH
Differential Propagation Delay,
LOW-to-HIGH
0.9
2.5
ns
tPHL
Differential Propagation Delay,
HIGH-to-LOW
0.9
2.5
ns
tTLH
Output Rise Time (20% to 80%)
tTHL
Output Fall Time (80% to 20%)
tSK(P)
Pulse Skew ⏐tPLH - tPHL⏐
tSK(LH), tSK(HL)
tSK(PP)
⏐VID⏐=400mV,
CL=10pF
Figure 2, Figure 3
(2)
Channel-to-Channel Skew
(3)
Part-to-Part Skew
0.5
ns
0.5
ns
0.4
ns
0.3
ns
1.0
ns
Notes:
2. tSK(LH), tSK(HL) is the skew between specified outputs of a single device when the outputs have identical loads and
are switching in the same direction.
3. tSK(PP) is the magnitude of the difference in propagation delay times between any specified terminals of two
devices switching in the same direction (either LOW-to-HIGH or HIGH-to-LOW) when both devices operate with
the same supply voltage, same temperature, and have identical test circuits.
© 2018 Semiconductor Components Industries, LLC
FIN1028 • Rev. 2
www.onsemi.com
4
FIN1028 — 3.3V LVDS 2-Bit High-Speed Differential Reciever
DC Electrical Characteristics
Notes:
4. CL includes all probe and fixture capacitances.
5. All input pulses have frequency = 10MHz, tR or tF=1ns.
Table 1. Receiver Minimum and Maximum Input Threshold Test Voltages
Applied Voltages (V)
Resulting Differential
Input Voltage (mV)
Resulting Common
Mode Input Voltage (V)
VIA
VIB
VID
VIC
1.25
1.15
100
1.2
1.15
1.25
-100
1.2
2.4
2.3
100
2.35
2.3
2.4
-100
2.35
0.1
0
100
0.05
0
0.1
-100
0.05
1.5
0.9
600
1.2
0.9
1.5
-600
1.2
2.4
1.8
600
2.1
1.8
2.4
-600
2.1
0.6
0
600
0.3
0
0.6
-600
0.3
Figure 3. AC Waveforms
© 2018 Semiconductor Components Industries, LLC
FIN1028 • Rev. 2
www.onsemi.com
5
FIN1028 —3.3V LVDS 2-Bit High-Speed Differential Receiver
Figure 2. Differential Driver Propagation Delay and Transition Time Test Circuit
FIN1028 —3.3V LVDS 2-Bit High-Speed Differential Receiver
Typical Performance Characteristics
Figure 4. Output High Voltage
vs. Power Supply Voltage
Figure 5. Output Low Voltage
vs. Power Supply Voltage
Figure 6. Output Short Circuit Current
vs. Power Supply Voltage
Figure 7. Power Supply Current vs. Frequency
Figure 8. Power Supply Current
vs. Ambient Temperature
© 2018 Semiconductor Components Industries, LLC
FIN1028 • Rev. 2
Figure 9. Differential Propagation Delay
vs. Power Supply Voltage
www.onsemi.com
6
Figure 10. Differential Propagation Delay
vs. Ambient Temperature
Figure 11. Differential Skew (tPLH-tPHL)
vs. Power Supply Voltage
Figure 12. Differential Skew (tPHL-tPHL)
vs. Ambient Temperature
Figure 13. Differential Propagation Delay
vs. Differential Input Voltage
Figure 14. Differential Propagation Delay
vs. Common-Mode Voltage
Figure 15. Transition Time vs. Power Supply Voltage
© 2018 Semiconductor Components Industries, LLC
FIN1028 • Rev. 2
www.onsemi.com
7
FIN1028 —3.3V LVDS 2-Bit High-Speed Differential Receiver
Typical Performance Characteristics (Continued)
Figure 16. Transition Time vs. Ambient Temperature
Figure 17. Differential Propagation Delay vs. Load
Figure 18. Differential Propagation Delay vs. Load
Figure 19. Transition Time vs. Load
Figure 20. Transition Time vs. Load
© 2018 Semiconductor Components Industries, LLC
FIN1028 • Rev. 2
Figure 21. Power Supply Current
vs. Power Supply Voltage
www.onsemi.com
8
FIN1028 —3.3V LVDS 2-Bit High-Speed Differential Receiver
Typical Performance Characteristics (Continued)
5.00
4.80
A
0.65
3.81
8
5
B
6.20
5.80
1.75
4.00
3.80
1
PIN ONE
INDICATOR
5.60
4
1.27
(0.33)
0.25
M
1.27
C B A
LAND PATTERN RECOMMENDATION
SEE DETAIL A
0.25
0.10
1.75 MAX
R0.10
0.25
0.19
C
0.10
0.51
0.33
0.50 x 45°
0.25
C
OPTION A - BEVEL EDGE
GAGE PLANE
R0.10
0.36
OPTION B - NO BEVEL EDGE
NOTES: UNLESS OTHERWISE SPECIFIED
8°
0°
0.90
0.406
SEATING PLANE
(1.04)
DETAIL A
SCALE: 2:1
A) THIS PACKAGE CONFORMS TO JEDEC
MS-012, VARIATION AA, ISSUE C,
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
FLASH OR BURRS.
D) LANDPATTERN STANDARD: SOIC127P600X175-8M.
E) DRAWING FILENAME: M08AREV13
Figure 22. 8-Lead, Small Outline Package (SOIC), JEDEC MS-012, 0.150-inch, Narrow Body
Click here for tape and reel specifications, available at:
http://www.fairchildsemi.com/products/discrete/pdf/soic8_tr.pdf
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2018 Semiconductor Components Industries, LLC
FIN1028 • Rev. 2
www.onsemi.com
9
FIN1028 —3.3V LVDS 2-Bit High-Speed Differential Receiver
Physical Dimensions
FIN1028 —3.3V LVDS 2-Bit High-Speed Differential Receiver
© 2018 Semiconductor Components Industries, LLC
FIN1028 • Rev. 2
www.onsemi.com
10
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
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