FPF2202

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This literature is subject to all applicable copyright laws and is not for resale in any manner. FPF2200-FPF2202 Integrated Load Switch with 500mA High Precision Current Limit Features General Description 1.8 to 5.5V Input Voltage Range Typical RDS(ON) = 140m @ VIN = 5.5V Typical RDS(ON) = 160m @ VIN = 3.3V The FPF2200-FPF2202 are low RDS(ON) P-Channel MOSFET load switches with high precision current limit value. The input voltage range operates from 1.8V to 5.5V to fulfill today's Ultra Portable Device's supply requirement. Switch control is by a logic input (ON) capable of interfacing directly with low voltage control signal. On-chip pull-down is available for output quick discharge when switch is turned off. Fixed 500mA Current Limit (min) 5% Accurate Current Limit 72 (typ) Output Discharge Resistance ESD Protected, above 8kV HBM and 2kV CDM For the FPF2201, if the constant current condition still persists after 30ms, these parts will shut off the switch and pull the fault signal pin (FLAGB) low. The FPF2200 has an auto-restart feature which will turn the switch on again after 450ms if the ON pin is still active. The FPF2201 do not have this auto-restart feature so the switch will remain off until the ON pin is cycled. For the FPF2202, a current limit condition will immediately pull the fault signal pin low and the part will remain in the constantcurrent mode until the switch current falls below the current limit. For the FPF2200 through FPF2202, the minimum current limit is 500mA with 5% accuracy. Applications PDAs Cell Phones GPS Devices MP3 Players Digital Cameras Peripheral Ports Notebook Computer Pin 1 BOTTOM TOP Ordering Information Part Current Limit (mA) Current Limit Blanking Time (mS) Auto-Restart Time (mS) ON Pin Activity FPF2200 500 30 450 Active HI FPF2201 500 30 NA Active HI FPF2202 500 NA NA Active HI ©2008 Fairchild Semiconductor Corporation FPF2200-FPF2202 Rev. B 1 www.fairchildsemi.com FPF2200-FPF2202 Integrated Load Switch with 500mA High Precision Current Limit June 2008 TO LOAD VOUT VIN FPF2200/1/2 OFF ON FLAGB ON GND Functional Block Diagram VIN UVLO THERMAL SHUTDOWN CONTROL LOGIC ON CURRENT LIMIT VOUT Output Discharge FLAGB GND FPF2200-FPF2202 Rev. B 2 www.fairchildsemi.com FPF2200-FPF2202 Integrated Load Switch with 500mA High Precision Current Limit Typical Application Circuit FPF2200-FPF2202 Integrated Load Switch with 500mA High Precision Current Limit Pin Configuration ON 6 1 N/C GND 5 2 VIN FLAGB 4 3 VOUT MicroFET 2x2 6L (BOTTOMVIEW) Pin Description Pin Name 1 N/C No Connection Function 2 VIN Supply Input: Input to the power switch and the supply voltage for the IC 3 VOUT 4 FLAGB 5 GND 6 ON Switch Output: Output of the power switch Fault Output: Active LO, open drain output which indicates an over current, supply under voltage or over temperature state Ground ON/OFF Control Input Absolute Maximum Ratings Parameter VIN, VOUT, ON, FLAGB TO GND Min. Max. Unit -0.3 6 V 1.2 W -65 125 °C 86 °C/W Power Dissipation @ TA = 25°C Operating and Storage Junction Temperature Thermal Resistance, Junction to Ambient Electrostatic Discharge Protection HBM 8000 V MM 400 V CDM 2000 V Recommended Operating Range Parameter Min. Max. Unit VIN 1.8 5.5 V Ambient Operating Temperature, TA -40 85 °C Electrical Characteristics VIN = 1.8 to 5.5V, TA = -40 to +85°C unless otherwise noted. Typical values are at VIN = 3.3V and TA = 25°C. Parameter Symbol Conditions Min. Typ. Max. Units 5.5 V Basic Operation Operating Voltage Quiescent Current VIN Shutdown Current FPF2200-FPF2202 Rev. B VIN IQ 1.8 IOUT=0mA, VIN=VON=1.8V 40 65 IOUT=0mA, VIN=VON=3.3V 45 75 IOUT=0mA, VIN=VON=5.5V 55 85 VON=0V, VIN=5.5V, VOUT=short to GND 3 2.5 A A www.fairchildsemi.com Symbol Min. Typ. VON=0V, VOUT=5.5V, VIN=short to GND VOUT Shutdown Current On-Resistance Conditions RON VIH ON Input Logic Low Voltage (OFF) VIL On Input Leakage FLAGB Output High Leakage Current A 140 185 160 210 VIN=1.8V, IOUT=200mA, TA=25°C 230 300 90 VIN=1.8V 0.8 1.4 m 265 72 VIN=5.5V 105 V VIN=1.8V 0.5 VIN=5.5V 1.0 VON = VIN or GND FLAGB Output Logic Low Voltage 1 VIN=3.3V, IOUT=200mA, TA=25°C VIN=3.3V, VON=0V, IOUT=10mA ON Input Logic High Voltage (ON) Units VIN=5.5V, IOUT=200mA, TA=25°C VIN=3.3V, IOUT=200mA, TA=-40°C to 85°C Output Discharge Resistance Max. -1 1 VIN=5.5V, ISINK=100 A 0.05 0.1 VIN=1.8V, ISINK=100 A 0.12 0.25 VIN=5.5V, Switch on 1 V A V A Protections Current Limit ILIM Thermal Shutdown Under Voltage Shutdown UVLO VIN=3.3V, VOUT = 3.0V, TA=25°C 504 530 Shutdown Threshold 140 Return from Shutdown 130 Hysteresis 10 VIN increasing 1.55 Under Voltage Shutdown Hysteresis 1.65 557 mA °C 1.75 V 50 mV Dynamic Turn On Time tON RL=500 , CL=0.001uF 70 S Turn Off Time tOFF RL=500 , CL=0.001uF 600 nS VOUT Rise Time tRISE RL=500 , CL=0.001uF 40 S VOUT Fall Time tFALL RL=500 , CL=0.001uF Over Current Blanking Time tBLANK FPF2200, FPF2201 15 30 60 mS Auto-Restart Time tRSTRT FPF2200 225 450 900 mS Current Limit Response Time FPF2200-FPF2202 Rev. B VIN = VON = 3.3V. Over-Current Condition: RLOAD=1.55 4 100 5 nS S www.fairchildsemi.com FPF2200-FPF2202 Integrated Load Switch with 500mA High Precision Current Limit Parameter 80 70 V ON = VIN 50 SUPPLY CURRENT (uA) SUPPLY CURRENT (uA) VON=VIN 70 60 o 85 C o 25 C 40 o -40 C 30 20 VIN=3.3V 60 VIN=5.5V 50 VIN=1.8V 40 30 20 10 -40 10 1 2 3 4 5 6 -15 SUPPLY VOLTAGE (V) 60 85 Figure 2. Quiescent Current vs. Temperature 1.30 1.6 1.15 VIH VON SUPPLY VOLTAGE (V) VON SUPPLY VOLTAGE (V) 35 o Figure 1. Quiescent Current vs. Input Voltage VIL 1.00 0.85 0.70 0.55 0.40 1.4 VIN=5.5V 1.2 1.0 VIN=3.3V 0.8 VIN=1.8V 0.6 0.4 1 2 3 4 5 6 -40 -15 VIN, SUPPLY VOLTAGE (V) 10 35 60 85 o TJ, JUNCTION TEMPERATURE ( C) Figure 3. VON vs. Input Voltage Figure 4. VON High Voltage vs. Temperature 1.4 0.04 1.2 0.03 VIN=5.5V 1.0 ON PIN CURRENT (uA) VON SUPPLY VOLTAGE (V) 10 TJ, JUNCTION TEMPERATURE ( C) VIN=3.3V 0.8 VIN=1.8V 0.6 0.4 0.02 VON = 5.5V 0.01 0.00 VON = 0V -0.01 -0.02 -0.03 0.2 -40 -15 10 35 60 -40 85 10 35 60 85 TJ, JUNCTION TEMPERATURE ( C) Figure 5. VON Low Voltage vs. Temperature FPF2200-FPF2202 Rev. B -15 o o TJ, JUNCTION TEMPERATURE ( C) Figure 6. On Pin Current vs. Temperature 5 www.fairchildsemi.com FPF2200-FPF2202 Integrated Load Switch with 500mA High Precision Current Limit Typical Characteristics 600 590 500 OUTPUT CURRENT (mA) OUTPUT CURRENT (mA) 600 400 300 200 580 VIN = 3.3V 570 VIN = 1.8V 560 550 VIN = 5.5V 540 100 530 -40 0 0 1 2 3 4 5 6 -15 VIN-VOUT (V) Figure 7. Current Limit vs. Output Voltage 300 270 270 240 RON(mOhms) RON (mOhms) 240 210 o 85 C 150 25oC 120 VIN=1.8V 210 180 VIN=3.3V VIN=5.5V 90 -40 60 3.5 4.5 5.5 -15 10 35 60 85 o VIN, SUPPLY VOLTAGE (V) TJ, JUNCTION TEMPERATURE ( C) Figure 9. RON vs. Input Voltage Figure 10. RON vs. Temperature 1000 100 TFALL RISE / FALL TIMES (uS) TURN-ON/OFF TIMES (uS) 85 120 90 2.5 60 150 -40oC 1.5 35 Figure 8. Current Limit vs. Temperature 300 180 10 TJ, JUNCTION TEMPERATURE (oC) 100 TOFF 10 TON VIN = 3.3V RL = 500 Ohms COUT = 0.11uF 1 0.1 -40 -15 10 35 60 -15 10 35 60 85 o o TJ, JUNCTION TEMPERATURE ( C) TJ, JUNCTION TEMPERATURE ( C) Figure 11. TON / TOFF vs. Temperature FPF2200-FPF2202 Rev. B TRISE 1 0.1 -40 85 VIN = 3.3V RL = 500 Ohms COUT = 0.11uF 10 Figure 12. TRISE / TFALL vs. Temperature 6 www.fairchildsemi.com FPF2200-FPF2202 Integrated Load Switch with 500mA High Precision Current Limit Typical Characteristics BLANKING TIME (mS) 40 VIN 2V/DIV 38 36 IOUT 10mA/DIV 34 VON 2V/DIV 32 30 28 -40 VIN=3.3V, RL=500 , CIN=10 F VOUT 2V/DIV -15 10 35 60 85 TJ, JUNCTION TEMPERATURE ( C) 100 s/DIV Figure 13. TBLANK vs Temperature VIN 2V/DIV Figure 14. TON Response VON 5V/DIV VIN=3.3V, RL=500 , CIN=10 F VIN=3.3V, RL=5 , CIN=10 F IOUT 500mA/DIV IOUT 10mA/DIV VFLAGB 2V/DIV VON 2V/DIV TBLANK VOUT 2V/DIV VOUT 2V/DIV 500ns/DIV 10ms/DIV Figure 15. TOFF Response Figure 16. TBLANK Response VIN=3.3V, RL=1.2 , CIN=10 F COUT=10 F VON 2V/DIV IOUT 500mA/DIV IOUT 500mA/DIV VIN 2V/DIV VIN 2V/DIV VOUT 2V/DIV VOUT 2V/DIV 100 s/DIV 500 s/DIV Figure 17. Current Limit Response (Output is loaded with 1.2 resistor and COUT=10 F) FPF2200-FPF2202 Rev. B VIN=5V, RL=1.2 , CIN=10 F COUT=10 F VON 2V/DIV Figure 18. Current Limit Response (Output is loaded with 1.2 resistor and COUT=100 F) 7 www.fairchildsemi.com FPF2200-FPF2202 Integrated Load Switch with 500mA High Precision Current Limit Typical Characteristics IOUT 500mA/DIV IOUT 5A/DIV VIN=VON=,3. 3V, RL=1.2 , CIN=10 F COUT=1 F VOUT 2V/DIV VOUT 2V/DIV 100 s/DIV 20 s/DIV Figure 19. Current Limit Response (Switch is powered into a short - Input and enable pins are tied together) FPF2200-FPF2202 Rev. B VIN=3.3V, RL=100 , CIN=10 F COUT=1 F VON 2V/DIV VON 2V/DIV Figure 20. Current Limit Response (Output shorted to GND while the switch is in normal operation) 8 www.fairchildsemi.com FPF2200-FPF2202 Integrated Load Switch with 500mA High Precision Current Limit Typical Characteristics Undervoltage Lockout (UVLO) The FPF2200, FPF2201, and FPF2202 are state of the art High Precision Current Limit switches designed to meet USB OTG (On-The-Go) applications with optimum current for a safe design practice. The core of each device is a 0.16 P-channel MOSFET and a controller capable of functioning over an input operating range of 1.8- 5.5V. The controller protects or offers current limiting, UVLO(undervoltage lockout) and thermal shutdown protection. The minimum current limit value is set to 500mA allowing to draw as much as 500mA from the USB port. The undervoltage lockout turns-off the switch if the input voltage drops below the undervoltage lockout threshold. With the ON pin active the input voltage rising above the undervoltage lockout threshold will cause a controlled turn-on of the switch which limits current over-shoots. Output Discharge Resistor The FPF2200/1/2 family contains an 80 on-chip load resistor for quick output discharge when the switch is turned off. This features become more attractive when application requires large output capacitor to be discharged when switch turns-off. However, VOUT pin should not be connected directly to the battery source due to the discharge mechanism of the load switch. On/Off Control The ON pin is active high, and controls the state of the switch. Applying a continuous high signal will hold the switch in the ON state. The switch will move into the OFF state when the active high is removed, or if a fault is encountered. For all versions, an undervoltage on VIN or a junction temperature in excess of 140°C overrides the ON control to turn off the switch. In addition, excessive currents will cause the switch to turn off in the FPF2200 and FPF2201. The FPF2200 has an Auto-Restart feature which will automatically turn the switch ON again after 450ms. For the FPF2201, the ON pin must be toggled to turn-on the switch again. The FPF2202 does not turn off in response to an over current condition but instead remains operating in a constant current mode so long as ON is active and the thermal shutdown or UVLO have not activated. Thermal Shutdown The thermal shutdown protects the die from internally or externally generated excessive temperatures. During an overtemperature condition the FLAGB is activated and the switch is turned-off. The switch automatically turns-on again if temperature of the die drops below the threshold temperature. Fault Reporting Upon the detection of an over-current condition, an input UVLO, or an over-temperature condition, the FLAGB signals the fault mode by activating LO. In the event of an over-current condition for the FPF2200 and FPF2201, the FLAGB goes LO at the end of the blanking time while FLAGB goes LO immediately for the FPF2202. If the over-current condition lasts longer than blanking time, FLAGB remains LO through the Auto-Restart Time for the FPF2200 while for the FPF2201, FLAGB is latched LO and ON must be toggled to release it. With the FPF2202, FLAGB is LO during the faults and immediately returns HI at the end of the fault condition. FLAGB is an open-drain MOSFET which requires a pull-up resistor between VIN and FLAGB. During shutdown, the pull-down on FLAGB is disabled to reduce current draw from the supply. A 100K pull up resistor is recommended to be used in the application. Current Limiting The current limit ensures that the current through the switch doesn't exceed a maximum value while not limiting at less than a minimum value. The minimum current at which the parts will limit is set to 500mA. The FPF2200 and FPF2201 have a blanking time of 30ms (nominal) during which the switch will act as a constant current source. At the end of the blanking time, the switch will be turned-off. The FPF2202 has no current limit blanking period so it will remain in a constant current state until the ON pin is deactivated or the thermal shutdown turns-off the switch. FPF2200-FPF2202 Rev. B 9 www.fairchildsemi.com FPF2200-FPF2202 Integrated Load Switch with 500mA High Precision Current Limit Description of Operation PCB Layout Recommendations Input Capacitor For best performance, all traces should be as short as possible. To be more effective, the input and output capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on normal and short-circuit operation. Using wide traces for VIN, VOUT and GND will help minimize parasitic electrical effects along with minimizing the case to ambient thermal impedance. To limit the voltage drop on the input supply caused by transient in-rush currents when the switch is turned on into a discharged load capacitor or a short-circuit, a capacitor is recommended to be placed between VIN and GND. A 1uF ceramic capacitor, CIN, placed close to the pins is usually sufficient. Higher values of CIN can be used to further reduce the voltage drop. Output Capacitor Improving Thermal Performance A 0.1uF capacitor COUT, should be placed between VOUT and GND. This capacitor will prevent parasitic board inductances from forcing VOUT below GND when the switch turns-off. For the FPF2200 and FPF2201, the total output capacitance needs to be kept below a maximum value, COUT(max), to prevent the part from registering an over-current condition and turning-off the switch. The maximum output capacitance can be determined from the following formula: An improper layout could result in higher junction temperature and triggering the thermal shutdown protection feature. This concern applies when the switch is set at higher current limit value and an over-current condition occurs. In this case, the power dissipation of the switch, from the formula below, could exceed the maximum absolute power dissipation of 1.2W. PD = (VIN - VOUT) x ILIM (Max) ILIM (Max) X tBLANK (Min) COUT (Max) = The following techniques have been identified to improve the thermal performance of this family of devices. These techniques are listed in order of the significance of their impact. VIN Power Dissipation 1. Thermal performance of the load switch can be improved by connecting pin7 of the DAP (Die Attach Pad) to the GND plane of the PCB. During normal on-state operation, the power dissipated in the device will depend upon the level at which the current limit is set. The maximum allowed setting for the current limit is 500mA and will result in a power dissipation of: 2. Embedding two exposed through-hole vias into the DAP (pin7) provides a path for heat to transfer to the back GND plane of the PCB. A drill size of Round, 14 mils (0.35mm) with 1-ounce copper plating is recommended to result in appropriate solder reflow. A smaller size hole prevents the solder from penetrating into the via, resulting in device lift-up. Similarly, a larger via-hole consumes excessive solder, and may result in voiding of the DAP. P = (ILIM)2 * RON = (0.5)2 * 0.16 = 40mW If the part goes into current limit, the maximum power dissipation will occur when the output is shorted to ground. For the FPF2200, the power dissipation will scale by the AutoRestart Time, tRSTRT, and the Over Current Blanking Time, tBLANK, so that the maximum power dissipated is: P (Max) = = tBLANK tBLANK + tRSTRT 30 30 + 450 * VIN (Max) * ILIM (Max) * 5.5 * 0.5 = 0.17W Note this is below the maximum package power dissipation, and the thermal shutdown feature will act as additional safety to protect the part from damage due to excessive heating. The junction temperature is only able to increase to the thermal shutdown threshold. Once this temperature has been reached, toggling ON will not turn-on the switch until the junction temperature drops. For the FPF2202, a short on the output will cause the part to operate in a constant current state dissipating a worst case power of: Figure 21: Two through hole open vias embedded in DAP 3. The VIN, VOUT and GND pins will dissipate most of the heat generated during a high load current condition. The layout suggested in Figure 23 provides each pin with adequate copper so that heat may be transferred as efficiently as possible out of the device. The low-power FLAGB and ON pin traces may be laid-out diagonally from the device to maximize the area available to the ground pad. Placing the input and output capacitors as close to the device as possible also contributes to heat dissipation, particularly during high load currents. P (Max) = VIN (MAX) * ILIM (MAX) = 5.5 * 0.557 = 3.064W This large amount of power will activate the thermal shutdown and the part will cycle in and out of thermal shutdown so long as the ON pin is active and the short is present. FPF2200-FPF2202 Rev. B 10 www.fairchildsemi.com FPF2200-FPF2202 Integrated Load Switch with 500mA High Precision Current Limit Application Information FPF2200-FPF2202 Integrated Load Switch with 500mA High Precision Current Limit Figure 22: X-Ray result (bottom view with 45o angle) Figure 25: Bottom and ASB Layers Figure 26: Zoom in to Top layer Figure 23: Proper layout of output and ground copper area FPF22XX Demo Board FPF22XX Demo board has components and circuitry to demonstrate FPF2223/4/5 load switches functions and features. R4 resistor with 0 value is used for measuring the output current. Load current can be scoped by removing the R4 resistor and soldering a current loop to the R4 footprint. Thermal performance of the board is improved using a few techniques recommended in the layout recommendations section of datasheet. R3 resistor should be left open for FPF220X family. Figure 24: Top, SST, and AST Layers FPF2200-FPF2202 Rev. B 11 www.fairchildsemi.com 2.0 0.05 C A 1.72 1.68 B 2X 6 4 0.15 2.0 1.21 2.25 0.90 0.52(6X) 0.05 C PIN#1 IDENT TOP VIEW 1 2X 3 0.65 0.42(6X) RECOMMENDED LAND PATTERN 0.10 C NOTES: 0.08 C SIDE VIEW C A. PACKAGE DOES NOT FULLY CONFORM TO JEDEC MO-229 REGISTRATION SEATING PLANE B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 2009. D. LAND PATTERN RECOMMENDATION IS EXISTING INDUSTRY LAND PATTERN. (0.70) (0.20)4X PIN #1 IDENT 1 E. DRAWING FILENAME: MKT-MLP06Krev5. 3 (0.40) (6X) (0.60) 6 4 (6X) 0.65 1.30 BOTTOM VIEW 0.10 0.05 C A B C ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 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