FPF2495CUCX

DATA SHEET www.onsemi.com IntelliMAXE 28 V, Over-Voltage, Over-Current Protection Load Switch with Adjustable Current-Limit Control WLCSP9 1.21x1.21x0.586 CASE 567RV MARKING DIAGRAM FPF2495C T5&K &.&2&Z Description The FPF2495C advanced load−management switch targets applications requiring a highly integrated solution. It disconnects loads powered from the DC power rail (15 kV ♦ IEC 61000−4−2 Contact Discharge: >8 kV UL Listed − File No. E467988 and IEC60950−1 (ed.2): am1 This is a Pb−Free Device ♦ ♦ • • Applications • Smart Phones, Tablet PCs • Storage, DSLR, and Portable Devices Publication Order Number: FPF2495C/D FPF2495C ORDERING INFORMATION Part Number Top Mark Manufacturing T5 Multiple Assembly & Test Sites FPF2495CUCX Operating Temperature Range −40 to 85°C Package Shipping† WLCSP9 1.21x1.21x0.586 (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. APPLICATION DIAGRAM Battery VIO Rpull−up Vin 5 V Boost USB Connector Vout C IN C OUT ON IO FPF2495C OCP FLAGB OTG Device ISET AP GND IO Figure 1. Typical Application NOTE: 1. CIN and COUT capacitors recommended for improvement of device stability. FUNCTIONAL BLOCK DIAGRAM HV Power Device TRCB VIN VOUT Current Limit OVP UVLO Control Logic ISET ON IntelliMAX FPF2495C Charge Pump Figure 2. Functional Block Diagram www.onsemi.com 2 OC FLAGB Thermal Shutdown GND FPF2495C PIN CONFIGURATIONS 1 2 3 3 2 1 A VIN GND VOUT VOUT GND VIN A B VIN GND VOUT VOUT GND VIN B C OC FLAGB ISET ON ON ISET OC FLAGB C Figure 3. Pin Assignments (Top View) Figure 4. Pin Assignments (Bottom View) PIN DESCRIPTION ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Pin No. Name A3, B3 VOUT A1, B1 VIN A2 GND Description Switch Output Supply Input: Input to the power switch Ground (true device ground) B2 C3 ON C1 OCFLAGB C2 ISET ON/OFF Control Input: Active HIGH − GPIO compatible Logic HIGH Switch Enable Logic LOW Switch Disable Fault Output: Active LOW, open−drain output that indicates an input over current. External pull−up resistor to VCC is required. Current Limit Set Input: A resistor from ISET to ground sets the current limit for the switch. www.onsemi.com 3 FPF2495C ABSOLUTE MAXIMUM RATINGS Symbol VPIN Min Max Unit VOUT to GND, VOUT to VIN Parameter Parameter −0.3 28.0 V ON, VIN, FLAGB, ISET to GND −0.3 6.0 ISW Maximum Continuous Switch Current (Note 4) − 2.2 A tPD Total Power Dissipation at TA = 25°C − 1.0 W TJ Operating Junction Temperature −40 +150 °C TSTG Storage Junction Temperature −65 +150 °C QJA Thermal Resistance, Junction−to−Ambient (1−inch Square Pad of 2 oz. Copper) − 95 (Note 2) °C/W − 110 (Note 3) ESD Electrostatic Discharge Capability Human Body Model, JESD22−A114 2.0 − Charged Device Model, JESD22−C101 2.5 − IEC61000−4−2 System Level Air Discharge (VIN, VON, VOUT to GND) 15.0 − Contact Discharge (VIN, VON, VOUT to GND) 8.0 − kV Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 2. Measured using 2S2P JEDEC std. PCB. 3. Measured using 2S2P JEDEC PCB cold plate method. 4. Maximum Junction Temperature = 85°C. RECOMMENDED OPERATING CONDITIONS (Create − Table − RecOperating) Symbol Parameter Min Max Unit VIN Supply Voltage 2.5 5.5 V TA Ambient Operating Temperature −40 85 °C Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 4 FPF2495C ELECTRICAL CHARACTERISTICS (VIN = 2.5 to 5.5 V, TA = −40 to +85°C; typical values are at VIN = 5 V and TA = 25°C unless otherwise noted) Symbol Parameter Conditions Min Typ Max Unit 2.5 − 5.5 V BASIC OPERATION VIN Input Voltage IQ(OFF) Off Supply Current VON = GND, VOUT = Open − 1 2 mA ISD(OFF) Shutdown Current VIN = 5.5 V, VOUT = 0 V, VON = GND − 0.1 4.0 mA IQ Quiescent Current IOUT = 0 mA − 65 100 mA On Resistance VIN = 5.0 V, IOUT = 1 A − 70 100 mW VIN = 3.7 V, IOUT = 1 A − 75 105 RON RON On Resistance (Note 6) VIN = 5.0 V, IOUT = 1.5 A − 70 − mW VIH ON Input Logic HIGH Voltage VIN = 2.5 V to 5.5 V 1.15 − − V VIL ON Input Logic LOW Voltage VIN = 2.5 V to 5.5 V − − 0.65 V FLAGB Output Logic LOW Voltage VIN = 5 V, ISINK = 10 mA − 0.1 0.2 V VIN = 2.5 V, ISINK = 10 mA − 0.15 0.30 FLAGB Output HIGH Leakage Current VIN = 5 V, Switch On − − 1 mA On Input Leakage VON = 0 V to VIN − − 1.0 mA Pull−Down Resistance at ON Pin VIN = 2.5~5.5 V, VON = HIGH, TA = −40 to 85°C − 14 − MW VOUT Rising Threshold 5.50 5.80 6.00 V VOUT Falling Threshold − 5.50 − VOUT Falling Threshold − 0.3 − V IOUT = 0.5 A, CL = 1 mF, TA=25°C, VOUT from 5.5 V to 6.0 V 1 − 4 (Note 6) ms VIN = 5 V, RSET = 9530 W, VOUT = 1.68 to 5 V with 25% Accuracy (Note 5) 80 107 134 mA VIN = 5 V, RSET = 2100 W, VOUT = 1.68 to 5 V with 10% Accuracy (Note 5) 437 486 535 VIN = 5 V, RSET = 1070 W, VOUT = 1.68 to 5 V with 10% Accuracy (Note 5) 858 953 1048 VIN Increasing − 2.4 − VIN Decreasing − 2.2 − − 200 − mV VIL_FLAG IFLAGB_LK ION RON_PD OVER−VOLTAGE PROTECTION VOV_TRIP OUTHYS tOVP Output OVP Lockout Output OVP Hysteresis OVP Response Time (Note 6) OVER−CURRENT PROTECTION ILIM VUVLO VUVLO_HYS Current Limit Under−Voltage Lockout UVLO Hysteresis V VT_RCB RCB Protection Trip Point VOUT − VIN − 50 − mV VR_RCB RCB Protection Release Trip Point VIN − VOUT − 50 − mV − 100 − mV VRCB_HYS RCB Hysteresis tRCB Default RCB Response Time VIN = 5 V, VON = High / Low − 2 − ms IRCB RCB Current VON = 0 V, VOUT = 5.5 V, − 7 − mA tHOCP Hard Over−Current Response Time Moderate Over−Current Condition, IOUT ≥ ILIM, VOUT = 0 V − 6 − ms tOCP Over−Current Response Time Moderate Over−Current Condition, IOUT ≥ ILIM VOUT ≤ VIN − 7 − ms www.onsemi.com 5 FPF2495C ELECTRICAL CHARACTERISTICS (VIN = 2.5 to 5.5 V, TA = −40 to +85°C; typical values are at VIN = 5 V and TA = 25°C unless otherwise noted) (continued) Symbol tOC_FLAG TSD Parameter Conditions Min Typ Max Unit Over−Current Flag Response Time When Over−Current Occurs to Flag Pulling LOW − 8 − ms Thermal Shutdown Shutdown Threshold − 150 − °C Return from Shutdown − 130 − Hysteresis − 20 − VIN = 5 V, RL = 100 W, CL = 1 mF, TA = 25°C, RSET = 2040 W − 0.67 − ms − 0.69 − ms DYNAMIC CHARACTERISTICS tDON Turn−On Delay (Note 6, 7) tR VOUT Rise Time (Note 6, 7) tON Turn−On Time (Note 6, 8) − 1.36 − ms tDOFF Turn−Off Delay (Note 6, 7) − 0.01 − ms tF VOUT Fall Time (Note 6, 7) − 0.22 − ms tOFF Turn−Off Time (Note 6, 9) − 0.23 − ms tDON Turn−On Delay (Note 7,10) − 0.65 0.78 ms tR VOUT Rise Time (Note 7,10) − 0.65 0.82 ms 1.3 1.6 ms VIN = 5 V, RL = 3.8 W, CL = 10 mF, TA = −40 to 85°C, RSET = 634 W tON Turn−On Time (Note 8,10) − tDOFF Turn−Off Delay (Note 7,10) − 4 10 ms tF VOUT Fall Time (Note 7,10) − 76 120 ms tOFF Turn−Off Time (Note 9,10) − 80 130 ms Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 5. Characterization based on 1% tolerance resistor. 6. This parameter is guaranteed by design and characterization; not production tested. 7. tDON / tDOFF / tR / tF are defined in Figure 5 below. 8. tON = tR + tDON. 9. tOFF = tF + tDOFF. 10. This parameter is guaranteed by design. TIMING DIAGRAM 90% Where: tDON = Delay On Time tR = VOUT Rise Time tON = Turn−On Time tDOFF = Delay Off Time tF = VOUT Fall Time tOFF = Turn Off Time V ON 10% 90% 90% V OUT 10% td ON 10% tR td OFF t ON tF t OFF Figure 5. Timing Diagram www.onsemi.com 6 FPF2495C OPERATION AND APPLICATION DESCRIPTION Input Capacitor Thermal Shutdown To limit the voltage drop on the input supply caused by transient inrush current when the switch turns on into discharge load capacitor; a capacitor must be placed in between the VIN and GND pins. A high−value capacitor on CIN can be used to reduce the voltage drop in high−current applications. The thermal shutdown protects the die from internally or externally generated excessive temperature. During an over−temperature condition, the switch is turned off. The switch automatically turns on again if the temperature of the die drops below the threshold temperature. Output Capacitor The current limit is set with an external resistor connected between the ISET and GND pins. The resistor is selected using the formula: ILIM (mA) = ((0.4 / RSET W) x 2550) x 1000 Resistor tolerance of 1% or less is recommended. Setting Current Limit An output capacitor should be placed between the VOUT and GND pins. This capacitor prevents parasitic board inductance from forcing VOUT below GND when the switch is on. This capacitor also prevents reverse inrush current from creating a voltage spike that could damage the device in the case of a VOUT short. Fault Reporting Upon the detection of an over−current, OC_FLAGB signal the fault by activating LOW. Current Limiting The current limit ensures that the current through the switch does not exceed the maximum set value, while not limiting the minimum value. The current at which the part’s limit is adjustable through the selection of the external resistor connected to the ISET pin. Information for selecting the resistor is found in the section below. The device acts as a constant−current source when the load draws more than the maximum value set by the device until thermal shutdown occurs. The device recovers if the die temperature drops below the threshold temperature. Under−Voltage Lockout (UVLO) The under−voltage lockout turns the switch off if the input voltage drops below the lockout threshold. With the ON pin active, the input voltage rising above the UVLO threshold releases the lockout and enables the switch. Figure 6. Current Limit Settings by RSET (Note 11) 11. Values based on 1% tolerance resistor. BOARD LAYOUT For best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to minimize the effect that parasitic trace inductance may have on normal and short−circuit operation. Using wide traces for VIN, VOUT, GND helps minimize parasitic electrical effects along with minimizing the case−to−ambient thermal impedance. True Reverse−Current Blocking The true reverse−current blocking feature protects the input source against current flow from output to input regardless of whether the load switch is on or off. www.onsemi.com 7 FPF2495C TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25°C) Figure 7. tON Response Figure 8. OVP Response (Increase VOUT to OVP Trip Point) Figure 9. OC_FLAGB Response Time (Toggle RLOAD from High to Low Resistance) Figure 10. tOFF Response Figure 11. tOCP Response Time www.onsemi.com 8 FPF2495C PACKAGE DIMENSIONS WLCSP9 1.21x1.21x0.586 CASE 567RV ISSUE O Table 1. PRODUCT−SPECIFIC DIMENSIONS D E X Y 1210 mm ±30 mm 1210 mm ±30 mm 205 mm 205 mm www.onsemi.com 9 FPF2495C IntelliMAX is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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