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FPF2498
Adjustable OVP with 28 V
Input OVT Load Switch
Description
The FPF2498 advanced load−management switch targets
applications requiring a highly integrated solution. It disconnects
loads powered from the DC power rail (< 12 V) with stringent
off−state current targets and high load capacitances (< 100 mF). The
FPF2498 consists of a slew−rate controlled low−impedance MOSFET
switch. FPF2498 has over−voltage protection and over−temperature
protection.
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WLCSP6 1.30x1.05x0.586
CASE 567RT
Applications
• Cellular Phones, Smart Phones
• Tablets
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
Related Resources
• FPF2498 Evaluation Board
Features
Function
Advanced Load Switch
Input
3.5 – 12 V
Features
28 V Absolute Ratings on VIN
1.7 A Maximum Continuous
Current Capability 80 mW RON Typical
Over−Voltage Protection (OVP)
Over−Current Protection (OCP)
Thermal Shutdown
Under−Voltage Lockout (UVLO)
Reverse Current Blocking (RCB)
ESD
15 kV IEC 61000−4−2 Air Gap
Operating Temperature
−40 to +85 °C
Range
Package
6−Ball WLCSP
(1.30 x 1.05 x 0.586 mm, 0.4 mm Pitch)
Ordering Information
FPF2498BUCX
Top Mark
TK
© Semiconductor Components Industries, LLC, 2017
March, 2019 − Rev. 3
1
Publication Order Number:
FPF2498/D
FPF2498
FPF2498
VIN
CLOAD
R1
3−6V
Charge
Pump
UVLO
OVLO
CIN
VOUT
RCB
OVP
V_IO
CONTROL
FLAGB
Rpull−up
Thermal
Shutdown
ON
OFF ON
GND
NOTE: Recommend CLOAD value be larger than 2.2 mF.
Figure 1. Block Diagram and Typical Application
PIN CONFIGURATION
Top Though View
Bottom View
1
2
2
A
GND
VIN
VIN
GND
A
B
VOUT
ON
ON
VOUT
B
C
OVLO
OVLO
C
1.3 mm
FLAG
FLAG
B
B
1.05 mm
Figure 2. Pin Assignments
Table 1. PIN MAP
Name
Pin #
Type
Default State
VIN
A2
Input
N/A
Input voltage path
VOUT
B1
Output
N/A
Output voltage path
ON
B2
Input
LOW
OVLO
C1
Input
FLAGB
C2
Open− Drain
Output
GND
A1
GND
Description
On / Off control of device
VIH=HIGH
Enabled
VIL=LOW
Disabled
OVP Adjustment set by R1 and R2 and is compared to 1.2 V
High−Z
GND
Indicates a OVP / OCP / OTP fault
Device ground
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2
LOW / GND
Active – Indicates:
OVP (over 6.5 V at 3 – 6 V)
OCP (over 2 A)
OTP (over 150°C)
HIGH / V_IO
Normal Operation
FPF2498
Table 2. ABSOLUTE MAXIMUM RATINGS
Symbol
VPIN
Parameters
Min.
Max.
Voltage on VIN to GND, VIN to VOUT, OVLO Pins
−0.3
28.0
Voltage on ON, FLAGB Pins
−0.3
6.0
Voltage on VOUT to GND Pins
−0.3
20.0
ISW
Maximum Switch Current
tPD
Total Power Dissipation at TA = 25°C
TJ
Operating Junction Temperature
−40
Storage Junction Temperature
−65
TSTG
QJA
Thermal Resistance, Junction−to−Ambient (1−inch Square Pad of 2 oz. Copper)
ESD
Electrostatic Discharge Capability
IEC61000−4−2 System Level
Unit
V
1.75
A
1
W
+150
°C
+150
°C
95 (1)
°C/W
110 (2)
Human Body Model,
ANSI / ESDA / JEDEC JS−001−2012
3
Charged Device Model, JESD22−C101
2
Air Discharge (VIN, VON, VOUT to GND)
15
Contact Discharge (VIN, VON, VOUT to GND)
8
kV
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured using 2S2P JEDEC std. PCB.
2. Measured using 2S2P JEDEC PCB cold plate method.
Table 3. RECOMMENDED OPERATING CONDITIONS
Symbol
Parameters
VIN
Supply Voltage
Min.
Max.
Unit
3.5
12.0
V
1.7
A
85
°C
Current (Note 3)
ISW
Maximum Continues Switch
TA
Ambient Operating Temperature
−40
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
3. Maximum Junction Temperature = 85°C
Table 4. ELECTRICAL CHARACTERISTICS
Unless otherwise noted; VIN=3.5 to 5.5 V, TA = −40 to +85°C; typical values are at VIN = 5 V and TA = 25°C.
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Unit
mA
Basic Operation
ISD(OFF)
Shutdown Current
VIN = 5.5 V, VOUT = 0 V, VON = GND
0.4
3.0
IQ
Quiescent Current
VIN = 5.5 V, VOUT = Floating, IOUT = 0 mA
90
125
RON
On Resistance
VIN = 3.7 V, IOUT = 200 mA
90
VIN = 5.0 V, IOUT = 200 mA
80
mA
mW
95 (5)
VIN = 9 V, IOUT = 200 mA
VIN = 12 V, IOUT = 200 mA
VIH
ON Input Logic HIGH Voltage
VIN = 3.5 V to 5.5 V
VIL
ON Input Logic LOW Voltage
VIN = 3.5 V to 5.5 V
VOL_FLAG
FLAGB Output Logic LOW Voltage
VIN = 5 V, ISINK = 1 mA
IFLAGB_LK
FLAGB Output HIGH Leakage Current
VIN = 5 V, Switch On
Pull−Down Resistance on ON Pin
VIN = 5 V, OVLO = GND
RPD
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3
1.15
V
0.10
3
0.65
V
0.20
V
0.5
mA
MW
FPF2498
Table 4. ELECTRICAL CHARACTERISTICS
Unless otherwise noted; VIN=3.5 to 5.5 V, TA = −40 to +85°C; typical values are at VIN = 5 V and TA = 25°C.
Symbol
Parameter
Conditions
Min.
Typ.
Max.
6.2
6.5
6.8
Unit
Over−Voltage Protection
VOV_TRIP
Default Input OVP Lockout
VIN Rising Threshold OVLO = GND
VIN Falling Threshold OVLO = GND
6.2
V
VOVLO_SEL
Voltage threshold for OVLO selection
VIN = 3.5 V to 5.5 V, OVLO = GND
0.3
V
VOVP_HYS
Input OVP Hysteresis
VIN Falling Threshold OVLO = External
Setting
0.3
V
VOVLO_TH
OVLO Set Threshold
VIN = 3.5 to VOVLO
1.20
V
Response Time
IOUT = 0.5 A, CL = 0 mF, TA = 25°C,
VIN = 6 V to 7 V
0.5
Under−Voltage Lockout
VIN Rising
3.2
VIN Falling
3.0
tOVP
VUVLO
VUVLO_HYS
UVLO Hysteresis
1
ms
V
200
mV
mA
IRCB
RCB Current
VON = 0 V, VOUT = 5.5 V, VIN = 0 V
TSD
Thermal Shutdown
Shutdown Threshold
150
Return from Shutdown
130
Hysteresis
20
ISW > IOCP
2
A
4.3
ms
3.0
ms
2
5
°C
Over−Current Protection
IOCP
Over−Current Protection Trip Point
Dynamic Characteristics
tDON
tR
tON
Turn−On Delay (6)
VOUT Rise Time
Time (7)
7.3
ms
(5, 6)
600
ms
tF
VOUT Fall Time (5, 6)
2.0
ms
tOFF
Turn−Off Time (7, 8)
2.5
ms
tDOFF
Turn−On
(6)
Turn−Off Delay
Time for Device Ready for Large Load
Current (9)
CL = 10 mF
5
ms
Over−Current Blanking Time (5)
VIN = 5 V IOUT ≥ 1.7 A
64
ms
tOCP
Over−Current Response Time (5)
Moderate Over−Current Condition;
IOUT ≥ ILIM VOUT ≤ VIN
4
ms
tHOCP
Hard Over−Current Response Time
Moderate Over−Current Condition;
IOUT ≥ ILIM VOUT ≤ 0 V
3
ms
100
ms
tREADY
tRESTART
Over−Current/Voltage/Temp. Flag Release
tFLAGB_Release Time(5)
4.
5.
6.
7.
8.
9.
VIN = 5 V, RL = 100 W, CL = 10 mF,
TA = 25°C
Time for Flag to Release when Fault
Condition Removed
TA = 25°C
This parameter is guaranteed by design and characterization; not production tested.
tDON/tDOFF/tR/tF are defined in figure below.
tON = tR + tDON.
tOFF = tF + tDOFF.
After tREADY, the device is ready for maximum DC current load condition.
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4
FPF2498
TIMING DIAGRAM
90%
VON
10%
90%
90%
VOUT
10%
tdON
10%
tR
tdOFF
tON
tF
tOFF
Figure 3. Timing Diagram
Device Fault Behavior Timing
Figure 4. OCP Turn−Off Timing Diagram
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5
where:
tDON = Delay On Time;
tR = VOUT Rise Time;
tON = Turn−On Time;
tDOFF = Delay Off Time;
tF = VOUT Fall Time;
tOFF = Turn Off Time
FPF2498
OPERATION AND APPLICATION DESCRIPTION
Input Capacitor
VOUT. A 1 MW or larger resistor is recommended on R1
to reduce standby power consumption. To use the default
values of 5.8 V for VOVLO, connect the OVLO pin directly
to GND.
To limit the voltage drop on the input supply caused by
transient inrush current when the switch turns on into
discharge load capacitor; a capacitor must be placed
between the VIN and GND pins. A high−value CIN capacitor
can be used to reduce the voltage drop in high−current
applications.
Reverse−Current Blocking (RCB)
The reverse−current blocking feature protects the input
source against current flow from output to input. When the
load switch is OFF, no current flows from the output to input.
Output Capacitor
An output capacitor should be placed between the VOUT
and GND pins. This capacitor prevents parasitic board
inductance from forcing VOUT below ground when the
switch is on. This capacitor also prevents reverse inrush
current from creating a voltage spike that could damage the
device in the case of a VOUT short.
Thermal Shutdown (TSD)
Thermal shutdown protects the die from internally or
externally generated excessive temperature. During an
over−temperature condition, the switch is turned off. The
switch automatically turns on again if the temperature of the
die drops below the threshold temperature.
Fault Reporting
Current Limit
Upon the detection of an over−voltage, over−current, or
over−temperature condition, the FLAGB signals the fault by
activating LOW.
The current limit ensures that the current flow though the
switch doesn’t exceed a maximum value, which can damage
the device. If the current flow though the switch exceeds the
trip point, the switch turns off and enters the blanking time.
After the blanking time, the switch is re−enabled and checks
if the fault still exists.
Under−Voltage Lockout (UVLO)
The under−voltage lockout turns the switch off if the input
voltage drops below the lockout threshold. With the ON pin
active, the input voltage rising above the UVLO threshold
releases the lockout and enables the switch.
Board Layout
For best performance, all traces should be as short as
possible. The input and output capacitors should be placed
close to the device to minimize the effect that parasitic trace
inductance may have on normal and short−circuit operation.
Using wide traces for VIN, VOUT, GND minimizes
parasitic electrical effects along with minimizing the
case−to−ambient thermal impedance.
Over−Voltage Lockout (OVLO)
The OVLO pin sets the over−voltage lockout trip point
with a resistor−divider network. OVLO adjustment is set by
R1 and R2 and is compared to 1.2 V. When VIN × R2 /
(R1+R2) >1.2 V, which means VIN > VOVLO, the switch
turns off to ensure protection to devices connected to
Table 5. PACKAGE SPECIFIC DIMENSIONS
D
E
X
Y
1.300 ± 0.030
1.050 ± 0.030
0.325
0.250
ORDERING INFORMATION
Part Number
Operating Temperature
Package
Packing Method†
FPF2498BUCX
−40°C to 85°C
WLCSP6 (Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D
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6
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP6 1.30x1.05x0.586
CASE 567RT
ISSUE O
DOCUMENT NUMBER:
DESCRIPTION:
98AON16586G
WLCSP6 1.30x1.05x0.586
DATE 30 NOV 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
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