FPF2895VUCX

DATA SHEET www.onsemi.com Current Limit Switch, with OVP and TRCB, 28 V / 5 A Rated WLCSP24 2.6x1.67x0.612 CASE 567TQ FPF2895V PIN CONFIGURATION 1 2 3 4 Description The FPF2895V features a 28 V and 5 A rated current limit power switch, which offers Over−Current Protection (OCP), Over−Voltage Protection (OVP), and True Reverse Current Block (TRCB) to protect system. It has low On−resistance of typical 27 Wm with WL−CSP can operate over an input voltage range of 4 V to 22 V. The FPF2895V supports ±15% of current limit accuracy, over-current range of 500 mA to 2 A and ±10% of current limit accuracy, over−current range of 2 A to 5 A , flexible operations such as selectable OVP, selectable ON polarity and selectable OCP behavior, which can be optimized according to system requirements. The FPF2895V is available in a 24−bump, 1.67 mm x 2.60 mm Wafer−Level Chip−Scale Package (WL-CSP) with 0.4 mm pitch. Features • • • • • • • • • • • • • AEC−Q100 Qualified (Grade 2) 28 V / 5 A Capability Wide Input Voltage Range: 4 V ~ 22 V Ultra Low On−Resistance ♦ Typ. 27 mW at 5 V and 25 °C Adjustable Current Limit with external RSET ♦ 500 mA ~ 5 A Selectable OVLO with OV1 and OV2 Logic Input ♦ 5.95 V ± 50 mV ♦ 10 V ± 100 mV ♦ 16.8 V ± 300 mV ♦ 23 V ± 460 mV Selectable ON Polarity Selectable Over-Current Behavior ♦ Auto−Restart Mode ♦ Current Source Mode True Reverse Current Block Thermal Shutdown Open Drain Fault FLAGB Output UL60950−1 & IEC 60950−1 Certification 5 A Max Loading Robust ESD Capability ♦ 2 kV HBM & 1 kV CDM ♦ 15 kV Air Discharge & 8 kV Contact Discharge under IEC 61000−4−2 A NC ON FLAGB POL B GND OC_M ODE OV1 GND C ISET VOUT VIN OV2 D VOUT VOUT VIN VIN E VOUT VOUT VIN VIN F VOUT VOUT VIN VIN ORDERING INFORMATION See detailed ordering and shipping information on page 2 of this data sheet. Applications • Laptop, Desktop Computing and Monitor • Power Accessories • Automotive © Semiconductor Components Industries, LLC, 2018 October, 2021 − Rev. 1 1 Publication Order Number: FPF2895V/D FPF2895V Table 1. ORDERING INFORMATION Part Number Operating Temperature Range Top Mark Package Packing Method FPF2895VUCX −40_C − +105_C 3K 24−Ball, 0.4 mm Pitch WLCSP Tape & Reel Application Diagram Power Source Periphrals VOUT VIN CIN COUT FPF 2895 V GPIO ON NC POL VIO OC _MODE MCU FLAGB ISET OV 1 RSET OV 2 GND Figure 1. Typical Application Block Diagram VIN VOUT OVLO UVLO ON POL POL SEL Control Logic w/ Charge Pump Current Limit ISET NC OC _MODE OV 1 OV 2 FPF 2895 V OVP SEL FLAGB Thermal Shutdown GND Figure 2. Functional Block Diagram www.onsemi.com 2 FPF2895V PIN CONFIGURATION 1 2 3 4 A NC ON FLAGB POL B GND OC_M ODE OV1 C ISET VOUT D VOUT E F 4 3 2 1 POL FLAGB ON NC A GND GND OV1 OC_M ODE GND B VIN OV2 OV2 VIN VOUT ISET C VOUT VIN VIN VIN VIN VOUT VOUT D VOUT VOUT VIN VIN VIN VIN VOUT VOUT E VOUT VOUT VIN VIN VIN VIN VOUT VOUT F Pin Configuration (Top View) Pin Configuration (Bottom View) Figure 3. Pin Configuration Table 2. PIN DEFINITIONS Name Bump Type Description VIN C3, D3, D4, E3, E4, F3, F4 Input/Supply VOUT C2, D1, D2, E1, E2, F1, F2 Output Switch Output to Load Recommended to connect to GND Switch Input and Device Supply NC A1 Dummy ON A2 Input Internal pull−down resistor of 1 MW is included. Active polarity is depending on POL state (Note 1) POL A4 Input Enable Polarity Selection. Internal pull/up of 1 MW is included. HIGH (or Floating): Active LOW LOW: Active HIGH (Note 1) FLAGB A3 Output Active LOW, open drain output indicates an over−current, under−voltage, over−voltage, or over−temperature state. ISET C1 Input A resistor from ISET to ground set the current limit for the switch. See below selection Table 6. OC_MODE B2 Input OCP behavior can be selected. Internal pull−up of 1 MW is included. HIGH (or Floating): Auto−restart mode during over−current condition. LOW: Current source mode during over−current condition. (Note 1) OV1 B3 Input Over−Voltage Selection Input 1. Internal pull−up of 1 MW is included and see below selection Table 7. (Note 1) OV2 C4 Input Over−Voltage Selection Input 2. Internal pull−up of 1 MW is included and see Table 7 (Note 1) GND B1, B4 GND Device Ground 1. To avoid external noise influence when floating, recommend to connect these pins to a certain level. www.onsemi.com 3 FPF2895V Table 3. ABSOLUTE MAXIMUM RATINGS Symbol Min. Max. Unit VIN, VOUT to GND −0.3 28.0 V VPIN ON, POL, OC_MODE, ISET, FLAGB and OVn to GND −0.3 6.0 V ISW Continuous Switch Current 5.5 A tPD Total Power Dissipation at TA = 25°C 2.08 W +150 °C VIN, VOUT TSTG Parameter Storage Junction Temperature −65 TJ Operating Junction Temperature +150 °C TL Lead Temperature (Soldering, 10 Seconds) +260 °C 60 (Note 2) °C/W QJA Thermal Resistance, Junction−to−Ambient (1in.2 pad of 2 oz. copper) ESD Electrostatic Discharge Capability IEC61000−4−2 System Level Human Body Model, ANSI/ESDA/JEDEC JS−001 2 Charged Device Model, JESD22−C101 1 Air Discharge 15 Contact Discharge 8 kV Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 2. Measured using 2S2P JEDEC std. PCB. Table 4. RECOMMENDED OPERATING CONDITIONS Symbol VIN CIN / COUT TA Parameter Min. Max. Supply Voltage 4.0 22.0 Input and Output Capacitance 1.0 Ambient Operating Temperature −40 Unit V mF +105 °C Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 4 FPF2895V Table 5. ELECTRICAL CHARACTERISTICS (Unless otherwise noted, VIN = 4 to 22 V, TA = −40 to 105°C; typical values are at VIN = 5 V, CIN = COUT = 1 mF, ON = HIGH, POL = OV1 = OV2 = OC_MODE = GND and TA = 25°C.) Parameter Symbol Conditions Min. Typ. Max. Unit 22 V 75 100 mA VIN = 5 V 270 400 VIN = 12 V 300 450 VIN = 20 V 350 500 VIN = 5 V 27 39 VIN = 12 V 27 39 VIN = 20 V 27 39 BASIC OPERATION VIN Input Voltage (Note 4) ISD_IN VIN Shutdown Current IQ RON Quiescent Current On Resistance 4 VON = OFF, VIN = 5.5 V, VOUT = Short to GND IOUT = 0 mA, VON = ON TA = 25_C, IOUT = 1 A ION ON Input Leakage VON = VIN or GND VIH Logic Pin Input (ON, POL, OV1, OV2, OC_MODE) High Voltage VIN = 3 V ∼ 23 V VIL Logic Pin Input (ON, POL, OV1, OV2, OC_MODE) Low Voltage VIN = 3 V ∼ 23 V VP_LOW FLAGB Output Logic Low Voltage VIN = 5 V, ISINK = 5 mA ILKG FLAGB Output High, Leakage Current VIN = 5 V, Switch ON 10 mA mW mA V 1.2 0.4 0.1 0.2 1 V V mA PROTECTIONS ILIM VFOLD IFOLD VUVLO Current Limit (Note 3) ILIM Foldback Trip Voltage (Note 3) ILIM Foldback Current (Note 3) Under−Voltage Lockout VIN = 5 V, VOUT = 4 V, RSET = 3.01 kW, TA = −40 to 105_C 1.275 1.50 1.725 VIN = 5 V, VOUT = 4 V, RSET = 1.54 kW, TA = −40 to 105_C 2.70 3.00 3.30 VOUT under ILIM Mode 500 VIN = 5 V, VOUT < VFOLD, TA = 25_C, OC_MODE = LOW 250 VIN Increasing 2.70 VIN Decreasing 2.5 UVLO Hysteresis OV1 = LOW, OV2 = HIGH Over−Voltage Lockout OV1 = HIGH, OV2 = LOW OV1 = HIGH, OV2 = HIGH TOVP VT_RCB mA mA 2.95 VINRising 22.20 VINFalling 22.00 VINRising 9.80 VINFalling 9.75 VINRising 16.30 VINFalling 16.10 VINRising 5.85 VINFalling 5.80 OVP Response Time (Note 3) RL = 100 W, CL = 0 mF, VIN > VOVLO to VOUT = 0.9 × VIN TRCB Protection Trip Point VOUT − VIN 23.00 23.46 10.00 10.10 16.80 17.10 5.95 6.00 150 25 www.onsemi.com 5 V mV 200 OV1 = LOW, OV2 = LOW VOVLO V 2 VIN = 5 V, VOUT < VFOLD, TA = 25_C, OC_MODE = HIGH A 40 V ns mV FPF2895V Table 5. ELECTRICAL CHARACTERISTICS (Unless otherwise noted, VIN = 4 to 22 V, TA = −40 to 105°C; typical values are at VIN = 5 V, CIN = COUT = 1 mF, ON = HIGH, POL = OV1 = OV2 = OC_MODE = GND and TA = 25°C.) TRCB Protection, Release Point VIN − VOUT 25 TRCB Response Time (Note 3) VIN = 5 V, VON = HIGH/LOW 5 ms tRCB_Release TRCB Release Time (Note 3) VIN = 5 V, Enabled 1 ms tOC Over Current Response Time (Note 3) VIN = 5 V, Moderate OC 20 VIN = 5 V, Hard Short 5 VOUT Shutdown Current VON = OFF, VOUT = 5 V, VIN = Short to GND VR_RCB tRCB ISD_OUT TSD Thermal Shutdown (Note 3) 40 ms 2 Shutdown Threshold 150 Hysteresis 20 mV mA _C DYNAMIC BEHAVIOR tDON Delay On Time RL = 100 W CL = 1 mF 1 ms tR VOUT Rise Time RL = 100 W CL = 1 mF 1 ms tON Turn−On Time RL = 100 W CL = 1 mF 2 ms tDOFF Delay Off Time RL = 100 W CL = 1 mF 10 ms tF VOUT Fall Time RL = 100 W CL = 1 mF 200 ms tOFF Turn−Off Time RL = 100 W CL = 1 mF 210 ms tBLANK Over−Current Blanking Time (Note 3) OC_MODE = HIGH 5 tRSTRT Auto−Restart Time (Note 3) OC_MODE = HIGH 200 tQUAL Over−Current Qualification Time (Note 3) OC_MODE = LOW 5 Restart−up during or after OC 3 Restart−up during or after Thermal shutdown 15 Restart−up during or after UVLO 1 tDEB FLAGB De−bounce Time (Note 3) ms ms ms ms 3. Guaranteed by characterization and design, not production test. 4. To avoid output voltage is coupled to high during cold start, the slew rate of Vin should be less than 10 mV/ms Setting Current Limit RSET (kW) = 4448.6/Ilim [mA] Resistor tolerance of 1% or less is recommended. FPF2895V current limit is set with an external resistor connected between ISET and GND. This resistor is selected using the following equation: Table 6. ILIM VS. RSET LOOK−UP TABLE ILIM [mA] RSET [kW] Min. Typ. Max. 8.89 450 500 550 7.41 540 600 660 6.35 630 700 770 5.56 720 800 880 4.94 810 900 990 4.45 900 1000 1100 4.04 990 1100 1210 3.71 1080 1200 1320 3.42 1170 1300 1430 www.onsemi.com 6 FPF2895V Table 6. ILIM VS. RSET LOOK−UP TABLE ILIM [mA] RSET [kW] Min. Typ. Max. 3.18 1260 1400 1540 2.96 1350 1500 1650 2.78 1440 1600 1760 2.62 1530 1700 1870 2.47 1620 1800 1980 2.34 1710 1900 2090 2.22 1800 2000 2200 2.12 1890 2100 2310 2.02 1980 2200 2420 1.93 2070 2300 2530 1.85 2160 2400 2640 1.78 2250 2500 2750 1.71 2340 2600 2860 1.65 2430 2700 2970 1.59 2520 2800 3080 1.53 2610 2900 3190 1.48 2700 3000 3300 1.43 2790 3100 3410 1.39 2880 3200 3520 1.35 2970 3300 3630 1.31 3060 3400 3740 1.27 3150 3500 3850 1.24 3240 3600 3960 1.20 3330 3700 4070 1.17 3420 3800 4180 1.14 3510 3900 4290 1.11 3600 4000 4400 1.08 3690 4100 4510 1.06 3780 4200 4620 1.03 3870 4300 4730 1.01 3960 4400 4840 0.99 (Note 5) 4050 4500 4950 0.97 4140 4600 5060 0.95 4230 4700 5170 0.93 4320 4800 5280 0.91 4410 4900 5390 0.89 4500 5000 5500 5. Passed UL&CB certification with max. 5 A output current. www.onsemi.com 7 FPF2895V Table 7. OVLO LEVEL SELECTION ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ OV1 OV2 OVLO LOW LOW 23 V ± 460 mV LOW HIGH (Floating) 10 V ± 100 mV HIGH (Floating) LOW 16.3 ± V 300 mV HIGH (Floating) HIGH (Floating) 5.95 ± V 50 mV Table 8. DEVICE ENABLE POLARITY SELECTION POL ON Device State LOW LOW (Floating) OFF LOW HIGH ON HIGH (Floating) LOW (Floating) ON HIGH (Floating) HIGH OFF www.onsemi.com 8 ON Polarity Active HIGH Active LOW FPF2895V TIMING DIAGRAMS 5V 90% 90% VOUT 10% 10% t DOFF tR tF tDON ON 50% 50% Figure 4. Normal ON/OFF Operation by ON (POL = GND) VOVLO VIN t OVP Measure @ OVLO_Rising to VOUT = 90% VIN tR tDON tDON VOUT ON VIO FLAGB Figure 5. OVLO Operation (POL = GND & FLAGB is pulled up with an external VIO) t OC VIN ILIM tRSTRT IOUT tBLANK 0A VOUT GND VIO tDEB FLAGB OC Event Figure 6. Current Limit Operation (OC_MODE = HIGH & FLAGB is pulled up with an external VIO) www.onsemi.com 9 FPF2895V tOC VIN ILIM IOUT tQUAL VOUT tDEB VIO FLAGB OC Event Figure 7. Current Limit Operation (OC_MODE = LOW & FLAGB is pulled up with an external VIO) VIN IOUT t RCB 0A Peak reverse current developing V T_RCB with Ron VR _RCB to release TRCB > VIN VOUT = VIN VIN −VF = VIN tRCB _RELEASE Internal FETs ON ON OFF Figure 8. TRCB Operation (Device is Enabled) VOUT Load current above 6A within 1us, FPF2895 will turn off immediately IOUT IFOLD 0 t BLANK FLAGB t RSTRT t DON t QUAL Figure 9. VOUT Hard Short to GND (OC_MODE = HIGH & FLAGB is pulled up with an external VIO) www.onsemi.com 10 FPF2895V PRODUCT−SPECIFIC DIMENSIONS D 2600 mm ± 30 mm E X Y 1670 mm ± 30 mm 235 mm ± 18 mm 300 mm ± 18 mm www.onsemi.com 11 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP24 2.6x1.67x0.612 CASE 567TQ ISSUE O DOCUMENT NUMBER: DESCRIPTION: 98AON13331G WLCSP24 2.6x1.67x0.612 DATE 31 MAR 2017 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. 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