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to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
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Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s
technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA
Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended
or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out
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is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
FQPF5P20
P-Channel QFET® MOSFET
-200 V, -3.4 A, 1.4 Ω
Description
Features
This P-Channel enhancement mode power MOSFET is
produced using Fairchild Semiconductor’s proprietary
planar stripe and DMOS technology. This advanced
MOSFET technology has been especially tailored to reduce
on-state resistance, and to provide superior switching
performance and high avalanche energy strength. These
devices are suitable for switched mode power supplies,
audio amplifier, DC motor control, and variable switching
power applications.
• -3.4 A, -200 V, RDS(on) = 1.4 Ω (Max.) @ VGS = -10 V,
ID = -1.7 A
• Low Gate Charge (Typ. 10 nC)
• Low Crss (Typ. 12 pF)
• 100% Avalanche Tested
S
G
D
G
G
D
S
TO-220F
TO-220F
LG-formed
S
D
Absolute Maximum Ratings
Symbol
VDSS
ID
TC = 25°C unless otherwise noted.
FQPF5P20
FQPF5P20RDTU
-200
Parameter
Drain-Source Voltage
- Continuous (TC = 25°C)
Drain Current
- Continuous (TC = 100°C)
IDM
Drain Current
VGSS
Gate-Source Voltage
EAS
Single Pulsed Avalanche Energy
IAR
EAR
dv/dt
PD
TJ, TSTG
TL
- Pulsed
Unit
V
-3.4
A
-2.15
A
-13.6
A
± 30
V
(Note 2)
330
mJ
Avalanche Current
(Note 1)
-3.4
A
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Power Dissipation (TC = 25°C)
(Note 1)
3.8
-5.5
38
0.3
-55 to +150
mJ
V/ns
W
W/°C
°C
300
°C
(Note 1)
(Note 3)
- Derate Above 25°C
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering,
1/8" from Case for 5 Seconds.
Thermal Characteristics
Symbol
FQPF5P20
FQPF5P20RDTU
3.29
Parameter
RθJC
Thermal Resistance, Junction-to-Case, Max.
RθJA
Thermal Resistance, Junction-to-Ambient, Max.
©2000 Fairchild Semiconductor Corporation
FQPF5P20 Rev. C1
1
62.5
Unit
°C/W
www.fairchildsemi.com
FQPF5P20 — P-Channel QFET® MOSFET
August 2014
Part Number
Top Mark
FQPF5P20
FQPF5P20
FQPF5P20RDTU
FQPF5P20
Elerical Characteristics
Symbol
Package
TO-220F
Packing Method
Tube
Reel Size
N/A
Tape Width
N/A
Quantity
50 units
TO-220F
(LG-formed)
Tube
N/A
N/A
50 units
TC = 25°C unless otherwise noted.
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
-200
--
--
V
Off Characteristics
BVDSS
Drain-Source Breakdown Voltage
VGS = 0 V, ID = -250 μA
ΔBVDSS
/ ΔTJ
Breakdown Voltage Temperature
Coefficient
ID = -250 μA, Referenced to 25°C
--
-0.17
--
V/°C
-1
μA
μA
IDSS
Zero Gate Voltage Drain Current
VDS = -200 V, VGS = 0 V
--
--
VDS = -160 V, TC = 125°C
--
--
-10
IGSSF
Gate-Body Leakage Current, Forward
VGS = -30 V, VDS = 0 V
--
--
-100
nA
IGSSR
Gate-Body Leakage Current, Reverse
VGS = 30 V, VDS = 0 V
--
--
100
nA
On Characteristics
VGS(th)
Gate Threshold Voltage
VDS = VGS, ID = -250 μA
-3.0
--
-5.0
V
RDS(on)
Static Drain-Source
On-Resistance
VGS = -10 V, ID = -1.7 A
--
1.1
1.4
Ω
gFS
Forward Transconductance
VDS = -40 V, ID = -1.7 A
--
2.15
--
S
VDS = -25 V, VGS = 0 V,
f = 1.0 MHz
--
330
430
pF
--
75
98
pF
--
12
15
pF
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Switching Characteristics
td(on)
Turn-On Delay Time
tr
Turn-On Rise Time
td(off)
Turn-Off Delay Time
tf
Turn-Off Fall Time
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
VDD = -100 V, ID = -4.8 A,
RG = 25 Ω
(Note 4)
VDS = -160 V, ID = -4.8 A,
VGS = -10 V
(Note 4)
--
9
28
ns
--
70
150
ns
--
12
35
ns
--
25
60
ns
--
10
13
nC
--
2.8
--
nC
--
5.2
--
nC
Drain-Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain-Source Diode Forward Current
--
--
-3.4
A
ISM
Maximum Pulsed Drain-Source Diode Forward Current
VGS = 0 V, IS = -3.4 A
Drain-Source Diode Forward Voltage
--
--
-13.6
A
VSD
--
--
-5.0
V
trr
Reverse Recovery Time
--
175
--
ns
Qrr
Reverse Recovery Charge
VGS = 0 V, IS = -4.8 A,
dIF / dt = 100 A/μs
--
1.07
--
μC
Notes:
1. Repetitive rating : pulse-width limited by maximum junction temperature.
2. L = 42.8 mH, IAS = -3.4 A, VDD = -50 V, RG = 25 Ω, starting TJ = 25°C.
3. ISD ≤ -4.8 A, di/dt ≤ 300 A/μs, VDD ≤ BVDSS, starting TJ = 25°C.
4. Essentially independent of operating temperature.
©2000 Fairchild Semiconductor Corporation
FQPF5P20 Rev. C1
2
www.fairchildsemi.com
FQPF5P20 — P-Channel QFET® MOSFET
Package Marking and Ordering Information
VGS
-15.0 V
-10.0 V
-8.0 V
-7.0 V
-6.5 V
-6.0 V
Bottom : -5.5 V
1
1
10
Top :
0
10
-ID , Drain Current [A]
-ID, Drain Current [A]
10
-1
10
※ Notes :
1. 250μ s Pulse Test
2. TC = 25℃
150℃
25℃
※ Notes :
1. VDS = -40V
2. 250μ s Pulse Test
-55℃
-2
10
0
10
-1
-1
0
10
10
1
10
2
10
4
6
8
10
-VGS , Gate-Source Voltage [V]
-VDS, Drain-Source Voltage [V]
Figure 1. On-Region Characteristics
Figure 2. Transfer Characteristics
3.0
1
-IDR , Reverse Drain Current [A]
RDS(on) [Ω],
Drain-Source On-Resistance
10
VGS = - 10V
2.4
VGS = - 20V
1.8
1.2
0.6
※ Note : TJ = 25℃
0.0
0
10
150℃
-1
0
3
6
9
10
12
0.0
0.5
-ID , Drain Current [A]
750
-VGS, Gate-Source Voltage [V]
Ciss
Coss
300
※ Notes :
1. VGS = 0 V
2. f = 1 MHz
Crss
0
-1
10
0
10
2.5
3.0
10
VDS = -40V
10
VDS = -100V
VDS = -160V
8
6
4
2
※ Note : ID = -4.8 A
0
1
0
2
4
6
8
10
12
QG, Total Gate Charge [nC]
-VDS, Drain-Source Voltage [V]
Figure 5. Capacitance Characteristics
©2000 Fairchild Semiconductor Corporation
FQPF5P20 Rev. C1
2.0
12
600
150
1.5
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperature
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
450
1.0
-VSD , Source-Drain Voltage [V]
Figure 3. On-Resistance Variation vs.
Drain Current and Gate Voltage
Capacitance [pF]
※ Notes :
1. VGS = 0V
2. 250μ s Pulse Test
25℃
Figure 6. Gate Charge Characteristics
3
www.fairchildsemi.com
FQPF5P20 — P-Channel QFET® MOSFET
Typical Characteristics
(Continued)
2.5
RDS(ON), (Normalized)
Drain-Source On-Resistance
-BVDSS, (Normalized)
Drain-Source Breakdown Voltage
1.2
1.1
1.0
※ Notes :
1. VGS = 0 V
2. ID = -250 μA
0.9
0.8
-100
-50
0
50
100
150
2.0
1.5
1.0
※ Notes :
1. VGS = -10 V
2. ID = -2.4 A
0.5
0.0
-100
200
-50
o
0
50
100
150
200
o
TJ, Junction Temperature [ C]
TJ, Junction Temperature [ C]
Figure 7. Breakdown Voltage Variation
vs. Temperature
Figure 8. On-Resistance Variation
vs. Temperature
4
Operation in This Area
is Limited by R DS(on)
1 ms
-ID, Drain Current [A]
-ID, Drain Current [A]
1
10
10 ms
100 ms
DC
0
10
※ Notes :
3
2
1
o
1. TC = 25 C
o
2. TJ = 150 C
3. Single Pulse
-1
10
0
1
10
0
25
2
10
10
50
Figure 9. Maximum Safe Operating Area
ZθJC(t), Thermal Response [oC/W]
Zθ JC(t), Thermal Response
75
100
125
150
TC, Case Temperature [℃]
-VDS, Drain-Source Voltage [V]
Figure 10. Maximum Drain Current
vs. Case Temperature
D = 0 .5
10
0
0 .2
※ N o te s :
1 . Z θ J C ( t) = 3 . 2 9 ℃ /W M a x .
2 . D u ty F a c to r , D = t 1 / t 2
3 . T J M - T C = P D M * Z θ J C ( t)
0 .1
0 .0 5
10
-1
0 .0 2
PDM
0 .0 1
t1
s in g le p u ls e
10
t2
-2
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
t 1 , S q u a r e W a v e P u ls e D u r a t io n [ s e c ]
Figure 11. Transient Thermal Response Curve
©2000 Fairchild Semiconductor Corporation
FQPF5P20 Rev. C1
4
www.fairchildsemi.com
FQPF5P20 — P-Channel QFET® MOSFET
Typical Characteristics
200nF
12V
FQPF5P20 — P-Channel QFET® MOSFET
VGS
Same Type
as DUT
50KΩ
Qg
-10V
300nF
VDS
VGS
Qgs
Qgd
DUT
-3mA
IG = const.
Charge
Figure 12. Gate Charge Test Circuit & Waveform
VDS
RG
RL
t on
td(on)
VDD
VGS
VGS
t off
tr
td(off)
tf
10%
DUT
VGS
-10V
VDS
90%
Figure 13. Resistive Switching Test Circuit & Waveforms
BVDSS
1
EAS = ---- L IAS2 -------------------2
BVDSS - VDD
L
VDS
tp
ID
RG
VDD
VDD
VGS
-10V
Time
VDS (t)
ID (t)
DUT
IAS
BVDSS
tp
Figure 14. Unclamped Inductive Switching Test Circuit & Waveforms
©2000 Fairchild Semiconductor Corporation
FQPF5P20 Rev. C1
5
www.fairchildsemi.com
FQPF5P20 — P-Channel QFET® MOSFET
+
VDS
DUT
_
I SD
L
Driver
RG
VGS
VGS
( Driver )
Compliment of DUT
(N-Channel)
VDD
• dv/dt controlled by RG
• ISD controlled by pulse period
Gate Pulse Width
D = -------------------------Gate Pulse Period
10V
Body Diode Reverse Current
I SD
( DUT )
IRM
di/dt
IFM , Body Diode Forward Current
VDS
( DUT )
VSD
Body Diode
Forward Voltage Drop
VDD
Body Diode Recovery dv/dt
Figure 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms
©2000 Fairchild Semiconductor Corporation
FQPF5P20 Rev. C1
6
www.fairchildsemi.com
B
A
10.36
9.96
B
3.28
3.08
7.00
3.40
3.20
2.66
2.42
0.70
6.88
6.48
1 X 45°
B
R1.00
1
3
1.47
1.24
R1.00
0.90
0.70
2.14
0.50 M
2.54
2.54
B
2.96
2.56
8.50
7.50
B
A
B
4.50
3.50
B
B
4.90
4.50
NOTES:
A. EXCEPT WHERE NOTED CONFORMS TO
EIAJ SC91A.
B DOES NOT COMPLY EIAJ STD. VALUE.
C. ALL DIMENSIONS ARE IN MILLIMETERS.
D. DIMENSIONS ARE EXCLUSIVE OF BURRS,
MOLD FLASH AND TIE BAR PROTRUSIONS.
E. DIMENSION AND TOLERANCE AS PER ASME
Y14.5-1994.
F. DRAWING FILE NAME: TO220N03REV2
16.07
15.67
0.60
0.45
4.80
4.20
B
A
10.36
9.96
B
3.28
3.08
7.00
3.40
3.20
2.66
2.42
0.70
SEE NOTE "F"
SEE NOTE "F"
6.88
6.48
1 X 45°
B
16.00
15.60
16.07
15.67
(3.23) B
1
2.14
3
1.47
1.24
2.96
2.56
0.90
0.70
10.05
9.45
0.50 M
A
30°
0.45
0.25
2.54
B
2.54
B
4.90
4.50
NOTES:
A. EXCEPT WHERE NOTED CONFORMS TO
EIAJ SC91A.
B DOES NOT COMPLY EIAJ STD. VALUE.
C. ALL DIMENSIONS ARE IN MILLIMETERS.
D. DIMENSIONS ARE EXCLUSIVE OF BURRS,
MOLD FLASH AND TIE BAR PROTRUSIONS.
E. DIMENSION AND TOLERANCE AS PER ASME
Y14.5-1994.
F. OPTION 1 - WITH SUPPORT PIN HOLE.
OPTION 2 - NO SUPPORT PIN HOLE.
G. DRAWING FILE NAME: TO220M03REV5
0.60
0.45
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
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