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to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
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Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON
Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s
technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA
Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended
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is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
FSA8049
Audio Jack Detection and Configuration, MIC / GND
Cross Point Switch
Features
Description
Detection
Audio Plug GND & MIC Polarity
VDD
2.5 to 4.4 V
THD (MIC)
0.002% Typical
ESD (IEC 61000-4-2)
(Air Gap)
15 kV
Operating Temperature
-40°C to 85°C
9-Ball WLCSP 3x3 Array, 0.4 mm
Terminal Pitch, 250 µm Ball
Package
Top Mark
M3
Ordering Information
FSA8049UCX
Detects 3- or 4-pole audio accessories
Detects polarity of GND and MIC on 4-pole plugs
Automatically routes GND and MIC to audio jack terminals
Related Resources
For evaluation boards and questions, please contact:
Applications
The FSA8049 is an audio jack detection switch for 3- or
4-pole accessories. The FSA8049 detects the locations of
ground (GND) and microphone (MIC) poles on the audio
plug and automatically routes them to the appropriate
connections. This allows the end user to plug accessories,
such as headsets with different audio pole configurations,
into the mobile device and have them operate correctly.
Analog.Switch@fairchildsemi.com.
Cellular Phones, Smart Phones
MP3 and Portable Multimedia Player
Typical Application
To Audio Plug
Detection Circuit
VDD
Baseband
Processor
GPIO
EN
Audio Jack
Oscillator &
Logic
Detection
LSPKR
CEXT
Audio
Sub System
RSPKR
Switch Enable
Timing
3Pole
4Pole
MIC Bias
RMIC
MIC
CMIC
GND/MIC1
MIC
GND/MIC2
5Ω
tOn/Off
Capacitor
100mΩ
GND
GNDA
Figure 1. Mobile Phone Example
© 2011 Fairchild Semiconductor Corporation
FSA8049 • Rev. 1.0.2
www.fairchildsemi.com
FSA8049 — Audio Jack Detection and Configuration, MIC/GND Cross point Switch
August 2012
1
2
3
A
VDD
GNDA
GND /
MIC1
B
MIC
GNDA
GND /
MIC 2
C
EN
CEXT
GND
3
2
1
GNDA
VDD
A
GND/
MIC2
GNDA
MIC
B
GND
CEXT
EN
C
GND//
MIC1
M3 KK
XYZ
Pin Assignments , Top Through View
Top Mark Side
Pin Assignments Bottom View
Bump Side
2
3
GND/
MIC1
GND/
MIC2
GND
Top View
1
VDD
GNDA
GNDA
CEXT
MIC
EN
M3
KK
X
Y
Z
●
A
B
C
=
=
=
=
=
=
FSA8049UCX Product Identifier
Lot Run Trace Code
Year
Work Week
Assembly Site (P= Penang, Malaysia)
Pin 1 Indicator
Bottom View
Figure 2. Pin Assignments
Figure 3. Top Mark
Pin Descriptions
Name
Ball
Type
Description
VDD
A1
Power
GNDA
A2
GND
Supply voltage
GND/MIC1
A3
I/O
Switch connects to audio jack
MIC
B1
I/O
Switch connects to audio subsystem microphone pre-amplifier
GNDA
B2
GND
GND/MIC2
B3
I/O
EN
C1
Input
Enable (0=VIL, 1=VIH)
CEXT
C2
Input
External capacitor for switch slow tON/OFF timing
GND
C3
GND
Device Ground(1)
Switch Ground(1)
Switch Ground(1)
Switch connects to audio jack
0
Disabled
1
Enabled
Note:
1. GND and GNDA can be shorted together if the system does not utilize an FM antenna on the handset ground. If the
system utilizes an FM antenna on the handset ground; separate GND and GNDA, place the FM-decoupling inductor and
capacitor on GNDA only, and connect GND to a low-impedance path to battery ground.
States of Pins after Audio Jack Detection
State of pins GND/MIC1, GND/MIC2, and MIC after detection time (tDET) is complete.
GND/MIC1
GND/MIC2
0 (GND)
0 (GND)
0 (GND)
1 (MIC Attached)
GND/MIC1=GND, GND/MIC2=MIC
4-Pole Headset with Microphone
1 (MIC Attached)
0 (GND)
GND/MIC1=MIC, GND/MIC2=GND
4-Pole Headset with Microphone
© 2011 Fairchild Semiconductor Corporation
FSA8049 • Rev. 1.0.2
Switch Configuration
Accessory Connected
GND/MIC1=GND, GND/MIC2=GND, MIC=GND 3-Pole Headphones
www.fairchildsemi.com
2
FSA8049 — Audio Jack Detection and Configuration, MIC/GND Cross point Switch
Pin Configuration
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable
above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition,
extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute
maximum ratings are stress ratings only.
Symbol
v
VSW
Parameter
Min.
Max.
Unit
Supply Voltage from Battery
-0.5
6.0
V
VCC+0.5
Switch I/O Voltage
-0.5
IIK
Input Clamp Diode Current
-50
ISW
Switch I/O Current (Continuous)(2)
TSTG
Storage Temperature Range
-65
TJ
Maximum Junction Temperature
TL
Lead Temperature (Soldering, 10 Seconds)
IEC 61000-4-2 System ESD
ESD
Human Body Model, JEDEC JESD22-A114
Air Gap
15
Contact
8
GND/MICn vs. GND
11
VDD vs. GND
16
All Pins
7
Charged Device Model, JEDEC JESD22-C101 All Pins
V
mA
50
mA
+150
°C
+150
°C
+260
°C
kV
1.5
Note:
2. The input and output negative ratings may be exceeded if the input and output diode current ratings are observed.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating
conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend
exceeding them or designing to Absolute Maximum Ratings.
Symbol
Parameter
VDD
Supply Voltage
VEN
Enable Input Voltage
TA
Operating Temperature
© 2011 Fairchild Semiconductor Corporation
FSA8049 • Rev. 1.0.2
Min.
Max.
Unit
2.5
4.4
V
0
VDD
V
-40
+85
ºC
www.fairchildsemi.com
3
FSA8049 — Audio Jack Detection and Configuration, MIC/GND Cross point Switch
Absolute Maximum Ratings
All typical values are at TA=25°C unless otherwise specified.
Symbol
Parameter
VDD (V)
Condition
TA=-40 to +85°C
Min.
Typ.
Max.
3.00
2.50
0.25
0.20
5.00
4.00
0.50
0.40
Unit
MIC Switch (MIC to (GND/MIC1 or GND/MIC2))
RON(MIC)
MIC Switch On Resistance
RFLAT(ON)
On Resistance Flatness
VIN(MIC)
CON(MIC)
COFF(MIC)
2.8
3.8
2.8
3.8
IOUT=24 mA, VIN=1.8 V
IOUT=24 mA, VIN=1 V to VDD
2.7 to 4.4
Switch Input Voltage Range
0
VDD
Ω
Ω
V
(3)
3.8
f=1 MHz
90
pF
(3)
3.8
f=1 MHz
21
pF
2.8
3.8
IOUT=24 mA
90
80
MIC Switch On Capacitance
MIC Switch Off Capacitance
GND Switch (GND to (GND/MIC1 or GND/MIC2))
RON(GNDA) GND Switch On Resistance
VIN(GNDA)
Switch Input Voltage Range
XC(GNDA)
GND Switch On Reactance
(4)
2.7 to 4.4
3.8
0
f=88 MHz to 108 MHz,
VIN=50 mV
170
100
mΩ
1
V
100
mΩ
Parallel I/O
VIH
Input High Voltage
2.7 to 4.4
1.1
VDD
V
VIL
Input Low Voltage
2.7 to 4.4
0
0.55
V
ICCT
Increase in Quiescent Supply
Current
4.4
EN=1.3 V
3
µA
IOZ
Switch Leakage Current
4.4
GND/MICn=1 V, 4.3 V;
MIC=4.3V, 1V; EN=LOW
75
nA
IIN
Input Leakage Current
0.1
µA
Current
0 to 4.4
-75
EN Input 0 to 4.3 V
ICC-DIS
Disabled Current
2.7 to 4.4 EN=0
100
nA
ICC-EN
Enabled Current After Detection
2.7 to 4.4 EN=1
100
nA
ICC-DET
Current During Detection Mode
2.7 to 4.4
EN=0→1, 3-Pole Mode,
GND/MIC1=GND/MIC2
0.5
2.0
mA
Notes:
3. Guaranteed by characterization.
4. Guaranteed by design.
© 2011 Fairchild Semiconductor Corporation
FSA8049 • Rev. 1.0.2
www.fairchildsemi.com
4
FSA8049 — Audio Jack Detection and Configuration, MIC/GND Cross point Switch
DC Electrical Characteristics
All typical values are at TA=25°C unless otherwise specified.
Symbol
Parameter
VDD (V)
Condition
TA = -40 to +85°C
Min.
Typ.
Max.
Unit
MIC Switch
THD
OIRR
(5)
Total Harmonic Distortion
Off Isolation
3.8
(5)
3.8
RT=600 Ω, VSW=0.5 VPP,
f=20 Hz to 20 kHz,
VIN=1.8 V and 2.2 V
(Figure 4)
0.002
f=20 kHz, RS=32 Ω,
CL=0 pF, RT=32 Ω
(Figure 5)
-108
f=20 KHz, RS=600 Ω,
CL=0 pF, RT=600 Ω
(Figure 5)
-85
CEXT=Float
RL=10 kΩ, CL=10 pF
200
µs
CEXT=0.1 µF
RL=10 kΩ, CL=10 pF
140
ms
CEXT=Float
RL=10 kΩ, CL=10 pF
20
µs
CEXT=0.1 µF
RL=10 kΩ, CL=1 0pF
6
ms
RL=10 kΩ, CL=10 pF
100
ns
%
dB
Parallel I/O
tON-GNDA
Switch Turn-On Time (MIC & GND
Switch), Measure 10/90
3.8
Switch Turn-Off Time (MIC & GND
Switch), Measure 10/90
3.8
tOFF-MIC
Switch Turn-Off Time (MIC
Switch), Measure 10/90
3.8
tON-DET
Detection Circuit NMOS On time
2.7 to 4.4
20
µs
20
µs
tOFF-GNDA
tOFF-DET
Detection Circuit NMOS OFF time
2.7 to 4.4
tDET
Detection Time of Audio Jack
GND and MIC Terminals(6)
2.7 to 4.4
EN=1
50
ms
tEN
Enable / Disable Time
2.7 to 4.4
EN=01, EN=10
15
µs
Power Supply Noise
300mVPP, Measured
10/90%, f=217 Hz Square
Wave
-89
dB
Power
PSRR
Power Supply Rejection Ratio
(5)
3.8
Notes:
5. Guaranteed by characterization.
6. Detection time may be longer if there is noise in the system or a poor audio jack connection.
© 2011 Fairchild Semiconductor Corporation
FSA8049 • Rev. 1.0.2
www.fairchildsemi.com
5
FSA8049 — Audio Jack Detection and Configuration, MIC/GND Cross point Switch
AC Electrical Characteristics
FSA8049 — Audio Jack Detection and Configuration, MIC/GND Cross point Switch
Typical Performance Characteristics
Figure 4.
THD Test Setup
Figure 5.
© 2011 Fairchild Semiconductor Corporation
FSA8049 • Rev. 1.0.2
Off Isolation
www.fairchildsemi.com
6
FSA8049 — Audio Jack Detection and Configuration, MIC/GND Cross point Switch
Physical Dimensions
F
0.03 C
A
E
2X
0.40
B
Ø0.20
Cu Pad
A1
PIN A1
INDEX AREA
0.40
D
Ø0.30
Solder Mask
0.03 C
2X
LAND PATTERN RECOMMENDATION
(NSMD PAD TYPE)
TOP VIEW
0.06 C
0.05 C
0.625
0.547
C
SEATING PLANE
D
0.378±0.018
E
0.208±0.021
SIDE VIEWS
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
Ø0.260±0.020
9X
0.40
C. DIMENSIONS AND TOLERANCE
PER ASMEY14.5M, 1994.
C
B
A
0.40
B. DIMENSIONS ARE IN MILLIMETERS.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
(Y)±0.018
E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS
±39 MICRONS (547-625 MICRONS).
F
1 2 3
(X)±0.018
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
BOTTOM VIEW
G. DRAWING FILNAME: MKT-UC009ABrev2
Figure 6. 9-Ball, Wafer-Level Chip-Scale Package (WLCSP), 3x3 Array, 0.4 mm Pitch, 250 µm Ball
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which
covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
Ordering Information
Part
Number
FSA8049UCX
Operating
Top
Temperature
Mark
Range
-40 to +85°C
© 2011 Fairchild Semiconductor Corporation
FSA8049 • Rev. 1.0.2
M3
Package
9-Ball, Wafer-Level Chip-Scale Package
(WLCSP), 3x3 Array, 0.4 mm Pitch,
250 µm Ball
D
E
X
Y
1.16 mm 1.16 mm 0.018 mm 0.018 mm
www.fairchildsemi.com
7
FSA8049 — Audio Jack Detection and Configuration, MIC/GND Cross point Switch
© 2011 Fairchild Semiconductor Corporation
FSA8049 • Rev. 1.0.2
www.fairchildsemi.com
8
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ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
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regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
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