FSA8069UCX

FSA8069UCX

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    WLCSP12_1.56X1.16MM

  • 描述:

  • 数据手册
  • 价格&库存
FSA8069UCX 数据手册
Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. FSA8069 Audio Jack IC Featuring Impedance and Moisture Detection Features Description  The FSA8069 is an audio jack detection switch for 3.5 mm and 2.5 mm headsets. The FSA8069 features impedance detection and moisture sensing, which prevents false detection of accessories in the audio jack. An integrated MIC switch allows a processor to configure attached accessories. An LDO provides DC bias to microphone and remote key circuit in accessory. The FSA8069 detects seven headset impedance steps and supports configurable gain in the amplifier according to the type of load. The architecture is designed to allow headphones to be used for listening to music from mobile handsets, personal media players, and portable peripheral devices. Detection:        Accessory Plug-In Send / End Key Press Impedance Detection Prevents False Detection due to Moisture VDD: 3.0 V to 4.5 V VIO: 1.6 V to VDD THD (MIC): 0.01% Typical 15 kV Air Gap ESD Detects 7 Steps of Headset Impedance Integrates LDO for MIC Bias Circuit MIC Switch Removes Audio Jack “Pop” and “Click” Caused by MIC Bias Applications    Any Device with 3.5 mm and 2.5 mm Audio Jack Cellular Phones, Smart Phones, and Tablets MP3, GPS, and PMP FSA8069 Processor I2C / Control Impedance / Moisture Detection Power + Audio Jack - MICBIAS LDO Audio Codec Figure 1. Block Diagram Ordering Information Part Number (1) FSA8069UCX Operating Temperature Range Top Mark Package Packing Method -40°C to 85°C MX 12-Ball WLCSP, 1.415 mm x 1.615 mm, 0.4 mm Pitch Tape & Reel Notes: 1. Includes backside lamination. © 2014 Fairchild Semiconductor Corporation FSA8069 • Rev. 1.3 www.fairchildsemi.com FSA8069 — Audio Jack IC Featuring Impedance and Moisture Detection February 2015 FSA8069 µP (AP or CP) /INT /INT SCL SDA SCL SDA I2C / Control Impedance/ Moisture Detection K/P K/P 0.1-1µF VIO 1µF VDD Power LDO ADCIN 2.2k (Note #2) LDO 2.8V, 5mA Key-Press Detection C1 (Note #3) L R G M 220nF (Note #3) J_MIC MIC MICIN Audio Codec J_DET Internal Regulator GND GND HPOUT_L HPOUT_R 10k (Note #4) Figure 2. System Diagram Notes: 2. 2.2 kΩ can generally be used in applications to bias the accessory microphone. Two separate resistors totaling 2.2 k with a large capacitor between them can improve noise rejection performance, as shown in Figure 7. 3. A DC-blocking capacitor (typically 1 µF) should be used when the codec requires AC-coupled input only. This capacitor can be removed and be tied to directly without C1 if the MICIN of the codec supports DC-coupled input. 4. A pull-down resistor allows the FSA8069 to detect Hi-Z (open cable) type accessories due to J_DET contact to left when an accessory is inserted. © 2014 Fairchild Semiconductor Corporation FSA8069 • Rev. 1.3 www.fairchildsemi.com 2 FSA8069 — Audio Jack IC Featuring Impedance and Moisture Detection Typical Application Diagram VDD INTB SCL A LDO K/P SDA B GND GND VIO C MIC J_MIC J_DET D 1 Figure 3. 2 3 Pin Assignment (Through View) Pin Definitions Name Pin # Type Description VDD A1 Power Device supply (3.0 V to 4.5 V) VIO C3 Power I/O supply (1.6 V to VDD) LDO output (2.8 V) LDO B1 Power J_DET D3 Detection Input MIC D1 Signal Path Microphone switch path that connects to the microphone input of the codec J_MIC D2 Signal Path Microphone switch path that connects to the audio jack SDA B3 DATA I C data SCL A3 DATA I C clock INTB A2 Output Interrupt output LOW: interrupt is asserted (active) HIGH: interrupt is not asserted K/P B2 Output Indicates state of headset key for a 4-pole jack when a key is being pressed HIGH: Key is being pressed LOW: Key is not being pressed GND C1, C2 Power Device ground © 2014 Fairchild Semiconductor Corporation FSA8069 • Rev. 1.3 Input from the audio jack; plug insert / removal detection pin 2 2 www.fairchildsemi.com 3 FSA8069 — Audio Jack IC Featuring Impedance and Moisture Detection Pin Configuration Moisture Detection Headset Impedance Detection Range Moisture in the audio jack can cause the phone to incorrectly route audio signals to the audio jack rather than the phone speaker or microphone. Users perceive this as a dropped call or muted phone. The FSA8069 protects against this type of false plug insertion notification and asserts a Moisture Change interrupt in Interrupt1 (0x04h) Register. FSA8069 detects jack insertion and removal by monitoring impedance on the J_DET pin. The accessory types is updated in the Status (03H) register. Figure 4. Moisture Impedance Detection Table 1. Impedance Detection Range Accessory Type Impedance Step Target Range [Ω] Headset #1 Step 0 0 to 24 Headset #2 Step 1 24 to 42 Headset #3 Step 2 42 to 100 Headset #4 Step 3 100 to 200 Headset #5 Step 4 200 to 450 Headset #6 Step 5 450 to 1,000 Line_In/Out (CarKit) Step 6 1000 to 15,000 Music Mode When a 4-pole headset is inserted into the audio jack and a music/listening application is used, the MIC bias is normally enabled for headset button press detection (i.e. mute, volume change, etc.). This consumes power due to a constant path from the MIC bias resistor and microphone in the headset to GND. Fairchild has developed a Music Mode to enable the MIC switch periodically to monitor for a pressed button. This results in a power savings for battery-sensitive devices, such as cell phones or MP3 players. The FSA8069 enters Music Mode when the Music Mode Enable bit in CONTROL(02h) is set and a plug is inserted,. Music Mode reduces MIC bias current by approximately 90% with the default Music Mode timing (0Bh) register value. MIC BIAS Audio CODEC R L 2.2K LDO Operation The integrated microphone bias LDO is set to 2.8 V. The LDO can be used to bias a microphone accessory 2 and is enabled / disabled by the I C register bit LDO ENABLE in the COLTROL register(02h)). This LDO requires a 0.22 µF to 1 µF coupling capacitor on the output. The coupling capacitor should be placed close to the LDO pin. Headset Key-Press Operation The headset key-press comparator threshold is a function of the MIC bias voltage, MIC bias resistor, and the MIC impedance. All of these variables must be considered when calculating the key-press resistor value. Figure 6 is an example of how to calculate the key-press resistor value. MIC MIC 1uF MIC Bias Current Flow Figure 5. MIC Bias Leakage Path RBIAS Key Press VBIAS 1 VTH_SE=0.69 V VBIAS=2.8 V RBIAS=2.2 kΩ RMIC=2 kΩ RMIC Figure 6. © 2014 Fairchild Semiconductor Corporation FSA8069 • Rev. 1.3 - VTH_SE VTH_SE RKEY Key Press Resistor 1 1 RKEY ≤ VBIAS-VTH_SE / RMIC RBIAS RKEY ≤ 1100 Ω Example Key-Press Resistor Calculations and Values www.fairchildsemi.com 4 FSA8069 — Audio Jack IC Featuring Impedance and Moisture Detection Application Information PCB layout can degrade the audio quality and be a contributory factor in audible noise coupling issues, high-frequency noise (ESD/ EMI) issues, and signal losses. To avoid unexpected noise issues and to achieve stable regulator output, all external components should be placed as close to the FSA8069 as possible. Decrease the spacing between the traces for MIC and ground signals between the audio jack to increase the inductive coupling of these signals. In effect, this creates a low-frequency band-pass filter that shunts ESD energy to ground before it reaches internal components. Where feasible, lay the MIC trace as a shielded stripline; as shown in Figure 9. FSA8069 MICBIAS_2.8V LDO GND LDO 2.8V, 5mA C1 R1 C2 ~3-4 mils GND R2 MIC J_MIC Codec MICIN ~3-4 mils Audio Jack Figure 7. MIC Bias and MIC Switch Circuit R1 C1 A1 A2 A3 B1 B2 B3 C1 C2 C3 D1 D2 D3 MIC GND ~3-4 mils GND Figure 9. MIC PCB Trace as Shield Strip Line R2 Audio Jack C2 Codec MICIN GND Figure 8. Recommended PCB Layout Placement © 2014 Fairchild Semiconductor Corporation FSA8069 • Rev. 1.3 www.fairchildsemi.com 5 FSA8069 — Audio Jack IC Featuring Impedance and Moisture Detection Recommended LDO Bias Circuit and MIC Switch PCB Layout Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol VDD, VIO Parameter Min. Max. Unit Supply Voltage from Battery -0.5 6.0 V VSW Switch I/O Voltage (MIC, J_MIC) -0.5 VDD+0.5 V VJD Input Voltage for J_DET Input -1.5 VDD+0.5 V IIK Input Clamp Diode Current -50 ISW Switch I/O Current TSTG Storage Temperature Range -65 mA 50 mA +150 C TJ Maximum Junction Temperature +150 C TL Lead Temperature (Soldering, 10 Seconds) +260 C IEC 61000-4-2 System ESD ESD Human Body Model, ANSI/ESDA/JEDEC JS-001-2012 Charged Device Model, JEDEC JESD22-C101 Air Gap 15 Contact 8 J_DET, J_MIC, VDD, VIO, GND 8 All Other Pins 2 All Pins 1 kV Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Min. Max. Unit VDD Battery Supply Voltage 3.0 4.5 V VIO Parallel I/O Supply Voltage 1.6 VDD V VSW Switch Input Voltage (J_MIC, MIC) 0 3.0 V -40 +85 ºC -1.4 +1.4 V TA Operating Temperature J_DETAudioV Audio Voltage Range on J_DET Pin COUT RJ_DET LDO Output Capacitance 220 Resistance on Audio Accessory Left Channel to Generate Valid Attach © 2014 Fairchild Semiconductor Corporation FSA8069 • Rev. 1.3 nF 15.75 kΩ www.fairchildsemi.com 6 FSA8069 — Audio Jack IC Featuring Impedance and Moisture Detection Absolute Maximum Ratings All typical values are at TA=25°C, CIN_VDD=1.0 µF, CIN_VIO=0.1 µF, and COUT_LDO=0.22 µF unless otherwise specified. Symbol Parameter VDD (V) Conditions TA = -40 to +85°C Min. Typ. Max. Unit MIC Switch RON RFLAT(ON) MIC Switch On Resistance 3.8 IOUT=30 mA, VIN=2.2 V 0.50 On Resistance Flatness 3.8 IOUT=30 mA, VIN=1.6 V to VDD 0.30 0 MIC, J_MIC Ports VA=4.3 V IOFF Power-Off Leakage Current Through Switch ION Input Leakage Current MIC, J_MIC switch ON IOZ Off Leakage Current Ω Inputs VMIC, VJMIC=3.0 V, Other 3.0 to 4.5 Side of Switch Port Floating 4.5 MIC and J_MIC Port VIN=3.0 V Comparator Threshold for Key Detection 3.0 to 4.5 Detection Threshold (0Fh) [3:0]=1001 (790 mV) 0.79 Tolerance between Impedance Detection Steps (see Table 1) 3.0 to 4.5 Impedance Detection Mode 5% 1.50 3 µA 1 µA 1 µA Key Press VCOMP V J_DET J_DETTolerance Parallel I/O (KP, INTB) VOH Output High Voltage IOH=-100 µA VOL Output Low Voltage IOL=+100 µA 0.8 × VIO 0.2 × VIO V 2 I C Controller DC Characteristics Fast Mode (400 kHz) VIL Low-Level Input Voltage VIH High-Level Input Voltage 0.3 × VIO 0.7 × VIO VOL1 Low-Level Output Voltage at 3 mA Sink Current (Open-Drain) Ii2C Input Current of I2C_SDA and I2C_SCL Pins, Input Voltage 0.26 V to 2.34 V VIO>2 V V V 0 VIO
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