FST16211GX

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ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Revised July 2002 FST16211 24-Bit Bus Switch General Description Features The Fairchild Switch FST16211 provides 24-bits of highspeed CMOS TTL-compatible bus switching. The low On Resistance of the switch allows inputs to be connected to outputs without adding propagation delay or generating additional ground bounce noise. ■ 4Ω switch connection between two ports The device is organized as a 12-bit or 24-bit bus switch. When OE1 is LOW, the switch is ON and Port 1A is connected to Port 1B. When OE2 is LOW, Port 2A is connected to Port 2B. When OE1/2 is HIGH, a high impedance state exists between the A and B Ports. ■ Control inputs compatible with TTL level ■ Minimal propagation delay through the switch ■ Low lCC ■ Zero bounce in flow-through mode ■ Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA) Ordering Code: Order Number Package Number Package Description FST16211G (Note 1)(Note 2) BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide FST16211MEA (Note 2) MS56A 56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118, 0.300" Wide FST16211MTD (Note 2) MTD56 56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide Note 1: Ordering code “G” indicates Trays. Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Logic Diagram © 2002 Fairchild Semiconductor Corporation DS500037 www.fairchildsemi.com FST16211 24-Bit Bus Switch July 1997 FST16211 Connection Diagrams Pin Descriptions Pin Assignment for SSOP and TSSOP Pin Name Description OE1, OE2 Bus Switch Enables 1A, 2A Bus A 1B, 2B Bus B FBGA Pin Assignments 1 2 3 4 5 6 A 1A2 1A1 NC OE2 1B1 1B2 B 1A4 1A3 1A7 OE1 1B3 1B4 C 1A6 1A5 GND 1B7 1B5 1B6 D 1A10 1A9 1A8 1B8 1B9 1B10 E 1A12 1A11 2A1 2B1 1B11 1B12 F 2A4 2A3 2A2 2B2 2B3 2B4 G 2A6 2A5 VCC GND 2B5 2B6 H 2A8 2A7 2A9 2B9 2B7 2B8 J 2A12 2A11 2A10 2B10 2B11 2B12 Truth Table Inputs Pin Assignment for FBGA (Top Thru View) www.fairchildsemi.com 2 Inputs/Outputs OE1 OE2 1A, 1B 2A, 2B L L 1A = 1B 2A = 2B L H 1A = 1B Z H L Z 2A = 2B H H Z Z Recommended Operating Conditions (Note 6) Supply Voltage (VCC) −0.5V to +7.0V DC Switch Voltage (VS) (Note 4) −0.5V to +7.0V Power Supply Operating (VCC) DC Input Voltage (VIN) (Note 5) −0.5V to +7.0V Input Voltage (VIN) 0V to 5.5V 0V to 5.5V DC Input Diode Current (lIK) VIN < 0V −50 mA Output Voltage (VOUT) DC Output (IOUT) Sink Current 128 mA Input Rise and Fall Time (tr, tf) +/− 100 mA DC VCC/GND Current (ICC/IGND) Storage Temperature Range (TSTG) 4.0V to 5.5V Switch Control Input −65°C to +150 °C 0 ns/V to 5 ns/V Switch I/O 0 ns/V to DC -40 °C to +85 °C Free Air Operating Temperature (TA) Note 3: The “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the absolute maximum rating. The “Recommended Operating Conditions” table will define the conditions for actual device operation. Note 4: VS is the voltage observed/applied at either A or B Ports across the switch. Note 5: The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are observed. Note 6: Unused control inputs must be held HIGH or LOW. They may not float. DC Electrical Characteristics Symbol Parameter VCC (V) TA = −40 °C to +85 °C Min Typ (Note 7) Max −1.2 Units Conditions IIN = −18 mA VIK Clamp Diode Voltage VIH HIGH Level Input Voltage 4.0–5.5 VIL LOW Level Input Voltage 4.0–5.5 0.8 V II Input Leakage Current 5.5 ±1.0 µA 0 ≤ VIN ≤ 5.5V 0 10 µA VIN = 5.5V ±1.0 µA 0 ≤ A, B ≤ VCC 4.5 2.0 V V IOZ OFF-STATE Leakage Current 5.5 RON Switch On Resistance 4.5 4 7 Ω VIN = 0V, IIN = 64 mA (Note 8) 4.5 4 7 Ω VIN = 0V, IIN = 30 mA 4.5 8 12 Ω VIN = 2.4V, IIN = 15 mA 4.0 11 20 Ω VIN = 2.4V, IIN = 15 mA ICC Quiescent Supply Current 5.5 3 µA VIN = VCC or GND, IOUT = 0 ∆ ICC Increase in ICC per Input 5.5 2.5 mA One Input at 3.4V Other Inputs at VCC or GND Note 7: Typical values are at VCC = 5.0V and TA = +25°C Note 8: Measured by the voltage drop between A and B pins at the indicated current through the switch. On Resistance is determined by the lower of the voltages on the two (A or B) pins. 3 www.fairchildsemi.com FST16211 Absolute Maximum Ratings(Note 3) FST16211 AC Electrical Characteristics TA = −40 °C to +85 °C, Symbol Parameter CL = 50pF, RU = RD = 500Ω VCC = 4.5 – 5.5V Min tPHL, tPLH Propagation Delay Bus to Bus (Note 9) tPZH, tPZL Output Enable Time 1.5 VCC = 4.0V Max Min Units Conditions Max 0.25 0.25 ns VI = OPEN Figures 1, 2 6.0 6.5 ns VI = 7V for tPZL Figures 1, 2 VI = OPEN for tPZH tPHZ, tPLZ Output Disable Time 1.5 Figure Number 7.0 7.2 VI = 7V for tPLZ ns VI = OPEN for tPHZ Figures 1, 2 Note 9: This parameter is guaranteed by design but is not tested. The bus switch contributes no propagation delay other than the RC delay of the typical On Resistance of the switch and the 50pF load capacitance, when driven by an ideal voltage source (zero output impedance). Capacitance Symbol (Note 10) Parameter Typ Max Units Conditions CIN Control Pin Input Capacitance 3 pF VCC = 5.0V CI/O Input/Output Capacitance 6 pF VCC, OE = 5.0V Note 10: TA = +25°C, f = 1 MHz, Capacitance is characterized but not tested. AC Loading and Waveforms Note: Input driven by 50 Ω source terminated in 50 Ω Note: CL includes load and stray capacitance Note: Input PRR = 1.0 MHz, tW = 500 ns FIGURE 1. AC Test Circuit FIGURE 2. AC Waveforms www.fairchildsemi.com 4 FST16211 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide Package Number BGA54A 5 www.fairchildsemi.com FST16211 56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118, 0.300" Wide Package Number MS56A www.fairchildsemi.com 6 FST16211 24-Bit Bus Switch 56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide Package Number MTD56 Technology Description The Fairchild Switch family derives from and embodies Fairchild’s proven switch technology used for several years in its 74LVX3L384 (FST3384) bus switch product. Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. www.fairchildsemi.com 7 www.fairchildsemi.com ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. 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