FSUSB30UMX

Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. FSUSB30 低功率、双端口、高速 USB2.0(480Mbps) 开关 特性 ? ? ? ? ? ? ? 说明 低导通电容：3.7pF （典型值） 低导通电阻：6.5W （典型值） 低功耗：1μA （最大值） 衆 t10μA 最大 ICCT 超过扩展控制电压范围 (VIN = 2.6V, VCC = 4.3V) 宽 -3dB 带宽， >720MHz 8kV 静电放电保护 当 VCC = 0V; D+/ D- 引脚可耐受的电压达到 5.5V 时， 会提供断电保护 封装： 衆 t10 引脚 MicroPak™ (1.6 x 2.1mm) 衆 t10 引脚 MSOP 衆 t10 引脚 UMLP (1.4 x 1.8mm) 应用 ? FSUSB30 是一款低功率、 2 端口、高速 USB 2.0 开关。 该器件配置为双刀双掷 (DPDT) 开关，专为在两个高速 (480Mbps) 源或高速和全速 (12Mbps) 源之间切换进行了 优化。 FSUSB30 符合 USB2.0 的要求，并且具有 3.7pF 的极低导通电容 (CON)。此器件的宽带宽 (720MHz) 超过 了通过三次谐波所需的带宽，这使得信号的边沿和相位失 真降到最小。出色的通道间串扰性能可实现最小的干扰。 FSUSB30 在 D+ / D- 引脚上包含了特殊的电路，在断电时 可使器件承受过压条件。同时，当应用于 S 引脚的控制电 压小于电源电压 (VCC) 时，该器件可以最大限度地降低功 耗。此特性对超便携式应用 （例如手机）尤为重要，可支 持基带处理器通用 I/O 的直接接口。其他应用包括便携手 机、PDA、数码相机、打印机和笔记本电脑中共享的开关 和连接器。 手机、个人数字处理 (PDA)、数码相机和笔记本 LCD 显示器、电视机和机顶盒 相关应用说明 ? AN-6022 使用 FSUSB30/FSUSB31，以符合 USB 2.0 故障条件要求 订购信息 封装编号 产品代码记号 FSUSB30L10X 订货号 MAC010A FJ FSUSB30MUX MUA10A FSUSB30 FSUSB30UMX MLP010A GJ 封装说明 10 引脚 MicroPak， 1.6 x 2.1mm 10 引脚模塑小外形封装 (MSOP)， JEDEC MO-187， 3.0mm 宽 10 引脚方形超薄 MLP (UMLP) 1.4 x 1.8mm 1D+ USB2.0 Controller Set Top Box (STB) CPU or DSP Processor VCC FSUSB30 D+ 1D– USB Connector D– 2D+ DVR or Mass Storage 2D– Controller . Control S OE 图 1. 典型应用 MicroPak 是飞兆半导体公司的商标。 © 2006 飞兆半导体公司 FSUSB30 Rev. 1.1.8 www.fairchildsemi.com FSUSB30 — 低功率、双端口、高速 USB2.0(480Mbps) 开关 2013 年 3 月 模拟符号 OE HSD1– HSD2– D– Pad Assignments for MicroPak 9 8 7 6 HSD1+ D+ HSD2+ HSD1– D– VCC 10 GND 5 3 S 4 HSD2+ HSD1+ S 2 OE D+ 1 HSD2– (Top View) 引脚描述 引脚名 说明 OE 总线开关使能 S 选择输入 D+, D-, HSDn+, HSDn- 数据端口 NC 未连接 Pad Assignments for DQFN NC VCC 1 14 S 2 13 OE HSD1+ 3 12 HSD1– NC 4 11 NC HSD2+ 5 10 HSD2– D+ 6 9 D– 7 真值表 8 GND NC (Top Through View) Pin Assignment for MSOP 1 10 VCC HSD1+ 2 9 OE HSD2+ 3 8 HSD1– D+ 4 7 HSD2– GND 5 6 D– S Control S OE 功能 X 高 未连接 低 低 D+, D- = HSD1n 高 低 D+, D- = HSD2n (Top Through View) 9 Sel 10 HSD2– VCC 7 6 1 2 HSD1+ 8 HSD2+ OE HSD1– Pad Assignments for µMLP 5 D– 4 GND 3 D+ (Top Through View) © 2006 飞兆半导体公司 FSUSB30 Rev. 1.1.8 www.fairchildsemi.com 2 FSUSB30 — 低功率、双端口、高速 USB2.0(480Mbps) 开关 连接图 应力超过绝对最大额定值，可能会损坏设备。在超出推荐的工作条件的情况下，该器件可能无法正常运行或操作，且不 建议让器件在这些条件下长期工作。此外，过度暴露在高于推荐的工作条件下，会影响器件的可靠性。绝对最大额定值 仅是额定应力值。 符号 VCC VCNTRL VSW IIK 参数 最低 最大值 单位 -0.5 +5.5 V 电源电压 DC 输入电压 (1) 直流开关 I/O 电压 (1) -0.5 VCC V HSDnX 0.5 VCC V D+,D- 考虑到 VCC > 0 0.5 VCC V D+,D- 考虑到 VCC = 0 -0.50 VCC V 直流输入二极管电流 IOUT 直流输出电流 TSTG 存储温度 ESD 人体模型 -50 mA 50 mA +150 °C 全部引脚 8 kV 输入 / 输出至地 8 kV -65 注意： 1. 当观测输入与输出二极管电流额定值时，该输入与输出可能超出负额定值。 推荐工作条件 推荐的操作条件表定义了器件的真实工作条件。指定推荐的工作条件，以确保设备的最佳性能达到数据表中的规格。飞 兆半导体建议不要超过推荐工作条件，也不能按照绝对最大额定值进行设计。 符号 参数 最低 最大值 单位 3.0 4.3 V 控制输入电压 0 VCC V 开关输入电压 0 VCC V -40 +85 °C 250 °C/W VCC 电源电压 VIN VSW TA JA 工作温度 热阻， 10 MicroPak 注意： 2. 控制输入必须保持高电平或低电平，不允许浮动。 © 2006 飞兆半导体公司 FSUSB30 Rev. 1.1.8 www.fairchildsemi.com 3 FSUSB30 — 低功率、双端口、高速 USB2.0(480Mbps) 开关 绝对最大额定值 若无其他说明，所有典型值都在 25°C 下测得。 符号 参数 VIK 箝位二极管电压 VIH 输入电压高电平 VIL 输入电压低电平 IIN 控制脚输入漏电流 IOZ 关断漏电流 IOFF 电源关断漏 电流 (D+, D–) RON 开关导通电阻 (3) ∆RON Delta 工作条件 VCC (V) IIN = -18mA TA = -40°C 至 +85°C 最小值 典型值 最大值 3.0 -1.2 V 3.0 至 3.6 1.3 V 4.3 1.7 V 3.0 至 3.6 0.5 4.3 RON(4) 单位 V 0.7 V VSW = 0.0V 至 VCC 4.3 -1.0 1.0 µA 0 ≤ Dn, HSD1n, HSD2n ≤ VCC 4.3 -2.0 2.0 µA VSW = 0V 至 4.3V, VCC = 0V 0 -2.0 2.0 µA 10.0  7.0  VSW = 0.4V, ION = -8mA 3.0 6.5 VSW = 0V, IO = 30mA, 25°C 3.6 VSW = 0.4V, ION = -8mA 3.0 0.35  2.0  RON 平坦度 RON 平坦度 (3) VSW = 0.0V - 1.0V, ION = -8mA 3.0 ICC 静态电源电流 VCNTRL = 0.0V 或 VCC, IOUT = 0 4.3 1.0 µA ICCT 每个控制电压的 ICC 电 流增量 VCNTRL （控制输入） = 2.6V 4.3 10.0 µA 单位 图位 说明： 3. 在通过开关的指定电流下，由 Dn、 HSD1n 和 HSD2n 引脚之间的电压降测得。 导通电阻决定于这两个端口上的电压降。 4. 由产品特性保证。 交流电气特性 若无其他说明，所有典型值都在 25°C， Vcc=3.3V 时测得。 符号 参数 工作条件 VCC (V) TA = -40°C 至 +85°C 最小值 典型值 最大值 tON 导通时间 S, OE 至 Output HD1n, HD2n = 0.8V, RL = 50, CL = 5pF 3.0 至 3.6 13 30 ns 图9 tOFF 关断时间 S, OE 至 Output HD1n, HD2n = 0.8V, RL = 50, CL = 5pF 3.0 至 3.6 12 25 ns 图9 tPD 传输延迟 (4) RL = 50, CL = 5pF 3.3 0.25 ns 图7 图8 tBBM 先开后合 RL = 50, CL = 5pF, VIN = 0.8V 3.0 至 3.6 ns 图 10 OIRR 关断隔离 （非相邻） f = 240MHz, RT = 50 3.0 至 3.6 -30 dB 图 13 Xtalk 非相邻通道串扰 RT = 50, f = 240MHz 3.0 至 3.6 -45 dB 图 14 MHz 图 12 BW -3dB 带宽 © 2006 飞兆半导体公司 FSUSB30 Rev. 1.1.8 RT = 50, CL = 0pF 3.0 至 3.6 RT = 50, CL = 5pF 2.0 6.5 720 550 www.fairchildsemi.com 4 FSUSB30 — 低功率、双端口、高速 USB2.0(480Mbps) 开关 直流电气特性 符号 参数 工作条件 VCC (V) TA = -40°C 至 +85°C 最小值 典型值 最大值 单位 图位 tSK(O) 通道间相位差 (5) RL = 50, CL = 5pF 3.0 至 3.6 50 ps 图7 图 11 tSK(P) 在相同输出下，反向 转换的时滞 (5) RL = 50, CL = 5pF 3.0 至 3.6 20 ps 图7 图 11 总抖动 (5) RL = 50, CL = 5pF, 480 Mbps 时，tR = tF = 500ps 3.0 至 3.6 (PRBS = 215 - 1) 200 ps tJ 注意： 5. 由产品特性保证。 电容值 符号 参数 工作条件 TA = -40°C 至 +85°C 最小值 典型值 最大值 单位 图位 pF 图 16 CIN 控制引脚输入电容 VCC = 0V CON D1n, D2n, Dn 导通电容 VCC = 3.3, OE = 0V 3.7 pF 图 15 COFF D1n, D2n 关断电容 VCC 和 OE = 3.3 2.5 pF 图 16 © 2006 飞兆半导体公司 FSUSB30 Rev. 1.1.8 1.5 www.fairchildsemi.com 5 FSUSB30 — 低功率、双端口、高速 USB2.0(480Mbps) 开关 高速 USB 相关的交流电气特性 FSUSB30 — 低功率、双端口、高速 USB2.0(480Mbps) 开关 典型特性 Frequency Response 0 -1 Gain (dB) -2 -3 -4 -5 -6 -7 -8 1 10 100 1000 10000 CL = 0pF, VCC = 3.3V Frequency (MHz) 图 2. 增益 vs. 频率 Off Isolation (dB) Frequency Response 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 1 10 100 1000 Frequency (MHz) 图 3. 关断隔离 Crosstalk (dB) Frequency Response 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 1 10 100 Frequency (MHz) 1000 VCC = 3.3V 图 4. 串扰 © 2006 飞兆半导体公司 FSUSB30 Rev. 1.1.8 www.fairchildsemi.com 6 VON IDn(OFF) NC A HSDn Dn VIN VIN ION Select GND Select GND VS = 0 or VCC GND VS = 0 to VCC Each switch port is tested separately. RON = VON / ION 图 5. 导通电阻 图 6. 关断漏电流 D+, D– 800mV Input: HSDn+, HSDn– 400mV VIN RS GND tFALL = 500ps tRISE = 500ps HSDn RL VOUT CL GND VSel 90% 90% 50% 50% 10% 10% VOH GND Output: D+, D– RL, RS, and CL are functions of the application environment (see AC Electrical tables for specific values). 50% 50% VOL tPLH CL includes test fixture and stray capacitance. 图 7. 交流测试电路负载 tPHL 图 8. 开关传输延迟波形 tFALL = 2.5ns tRISE = 2.5ns VCC 90% Input – S, OE VCC/2 GND 90% VCC/2 10% 10% VOH 90% 90% Output – VOUT VOL tON tOFF 图 9. 开通 / 关断波形 © 2006 飞兆半导体公司 FSUSB30 Rev. 1.1.8 www.fairchildsemi.com 7 FSUSB30 — 低功率、双端口、高速 USB2.0(480Mbps) 开关 测试框图 VCC HSDn VO VOUT D+, D– RL VCC Control Input HSDn CL* 50% 0V tR = tF = 2.5ns (10–90%) S Control Input VOUT GND 0.9 x VOUT tD *CL includes test fixture and stray capacitance. 图 10. “ 先开后合 ”(tBBM) tFALL = 500ps tRISE = 500ps 800mV 90% Input: D+, D– 50% 10% 400mV 10% tFALL = 500ps tRISE = 500ps 800mV 90% Input: HSDn+ HSDn– 50% VOH Output1: HSD1+ HSD1– 90% 50% 10% 400mV 90% 50% 50% 50% VOL 10% VOH tPLH1 tPHL1 50% 50% VOH 50% Output: D+, D– 50% Output1: D2+, D2– VOL VOL tPLH tPHL tPLH2 TSK(P) = | tPHL – tPLH | Pulse Skew, TSK(P) tPHL2 TSK(O) = | tPLH1 – tPLH2 | or | tPHL1 – tPHL2 | Output Skew, TSK(OUT) 图 11. 开关时滞测试 Network Analyzer FSUSB30 RS VIN VS GND GND VSel GND VOUT GND RS and RT are functions of the application environment (See AC Electrical Tables for specific values). RT GND 图 12. 带宽 © 2006 飞兆半导体公司 FSUSB30 Rev. 1.1.8 www.fairchildsemi.com 8 FSUSB30 — 低功率、双端口、高速 USB2.0(480Mbps) 开关 VCC FSUSB30 — 低功率、双端口、高速 USB2.0(480Mbps) 开关 Network Analyzer FSUSB30 RS VIN VS GND RT GND VSel GND GND VOUT RT GND OFF-Isolation = 20 Log (VOUT / VIN) GND 图 13. 通道的关断隔离 NC Network Analyzer FSUSB30 RS VIN VS GND GND VSel RT GND GND GND RS and RT are functions of the application environment (50, 75 or 100Ω) RT VOUT GND Crosstalk = 20 Log (VOUT / VIN) 图 14. 非相邻通道间串扰 Capacitance Meter Dn FSUSB30 Dn S S Capacitance Meter VSel = 0 or VCC f = 240MHz f = 240MHz D1n, D2n 图 15. 通道导通电容 © 2006 飞兆半导体公司 FSUSB30 Rev. 1.1.8 FSUSB30 VSel = 0 or VCC D1n, D2n 图 16. 通道关断电容 www.fairchildsemi.com 9 上电保护 在 USB 2.0 规范的第 7.1.1 节，说明了 USB 设备必须能 够耐受关闭或开启 USB 设备时 Vbus 与 D+ 或 D- 的短 路。 FSUSB30 配置可有效满足这两项要求。 USB 2.0 规范还说明， USB 设备应该能够耐受传输数据 时出现的 Vbus 短路。为了提供针对这种情况的防护，飞 兆建议在开关 VCC 引脚和电源电压轨之间加入一个 100W 串行电阻。在出现过压时，这种更改操作可以限制 流回 VCC 轨道的电流，从而将电流保持在安全工作范围 内。在这种应用中，开关将完整的 5.25V 输入信号通过选 择的输出口发送出去，同时维持未被选择的引脚上的关断 隔离。 断电保护 对于 Vbus 短路，开关需要能够耐受这种情况至少 24 小 时。 FSUSB30 具有专门设计的电路，可以防止关闭电源 和过压条件下的意外信号泄漏，并且保证系统可靠性。这 种保护也被增加到普通引脚 (D+, D-)。 VCC= 3.6 V 100 Ohms HSD+ HSD+ HSD- D+ = 5.25V FSUSB30 HSD- D- = 5.25V Figure 17. Adding 100 resistor in series with the VCC supply allows the FSUSB30 to withstand a Vbus short when powered up For more information, see Applications Note AN-6022 Using the FSUSB30 to Comply with USB 2.0 Fault Condition Requirements at www.fairchildsemi.com © 2006 飞兆半导体公司 FSUSB30 Rev. 1.1.8 www.fairchildsemi.com 10 FSUSB30 — 低功率、双端口、高速 USB2.0(480Mbps) 开关 应用指南：符合 USB 2.0 Vbus 短路要求 DQFN 的卷带形式 封装指示符 BQX 带第 节 位腔 空白段 （始点终点） 载体 空白片尾 （插孔末端） 腔状态 盖带状态 125 （典型值） 空 密封 2500/3000 装满 密封 75 （典型值） 空 密封 卷带尺寸 尺寸以英寸 （毫米）表示，除非另有说明。 © 2006 飞兆半导体公司 FSUSB30 Rev. 1.1.8 www.fairchildsemi.com 11 FSUSB30 — 低功率、双端口、高速 USB2.0(480Mbps) 开关 卷带和卷盘规格 尺寸以英寸 （毫米）表示，除非另有说明。 卷带大小 A B C D N W1 W2 (12mm) 13.0 (330) 0.059 (1.50) 0.512 (13.00) 0.795 (20.20) 7.008 (178) 0.488 (12.4) 0.724 (18.4) © 2006 飞兆半导体公司 FSUSB30 Rev. 1.1.8 www.fairchildsemi.com 12 FSUSB30 — 低功率、双端口、高速 USB2.0(480Mbps) 开关 DQFN 的卷带尺寸 FSUSB30 — 低功率、双端口、高速 USB2.0(480Mbps) 开关 MSOP 的卷带尺寸 尺寸以英寸 （毫米）表示，除非另有说明。 MSOP 的卷带尺寸 尺寸以英寸 （毫米）表示，除非另有说明。 卷带大小 A B C D N W1 W2 W3 (12mm) 13 (330) 0.059 (1.5) 0.512 (13) 0.795 (20.2) 7.008 (178) 0.448 (12.4) 0.724 (18.4) 0.468-0.606 (11.9 -15.4) © 2006 飞兆半导体公司 FSUSB30 Rev. 1.1.8 www.fairchildsemi.com 13 0.10 C 2.10 2X A 1.62 B KEEPOUT ZONE, NO TRACES OR VIAS ALLOWED (0.11) 1.12 1.60 PIN1 IDENT IS 2X LONGER THAN OTHER LINES 0.56 0.10 C 2X TOP VIEW (0.35) 10X (0.25) 10X 0.50 RECOMMENDED LAND PATTERN 0.55 MAX 0.05 C 0.05 C 0.05 0.00 C (0.20) 0.35 0.25 SIDE VIEW D 0.65 0.55 DETAIL A 0.35 0.25 1 4 0.35 0.25 DETAIL A 2X SCALE 0.56 10 (0.29) (0.15) (0.36) 5 6 9 0.50 0.25 9X 0.15 1.62 0.35 9X 0.25 0.10 0.05 C A B C ALL FEATURES BOTTOM VIEW NOTES: A. PACKAGE CONFORMS TO JEDEC REGISTRATION MO-255, VARIATION UABD . B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. D. PRESENCE OF CENTER PAD IS PACKAGE SUPPLIER DEPENDENT. IF PRESENT IT IS NOT INTENDED TO BE SOLDERED AND HAS A BLACK OXIDE FINISH. E. DRAWING FILENAME: MKT-MAC10Arev5. 图 17. 10 引脚 MicroPak， 1.6 x 2.1mm 要了解卷带和卷盘规格，请访问飞兆半导体的网站：http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf. 封装图纸是作为一项服务而提供给考虑选用飞兆半导体产品的客户。具体参数可进行改动，且无需做出相应通知。请注意图纸上的版本 和 / 或日期，并联系飞兆半导体代表核实或获得最新版本。封装规格并不超出飞兆公司全球范围内的条款与条件，尤其指保修，保修涉 及飞兆半导体的全部产品。 请经常访问飞兆半导体在线封装网页，以获取最新封装图纸。 http://www.fairchildsemi.com/packaging/. © 2006 飞兆半导体公司 FSUSB30 Rev. 1.1.8 www.fairchildsemi.com 14 FSUSB30 — 低功率、双端口、高速 USB2.0(480Mbps) 开关 物理尺寸测试 FSUSB30 — 低功率、双端口、高速 USB2.0(480Mbps) 开关 物理尺寸测试 图 18. 10 引脚模塑小外形封装 (MSOP)， JEDEC MO-187， 3.0mm 宽 封装图纸是作为一项服务而提供给考虑选用飞兆半导体产品的客户。具体参数可进行改动，且无需做出相应通知。请注意图纸上的版本和 / 或日期，并联系飞兆半导体代表核实或获得最新版本。封装规格并不超出飞兆公司全球范围内的条款与条件，尤其指保修，保修涉及飞兆 半导体的全部产品。 请经常访问飞兆半导体在线封装网页，以获取最新封装图纸。 http://www.fairchildsemi.com/packaging/. © 2006 飞兆半导体公司 FSUSB30 Rev. 1.1.8 www.fairchildsemi.com 15 1.40 0.10 C A B 2X (9X) 1.70 0.563 0.663 1.80 1 PIN#1 IDENT 2.10 0.10 C TOP VIEW 0.40 2X (10X) 0.225 0.55 MAX. 0.10 C 0.08 C RECOMMENDED LAND PATTERN (0.15) SEATING C PLANE 0.05 0.00 0.55 SIDE VIEW 1.85 (10X) 0.225 6 OPTIONAL MINIMIAL TOE LAND PATTERN 0.40 1 NOTES: PIN#1 IDENT A. PACKAGE DOES NOT CONFORM TO ANY JEDEC STANDARD. B. DIMENSIONS ARE IN MILLIMETERS. 0.15 (10X) 0.25 10 BOTTOM VIEW 0.10 C A B 0.05 C C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. D. LAND PATTERN RECOMMENDATION IS BASED ON FSC DESIGN ONLY. 0.55 0.45 0.25 0.15 9X 0.45 0.40 0.35 (9X) 0.45 3 DETAIL A 1.45 PACKAGE EDGE 45° DETAIL A SCALE : 2X F. FAIRCHILD SEMICONDUCTOR. LEAD OPTION 2 LEAD OPTION 1 SCALE : 2X E. DRAWING FILENAME: MKT-UMLP10Arev5. SCALE : 2X 图 19. 10 引脚，方形，超薄膜塑无铅封装 (UMLP)， 1.4 x 1.8mm 封装图纸是作为一项服务而提供给考虑选用飞兆半导体产品的客户。具体参数可进行改动，且无需做出相应通知。请注意图纸上的版本 和 / 或日期，并联系飞兆半导体代表核实或获得最新版本。封装规格并不超出飞兆公司全球范围内的条款与条件，尤其指保修，保修涉 及飞兆半导体的全部产品。 请经常访问飞兆半导体在线封装网页，以获取最新封装图纸。 http://www.fairchildsemi.com/packaging/. © 2006 飞兆半导体公司 FSUSB30 Rev. 1.1.8 www.fairchildsemi.com 16 FSUSB30 — 低功率、双端口、高速 USB2.0(480Mbps) 开关 物理尺寸测试 FSUSB30 — 低功率、双端口、高速 USB2.0(480Mbps) 开关 © 2006 飞兆半导体公司 FSUSB30 Rev. 1.1.8 www.fairchildsemi.com 17 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com © Semiconductor Components Industries, LLC N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 www.onsemi.com 1 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative www.onsemi.com