Is Now Part of
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Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers
will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor
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to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
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Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s
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FSUSB31
Low-Power, Single-Port, High-Speed USB 2.0 (480Mbps)
Switch
Features
Description
■ Low On Capacitance: 3.7pF (Typical)
The FSUSB31 is a low-power, single-port, high-speed
USB 2.0 switch. This part is configured as a double-pole,
single-throw switch and is optimized for switching or isolating a high-speed (480Mbps) source or a high-speed
and full-speed (12Mbps) source. The FSUSB31 is compatible with the requirements of USB2.0 and features an
extremely low on capacitance (CON) of 3.7pF. The wide
bandwidth of this device (>720MHz) exceeds the bandwidth needed to pass the third harmonic, resulting in signals with minimum edge and phase distortion. Superior
channel-to-channel crosstalk minimizes interference.
■ Low On Resistance: 6.5Ω (Typical)
■ Low Power Consumption: 1µA (Maximum)
■
■
■
■
– 10µA Maximum ICCT Over an Expanded Control
Voltage Range: VIN = 2.6V, VCC = 4.3V
Wide -3dB Bandwidth: > 720MHz
8kV I/O to GND ESD Protection
Power-off Protection When VCC = 0V, D+ / D- Pins Can
Tolerate up to 5.5V
Packaged in:
– 8-lead MicroPak™ (1.6 x 1.6mm)
– 8-lead US8
– 8-lead Ultrathin MLP (1.2 x 1.4mm)
Applications
■ Cell Phone, PDA, Digital Camera, and Notebook
■ LCD Monitor, TV, and Set-top Box
Related Resources
■ AN-6022 Using the FSUSB30/31 to Comply with
USB 2.0 Fault Condition Requirements
The FSUSB31 contains special circuitry on the D+ / Dpins that allows the device to withstand an over-voltage
condition. This device is also designed to minimize current consumption even when the control voltage applied
to the OE pin is lower than the supply voltage (VCC). This
feature is especially valuable for mobile applications,
such as cell phones, allowing direct interface with the
general-purpose I/Os of the baseband processor. Other
applications include port isolation and switching in portable cell phones, PDAs, digital cameras, printers, and
notebook computers.
Ordering Information
Part Number
FSUSB31K8X
Package
MAB08A
Eco Status
Package Description
Green
8-Lead US8, JEDEC MO-187, Variation CA 3.1mm Wide
FSUSB31L8X
MAC08A
RoHS
8-Lead MicroPak, 1.6mm Wide
FSUSB31UMX
UMLP08A
Green
8-Lead, Ultrathin Molded Leadless Package (UMLP), 1.2 x 1.4mm
For Fairchild’s definition of “green” Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.
Application Diagram
VCC
FSUSB31
D+
USB
Connector
Base Band
Processor
or FS USB
Controller
D–
OE
HS USB
Controller
Figure 1. Typical Application Diagram
MicroPak™ is a trademark of Fairchild Semiconductor Corporation.
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.1.0
www.fairchildsemi.com
FSUSB31 — Low-Power, Single-Port, High-Speed USB 2.0 (480Mbps) Switch
February 2009
Pin Descriptions
HSD+
D+
HSD–
D–
Description
OE
Bus Switch Enable
D+, D−, HSD+, HSD−
Data Ports
NC
No Connect
Truth Table
Control
OE
Pin Name
Figure 2. Analog Symbol
OE
Function
HIGH
Disconnect
LOW
D+, D− = HSD+, HSD-
HSD–
D–
7
6
5
4
2
GND
3
D+
1
HSD+
8
OE
VCC
NC
Connection Diagrams
g
Figure 3. Pin Assignments for MicroPak
1
8
VCC
HSD–
2
7
OE
D–
3
6
HSD+
GND
4
5
D+
NC
Figure 4. Pin Assignments for US8
Figure 5. Pin Assignments for UMLP
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.1.0
www.fairchildsemi.com
2
FSUSB31 — Low-Power, Single-Port, High-Speed USB 2.0 (480Mbps) Switch
Analog Symbol
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only.
Symbol
VCC
Parameter
Minimum
Maximum
Unit
-0.5
5.5
V
-0.5
VCC
V
HSD
-0.5
VCC
V
D+, D−
-0.5
VCC
V
Supply Voltage
(1)
VS
DC Input Voltage
VIN
DC Switch Voltage(1)
IIK
DC Input Diode Current
IOUT
DC Output Current
TSTG
Storage Temperature
ESD
Human Body Model:
JESD22-A114
-50
-65
All Pins
I/O to GND
mA
50
mA
+150
°C
7.5
kV
8
kV
Note:
1.The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are
observed.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol
Parameter
Minimum
Maximum
Unit
VCC
Supply Voltage
3.0
4.3
V
VIN
Control Input Voltage(2)
0
VCC
V
Switch Input Voltage
0
VCC
V
-40
+85
°C
TA
Operating Temperature
Note:
2. Control input must be held HIGH or LOW and it must not float.
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.1.0
www.fairchildsemi.com
3
FSUSB31 — Low-Power, Single-Port, High-Speed USB 2.0 (480Mbps) Switch
Absolute Maximum Ratings
All typical values are at 25°C unless otherwise specified.
Symbol
Parameter
VIK
Clamp Diode Voltage
VIH
Input Voltage HIGH
VIL
Input Voltage LOW
VCC (V)
Conditions
IIN = −18mA
TA = −40°C to +85°C
Min.
Typ.
3.0
Unit
Max.
-1.2
3.0 to 3.6
1.3
4.3
1.7
V
V
3.0 to 3.6
0.5
4.3
0.7
V
IIN
Control Input Leakage
VIN = 0V to VCC
0 to VCC
-1.0
1.0
μA
IOZ
OFF State Leakage
0 ≤ HSD ≤ VCC
4.3
-2.0
2.0
μA
IOFF
Power OFF Leakage
Current (D+, D–)
VIN = 0.0V to 4.3V,
VCC = 0V
0
-2.0
2.0
μA
RON
Switch On Resistance(3)
VIN = 0.4V, ION = −8mA
VIN = 0.4V, ION = −8mA
10.0
Ω
ΔRON
Delta RON
(4)
RON Flatness RON Flatness(3)
3.0
6.5
3.0
0.35
Ω
VIN = 0.0V −1.0V,
ION = −8mA
3.0
2.0
Ω
ICC
Quiescent Supply Current
VIN = 0.0V or VCC,
IOUT = 0
4.3
1.0
μA
ICCT
Increase in ICC Current
per Control Voltage and
VCC Levels
VIN = 2.6V, VCC = 4.3V
4.3
10.0
μA
Notes:
3. Measured by the voltage drop between Dn, HSD, and Dn pins at the indicated current through the switch.
On resistance is determined by the lower of the voltage on the two ports.
4. Guaranteed by characterization.
AC Electrical Characteristics
All typical values are for VCC = 3.3V are at 25°C unless otherwise specified.
Symbol
Parameter
VCC (V)
Conditions
TA = −40°C to +85°C
Figure
Number
Typ.
Max.
3.0 to 3.6
15.0
30.0
ns
Figure 13
3.0 to 3.6
12.0
25.0
ns
Figure 13
RL = 50Ω, CL = 5pF
3.3
0.25
ns
Figure 11
Figure 12
Break-Before-Make
RL = 50Ω, CL = 5pF,
VIN = 0.8V
3.0 to 3.6
ns
Figure 14
OIRR
Off Isolation
(Non-Adjacent)
RT = 50Ω, f = 240MHz
3.0 to 3.6
-35.0
dB
Figure 17
Xtalk
Non-Adjacent Channel
Crosstalk
RT = 50Ω, f = 240MHz
3.0 to 3.6
-55.0
dB
Figure 18
MHz
Figure 16
tON
Turn-On Time,
OE to Output
VIN = 0.8V, RL = 50Ω,
CL = 5pF
tOFF
Turn-Off Time,
OE to Output
VIN = 0.8V, RL = 50Ω,
CL = 5pF
tPD
Propagation Delay(5)
tBBM
BW
-3dB Bandwidth
RT = 50Ω, CL = 0pF
3.0 to 3.6
RT = 50Ω, CL = 5pF
Min.
Unit
2.0
6.5
720
550
Note:
5. Guaranteed by characterization.
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.1.0
www.fairchildsemi.com
4
FSUSB31 — Low-Power, Single-Port, High-Speed USB 2.0 (480Mbps) Switch
DC Electrical Characteristics
Symbol
Parameter
TA = −40°C to
+85°C
VCC (V)
Conditions
Min.
Typ.
Unit
Figure
Number
Max.
tSK(O)
Channel-to-Channel Skew(6)
CL = 5pF
3.0 to 3.6
50.0
ps
Figure 11
Figure 15
tSK(P)
Skew of Opposite
Transitions of the
Same Output(6)
CL = 5pF
3.0 to 3.6
20.0
ps
Figure 11
Figure 15
Total Jitter(6)
RL = 50Ω, CL = 5pF,
tR = tF = 500ps at 480 Mbps
(PRBS = 215 − 1)
3.0 to 3.6
200
ps
tJ
Note:
6. Guaranteed by design.
Capacitance
Symbol
Parameter
Conditions
Min.
Typ.
1.0
Max.
Unit
Figure
Number
pF
Figure 20
CIN
Control Pin Input Capacitance
CON
On Capacitance
VCC = 3.3V, OE = 0V
3.7
pF
Figure 19
COFF
Off Capacitance
VCC and OE = 3.3V
1.7
pF
Figure 20
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.1.0
VCC = 0V
TA = −40°C to +85°C
www.fairchildsemi.com
5
FSUSB31 — Low-Power, Single-Port, High-Speed USB 2.0 (480Mbps) Switch
USB Hi-Speed Related AC Electrical Characteristics
0
0
-1
-10
Off Isolation (dB)
Gain (dB)
-2
VCC = 3.3V
-20
CL = 0pF
VCC = 3.3V
-3
-4
-5
-6
-30
-40
-50
-60
-70
-80
-7
-90
-8
-100
1
10
100
1000
10000
1
10
Frequency (MHz)
Figure 6. Gain vs. Frequency
Crosstalk (dB)
100
1000
Frequency (MHz)
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
Figure 7. Off Isolation
VCC = 3.3V
1
10
100
1000
Frequency (MHz)
Figure 8. Crosstalk
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.1.0
www.fairchildsemi.com
6
FSUSB31 — Low-Power, Single-Port, High-Speed USB 2.0 (480Mbps) Switch
Typical Characteristics
VON
FSUSB31
FSUSB31
IDn(OFF)
NC
HSD
Dn
A
VIN
VIN
ION
OE
OE
GND
GND
GND
VS = 0 to VCC
VS = 0 or VCC
RON = VON / ION
Each switch port is tested separately.
Figure 9. On Resistance
Figure 10. Off Leakage
FSUSB31
D+, D–
VIN
C L*
RS
GND
tFALL = 500ps
tRISE = 500ps
HSD
RL
400mV
Input: HSD+,
HSD–
VOUT
90%
50%
10%
0V
GND
90%
50%
10%
VOE
VOH
GND
Output: D+, D–
RL, RS, and CL are functions of the application environment
(see AC Electrical tables for specific values).
50%
tPLH
*CL includes test fixture and stray capacitance.
Figure 11. AC Test Circuit Load
tPHL
Figure 12. Switch Propagation Delay Waveforms
(tPD)
tFALL = 2.5ns
tRISE = 2.5ns
VCC
90%
Input – OE
VCC/2
GND
50%
VOL
90%
VCC/2
10%
10%
VOH
90%
90%
Output – VOUT
VOL
tON
tOFF
Figure 13. Turn On / Turn Off Waveform (tON / tOFF)
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.1.0
www.fairchildsemi.com
7
FSUSB31 — Low-Power, Single-Port, High-Speed USB 2.0 (480Mbps) Switch
Test Diagrams
VCC
VCC
HSDn
VO
VOUT
D+, D–
RL
VCC
Control
Input
HSDn
CL*
50%
0V
tR = tF = 2.5ns (10–90%)
S
Control
Input
VOUT
GND
0.9 x VOUT
tD
*CL includes test fixture and stray capacitance.
Figure 14. Break-Before-Make (tBBM)
tFALL = 500ps
tRISE = 500ps
400mV
90%
Input: D+, D–
50%
10%
0V
10%
tFALL = 500ps
tRISE = 500ps
400mV
90%
Input: HSDn+
HSDn–
VOH
Output1: HSD1+
HSD1–
90%
50%
0V
90%
50%
50%
10%
50%
50%
VOL
10%
tPLH1
tPHL1
50%
50%
VOH
VOH
50%
Output: D+, D–
50%
Output1: D2+, D2–
VOL
VOL
tPLH
tPHL
tPLH2
TSK(P) = | tPHL – tPLH |
Pulse Skew, TSK(P)
tPHL2
TSK(O) = | tPLH1 – tPLH2 | or | tPHL1 – tPHL2 |
Output Skew, TSK(OUT)
Figure 15. Switch Skew Tests
Network Analyzer
FSUSB31
RS
VIN
VS
GND
GND
VOE
GND
VOUT
GND
RS and RT are functions of the application environment
(see AC Electrical Tables for specific values).
RT
GND
Figure 16. Bandwidth
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.1.0
www.fairchildsemi.com
8
FSUSB31 — Low-Power, Single-Port, High-Speed USB 2.0 (480Mbps) Switch
Test Diagrams (Continued)
FSUSB31 — Low-Power, Single-Port, High-Speed USB 2.0 (480Mbps) Switch
Test Diagrams (Continued)
Network Analyzer
FSUSB31
RS
VIN
VS
GND
RT
VOE
GND
GND
GND
VOUT
GND
OFF-Isolation = 20 Log (VOUT / VIN)
RT
GND
Figure 17. Channel Off Isolation
NC
Network Analyzer
FSUSB31
RS
VIN
VS
GND
VOE
GND
RT
GND
GND
RT
GND
RS and RT are functions of the application environment
(50, 75 or 100Ω).
VOUT
GND
Crosstalk = 20 Log (VOUT / VIN)
Figure 18. Non-Adjacent Channel-to-Channel Crosstalk
Capacitance
Meter
Dn
FSUSB31
Dn
FSUSB31
OE
OE
Capacitance
Meter
VOE = 0 or VCC
F = 240MHz
F = 240MHz
HSDn
Figure 19. Channel On Capacitance
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.1.0
VOE = 0 or VCC
HSDn
Figure 20. Channel Off Capacitance
www.fairchildsemi.com
9
Power-On Protection
In section 7.1.1 of the USB 2.0 specification, it notes that
USB devices must be able to withstand a Vbus short to
D+ or D- when the USB devices is either powered off or
powered on. The FSUSB31 can be successfully configured to meet both these requirements.
The USB 2.0 specification also notes that the USB
device should be capable of withstanding a Vbus short
during transmission of data. Fairchild recommends adding a 100Ω series resister between the switch VCC pin
and supply rail to protect against this case. This modification works by limiting current flow back into the VCC
rail during the over-voltage event so current remains
within the safe operating range. In this application, the
switch passes the full 5.25V input signal through to the
selected output, while maintaining specified off isolation
on the un-selected pins.
Power-Off Protection
For a Vbus short circuit, the switch is expected to withstand such a condition for at least 24 hours. The
FSUSB31 has specially designed circuitry which prevents unintended signal bleed through as well as guaranteed system reliability during a power-down, overvoltage condition. The protection has been added to the
common pins (D+, D-).
VCC= 3.6 V
100 Ohms
HSD+
HSD-
D+ = 5.25V
FSUSB31
D- = 5.25V
Figure 21. A 100Ω resistor in series with the VCC supply allows the FSUSB31 to withstand a Vbus
short when powered up
For more information, see Applications Note AN-6022 — Using the FSUSB30/FSUSB31 to Comply with
USB 2.0 Fault Condition Requirements at www.fairchildsemi.com.
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.1.0
www.fairchildsemi.com
10
FSUSB31 — Low-Power, Single-Port, High-Speed USB 2.0 (480Mbps) Switch
Application Guidance: Meeting USB 2.0 Vbus Short Requirements
FSUSB31 — Low-Power, Single-Port, High-Speed USB 2.0 (480Mbps) Switch
Physical Dimensions
Figure 22. 8-Lead US8, JEDEC MO-187, Variation CA 3.1mm Wide
For MicroPak™ tape and reel specifications, please visit Fairchild’s website: http://www.fairchildsemi.com/ms/MS/MS-522.pdf.
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.1.0
www.fairchildsemi.com
11
0.10
2X
(Continued)
C
A
1.6
B
1.6
INDEX AREA
0.10
2X
C
TOP VIEW
0.55 MAX
0.05
0.05
0.00
DETAIL A
8X(0.09)
8X
0.05
C
Recommended Landpattern
C
(0.20)
1.0
2
1
4 (0.1)
C
8
4
7
0.35
0.25
3X(0.2)
0.35
0.25
0.5
3
6
5
(0.15)
0.35
0.25
0.15 8X
0.25
0.10
0.05
C A B
C
DETAIL A
PIN #1 TERMINAL
SCALE: 2X
BOTTOM VIEW
Notes:
1. PACKAGE CONFORMS TO JEDEC MO-255 VARIATION UAAD
2. DIMENSIONS ARE IN MILLIMETERS
3. DRAWING CONFORMS TO ASME Y.14M-1994
4. PIN 1 FLAG, END OF PACKAGE OFFSET
5. DRAWING FILE NAME: MKT-MAC08AREV4
MAC08AREV4
Figure 23. 8-Lead MicroPak, 1.6mm Wide
For MicroPak™ tape and reel specifications, please visit Fairchild’s website:
http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf.
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.1.0
www.fairchildsemi.com
12
FSUSB31 — Low-Power, Single-Port, High-Speed USB 2.0 (480Mbps) Switch
Physical Dimensions
2X
(Continued)
0.10
C
1.450
0.725
1.4
B
A
0.400
0.450
1.20
1.250
0.350 7X
0.10
2X
0.625
C
0.250 8X
TOP VIEW
0.55 MAX
0.05
C
0.05
C
SEATING
PLANE
0.025
0.00
C
0.40
2
DETAIL A
0.35 7X
0.25
4
0.10
PIN#1 IDENT
0.30
5
1
8
6
(0.2)
0.15
8X
0.25
0.10
0.05
45°
0.20
0.10
C A B
C
BOTTOM VIEW
DETAIL: A
SCALE : 2x
NOTES:
A. DOES NOT CONFORMS TO JEDEC STANDARD.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES CONFORMS TO ASME Y14.5M, 1994.
D. DRAWING FILE NAME : UMLP08Arev1
Figure 24. 8-Lead, Ultrathin Molded Leadless Package (UMLP), 1.2 x 1.4mm
For MicroPak™ tape and reel specifications, please visit Fairchild’s website:
http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf.
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.1.0
www.fairchildsemi.com
13
FSUSB31 — Low-Power, Single-Port, High-Speed USB 2.0 (480Mbps) Switch
Physical Dimensions
FSUSB31 — Low-Power, Single-Port, High-Speed USB 2.0 (480Mbps) Switch
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.1.0
14
www.fairchildsemi.com
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
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