FSV2050V

Schottky Rectifier 20 A, 50 V Ultra−Low VF FSV2050V Features • • • • • • • • Ultra Low Forward Voltage Drop Low Thermal Resistance Very Low Profile: Typical Height of 1.1 mm Green Molding Compound as per IEC61249 Standard Non−DAP Option Only Qualified with Reflow (J−STD−020) and Solder Temperature 260°C Classification Lead Free in Compliance with EU RoHS 2011/65/EU Directive These Devices are Pb−Free, Halogen Free and are RoHS Compliant www.onsemi.com Anode 1 Anode 2 3. Cathode Schottky Rectifier 3 Specifications ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Symbol Parameter Value Unit VRRM Peak Repetitive Reverse Voltage 50 V VRWM Working Peak Reverse Voltage 50 V VRMS RMS Reverse Voltage 35 V DC Blocking Voltage 50 V IF(AV) Average Rectified Peak Forward Surge Current 20 A IFSM Non−Repetitive Peak Forward Surge Current 320 A Operating Junction Temperature Range −55 to +150 °C Storage Temperature Range −55 to +150 °C VR TJ TSTG Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 2 1 TO−277−3LD CASE 340BQ MARKING DIAGRAM $Y&Z&3 FSV2050V $Y &Z &3 FSV2050V = ON Semiconductor Logo = Assembly Plant Code = Date Code (Year & Week) = Specific Device Code ORDERING INFORMATION See detailed ordering and shipping information on page 2 of this data sheet. © Semiconductor Components Industries, LLC, 2014 April, 2020 − Rev. 3 1 Publication Order Number: FSV2050V/D FSV2050V THERMAL CHARACTERISTICS (TA = 25°C unless otherwise noted) (Note 1) Symbol Characteristic Minimum Land Pattern Maximum Land Pattern Unit RqJA Junction−to−Ambient Thermal Resistance 100 40 °C/W ΨJL Junction−to−Lead Thermal Characteristics, Thermocouple Soldered to Anode 15 12 °C/W Junction−to−Lead Thermal Characteristics, Thermocouple Soldered to Cathode 6 5 1. The thermal resistances (RqJA & ΨJL) are characterized with device mounted on the following FR4 printed circuit boards, as shown in Figure 1 and Figure 2. PCB size: 76.2 x 114.3 mm. Minimum land pattern size: 4.9 x 4.8 mm (big pattern, x1), 1.4 x 1.52 mm (small pattern, x2). Maximum land pattern size: 30 x 30 mm (pattern, x2). Force line trace size = 55 mils, sense line trace size = 4 mils. F S F S F S F S F S Figure 1. Minimum Land Pattern of 2 oz Copper Figure 2. Maximum Land Pattern of 2 oz Copper ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol Parameter Conditions Min Typ Max Unit Breakdown Voltage IR = 500 mA 50 55.3 − V VF Forward Voltage Drop IF = 20 A − 485 550 mV IR Reverse Current VR = 50 V − 60.3 320 mA BVR Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. ORDERING INFORMATION Part Number Top Mark Package Shipping† FSV2050V FSV2050V TO−277−3LD (Pb−Free/Halogen Free) 5000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 2 FSV2050V TYPICAL PERFORMANCE CHARACTERISTICS 10 TJ = 150°C TJ = 125°C 1 TJ = 75°C 0.1 TJ = 25°C TJ = 150°C 10 TJ = 125°C 1 TJ = 75°C 0.1 TJ = 25°C 0.01 0.01 0 0.1 0.2 0.3 0.4 0.5 0.6 20 30 40 50 60 70 80 90 100 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) VF, FORWARD VOLTAGE (V) Figure 3. Typical Forward Characteristics Figure 4. Typical Reverse Characteristics 25 10000 AVERAGE CURRENT (A) CJ, JUNCTION CAPACITANCE (pF) 100 IR, REVERSE CURRENT (mA) IF, FORWARD CURRENT (A) 100 1000 100 10 1 1 10 TL (Cathode, 3cm x 3cm Pad) 20 TL (Cathode, Min. Pad) 15 10 TA (3cm x 3cm Pad) 5 TA (Min. Pad) 100 0 VR, REVERSE BIAS VOLTAGE (V) 0 25 50 75 100 125 150 o AMBIENT / LEAD TEMPERATURE ( C) Figure 5. Typical Junction Capacitance Figure 6. Forward Current Derating Curve www.onsemi.com 3 175 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TO−277−3LD CASE 340BQ ISSUE O DOCUMENT NUMBER: DESCRIPTION: 98AON13861G TO−277−3LD DATE 30 SEP 2016 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 www.onsemi.com 1 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative