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FSV330AF

FSV330AF

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    SMAF(DO-214AD)

  • 描述:

    DIODE SCHOTTKY 30V 3A SMAF

  • 详情介绍
  • 数据手册
  • 价格&库存
FSV330AF 数据手册
FSV330AF Schottky Barrier Rectifier Features • • • • • • • Low Forward Voltage Drop: 0.5 V Maximum at 3 A, TA = 25°C Ultra Thin Profile − Maximum Height of 1.0 mm High Surge Capacity UL Flammability 94V−0 Classification MSL 1 Green Mold Compound These Devices are Pb−Free, Halogen Free Free and are RoHS Compliant www.onsemi.com 1 Cathode 2 Anode Schottky Barrier Rectifier Specifications ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Symbol Value Unit VRRM Recurrent Peak Reverse Voltage 30 V VRMS RMS Reverse Voltage 21 V DC Blocking Voltage 30 V IF(AV) Average Forward Current 3 A IFSM Peak Forward Surge Current: 8.3 ms Single Half Sine−Wave Superimposed on Rated Load (JEDEC Method) 80 A TJ Operating Junction Temperature Range −55 to +150 °C Storage Temperature Range −55 to +150 °C VR TSTG Rating Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. DO−214AD (SMAF) CASE 403AD MARKING DIAGRAM $Y&Z&3 FSV330AF Band Indicates Cathode $Y &Z &3 FSV330AF = ON Semiconductor Logo = Assembly Plant Code = Data Code (Year & Week) = Specific Device Code ORDERING INFORMATION See detailed ordering and shipping information on page 2 of this data sheet. © Semiconductor Components Industries, LLC, 2014 May, 2018 − Rev. 2 1 Publication Order Number: FSV330AF/D FSV330AF THERMAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol Value Unit ΨJL Typical Thermal Characteristics, Junction−to−Lead (Note 1) Characteristic 20 °C/W RqJA Typical Thermal Resistance, Junction−to−Ambient (Note 2) 150 °C/W cm2 1. Mounted on FR4 PCB, single−sided cooper, with 48 2. Mounted on FR4 PCB, single−sided cooper, mini pad pad area. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Parameter Symbol Conditions Min Typ Max Unit VF Forward Voltage IF = 3 A − − 0.5 V IR Reverse Current VR = VDC, TA = 85°C − − 100 mA Trr Reverse Recovery Time IF = 0.5 A, IR = 1 A, Irr = 0.25 A − 12.50 − ns CJ Junction Capacitance VR = 0 V, f = 1 MHz − 485 − pF Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. ORDERING INFORMATION Part Number Top Mark Package Shipping† FSV330AF FSV330AF DO−214AD (SMAF) (Pb−Free/Halogen Free) 10000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 2 FSV330AF TYPICAL PERFORMANCE CHARACTERISTICS IR, Reverse Current (mA) IF, Forward Current (A) 3.5 3 2.5 2 1.5 1 0.5 0 0 25 50 75 100 125 100 TJ = 125°C 1 TJ = 75°C 0.1 0.01 0.001 150 TJ = 150°C 10 TJ = 25°C 8 16 24 32 40 TC, Case Temperature (5C) VR, Peak Reverse Voltage (V) Figure 1. Forward Current Derating Curve Figure 2. Typical Reverse Characteristics C, Junction Capacitance (pF) 600 IF, Forward Current (A) 10 TJ = 150°C 1 TJ = 125°C TJ = 75°C TJ = 25°C 0.1 500 400 300 200 100 0 0 0.2 0.4 0.6 VF, Forward Voltage (V) 0 10 15 20 25 30 VR, Reverse Voltage (V) Figure 3. Typical Forward Characteristics Figure 4. Typical Junction Capacitance www.onsemi.com 3 5 35 40 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SMA−FL CASE 403AD ISSUE A DOCUMENT NUMBER: DESCRIPTION: 98AON13439G SMA−FL DATE 14 JUL 2020 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative
FSV330AF
1. 物料型号:FSV330AF 2. 器件简介:肖特基势垒整流器,具有低正向电压降、超薄外形、高浪涌容量、UL94V-0可燃性分类、无铅和无卤素,符合RoHS标准。 3. 引脚分配:文档中提供了标记图,显示了阴极和阳极的位置,并通过带状指示阴极。 4. 参数特性: - 绝对最大额定值:包括重复峰值反向电压、RMS反向电压、直流阻断电压、平均正向电流、峰值正向浪涌电流、工作结温度范围和存储温度范围。 - 热特性:包括典型热特性(结到引脚)和典型热阻(结到环境)。 - 电气特性:包括正向电压、反向电流、反向恢复时间、结电容等。 5. 功能详解:文档提供了正向电流降额曲线、典型反向特性、典型正向特性和典型结电容等图表。 6. 应用信息:文档提供了订购信息,包括部件编号、顶标、封装和运输信息。 7. 封装信息:提供了机械案例轮廓和封装尺寸,包括SMA-FL案例403AD的尺寸。
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