HBL5006HT1G

HBL5006 Series LED Shunt The HBL5006 Series are electronic shunts which provide a current bypass in the case of LEDs going into open circuit. LEDs are by nature quite fragile when subjected to transients and surge conditions. There are also many cases where high reliability of the LED lighting must be maintained such as in headlights, lighthouses, bridges, aircraft, runways and so forth. In these cases the low cost addition of the shunt device will provide full assurance that an entire string of LEDs will not extinguish should one LED fail open. The shunt device is also applicable to other loads where circuit continuity is required. The devices are designed to be used with LED string currents from 50 to 350 mA. www.onsemi.com MARKING DIAGRAMS 1 SOD−323 CASE 477 Features HD M 2 • Protection for the Following IEC Standards: • • • • • • Typical Applications • • • • • • 1 SOD−523 CASE 502 SOD−923 CASE 514AB XX M 2 56 M IEC 61000−4−2 (Level 4) ISO 10605 Low ESD Clamping Voltage Automatically Resets Itself if the LED Heals Itself or is Replaced ON−State Voltage Typically 1.1 V OFF−State Current less than 1.0 mA SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant 2 1 LD M = Specific Device Code = Date Code HBL5006 LEDs where Preventive Maintenance is Impractical LED Headlights in Automobiles Automotive LED Applications LEDs with High Reliability Requirements Crowbar Protection for Open Circuit Conditions Overvoltage Protection for Sensitive Circuits Control Circuit ESD 1 + HBL5006 2 − Apply heat sinking to pin 2 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2014 August, 2018 − Rev. 1 1 Publication Order Number: HBL5006/D HBL5006 Series MAXIMUM RATINGS Rating On−State Current, (TA = 25°C) (Note 2) SOD−323 (Note 1) SOD−323 (Note 2) Thermal Resistance, Junction−to−Air (All Packages) Symbol Value Unit IT(AVG) 250 200 mA SOD−523 (Note 1) SOD−523 (Note 2) 300 250 SOD−923 (Note 1) SOD−923 (Note 2) 350 300 SOD−323 (Note 1) SOD−323 (Note 2) qJA 435 550 SOD−523 (Note 1) SOD−523 (Note 2) 360 435 SOD−923 (Note 1) SOD−923 (Note 2) 285 360 Operating Temperature Range (Note 3) Non−Operating Temperature Range Lead Temperature, Soldering (10 Sec) IEC 61000−4−2 Contact (ESD) IEC 61000−4−2 Air (ESD) °C/W TJ −40 to 150 °C TJ 150 °C TL 260 °C ESD ESD ±15 ±15 kV Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Mounted onto a 2−layer, 1000 mm2 per layer, 3 oz Cu, FR4 PCB with pin 2 connected to the heat sink and pin 1 only connected to a signal trace. The heat sinking must be connected to pin 2, which is the LED cathode connection. Normally this device would be mounted on the same copper heat sink and adjacent to the LED(s). If the LED(s) were to go open, then the HBL shunt would now dissipate the power using the same copper heat sink. Since the shunt has a voltage that is nominally 30% of the LED, then the power dissipation would be much lower, and easily handled by the same heat sink as the LED. 2. Mounted onto a 2−layer, 50 mm2 per layer, 1 oz Cu, FR4 PCB. 3. Max operating temperature for DC conditions is 150°C, but not to exceed 175°C for pulsed conditions with low duty cycle or non−repetitive. www.onsemi.com 2 HBL5006 Series ELECTRICAL CHARACTERISTICS (Unless otherwise noted: TA = 25°C) Symbol VBR IH IL VBO IR VT VC Characteristics Breakdown Voltage: The minimum voltage across the device in or at the breakdown region. Measured at IBR = 1 mA. Holding Current: The minimum current required to maintain the device in the on-state. Latching Current: The minimum current required to turn from the off-state to the on-state. Breakover Voltage: The voltage across the device in the breakover region. Off−State Current: The dc value of current that results from the application of the off-state voltage. Measured at 3.3 V. On−State Voltage. Measured at 100 mA. Clamping Voltage TLP (Note 4) IPP = 8 A 6100−4−2 Level 2 equivalent } IEC (±4 kV Contact, ±4 kV Air) IPP = 16 A 6100−4−2 Level 4 equivalent } IEC (±8 kV Contact, ±15 kV Air) Package Min Typ SOD−323 6.2 7.0 SOD−523 6.2 7.0 SOD−923 6.2 7.0 Max V SOD−323 25 40 SOD−523 25 40 SOD−923 25 40 SOD−323 9.0 SOD−523 9.0 SOD−923 9.0 6.5 7.2 8.0 SOD−523 6.5 7.2 8.0 SOD−923 6.5 7.2 8.0 SOD−323 1.0 SOD−523 1.0 SOD−923 1.0 SOD−323 0.9 1.1 1.3 SOD−523 0.9 1.1 1.3 SOD−923 0.9 1.1 1.3 6.5 11.2 SOD−523 6.5 11.2 SOD−923 6.5 11.2 mA mA SOD−323 SOD−323 Unit V mA V V Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4. ANSI/ESD STM5.5.1 − Electrostatic Discharge Sensitivity Testing using Transmission Line Pulse (TLP) Model TLP conditions: Z0 = 50 W, tp = 100 ns, tr = 4 ns, averaging window; t1 = 30 ns to t2 = 60 ns. Current On−state Current Holding Current Latching Current Voltage Off−state Current Breakdown Voltage Breakover Voltage Figure 1. I−V Characteristics www.onsemi.com 3 HBL5006 Series TYPICAL APPLICATION CIRCUIT Typical Application Circuit for HBL5006 Current Source HBL5006 Control Circuit ESD HBL5006 Control Circuit ESD HBL5006 Control Circuit ESD HBL5006 Control Circuit ESD Figure 2. Typical Application Circuit www.onsemi.com 4 HBL5006 Series DEVICE ORDERING INFORMATION Marking Package Shipping† HBL5006HT1G HD SZHBL5006HT1G* HD SOD−323 (Pb−Free) 3000 / Tape & Reel HBL5006XV2T1G 56 SZHBL5006XV2T1G* 56 HBL5006XV2T5G 56 SZHBL5006XV2T5G* 56 HBL5006P2T5G LD SZHBL5006P2T5G* LD Device 3000 / Tape & Reel SOD−523 (Pb−Free) 8000 / Tape & Reel SOD−923 (Pb−Free) 8000 / Tape & Reel †For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. *SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable. www.onsemi.com 5 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS 2 1 STYLE 1 SOD−323 CASE 477−02 ISSUE H 2 SCALE 4:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. LEAD THICKNESS SPECIFIED PER L/F DRAWING WITH SOLDER PLATING. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 5. DIMENSION L IS MEASURED FROM END OF RADIUS. HE D b 1 2 E A3 A C NOTE 3 DATE 13 MAR 2007 1 STYLE 2 L A1 NOTE 5 MILLIMETERS DIM MIN NOM MAX A 0.80 0.90 1.00 A1 0.00 0.05 0.10 A3 0.15 REF b 0.25 0.32 0.4 C 0.089 0.12 0.177 D 1.60 1.70 1.80 E 1.15 1.25 1.35 L 0.08 HE 2.30 2.50 2.70 INCHES NOM MAX 0.035 0.040 0.002 0.004 0.006 REF 0.010 0.012 0.016 0.003 0.005 0.007 0.062 0.066 0.070 0.045 0.049 0.053 0.003 0.090 0.098 0.105 MIN 0.031 0.000 GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT* XX M 0.63 0.025 STYLE 1 0.83 0.033 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. 2.85 0.112 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DESCRIPTION: 98ASB17533C SOD−323 STYLE 2 XX = Specific Device Code M = Date Code 1.60 0.063 DOCUMENT NUMBER: XX M STYLE 1: PIN 1. CATHODE (POLARITY BAND) 2. ANODE STYLE 2: NO POLARITY Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS 2 2 1 1 STYLE 1 STYLE 2 SOD−523 CASE 502−01 ISSUE E SCALE 4:1 −X− D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. −Y− E M 2 X Y DIM A b c D E HE L L2 TOP VIEW A c HE MILLIMETERS MIN NOM MAX 0.50 0.60 0.70 0.25 0.30 0.35 0.07 0.14 0.20 1.10 1.20 1.30 0.70 0.80 0.90 1.50 1.60 1.70 0.30 REF 0.15 0.20 0.25 GENERIC MARKING DIAGRAM* SIDE VIEW 2X XX L 1 XX 2 1 STYLE 1 2X XX M L2 RECOMMENDED SOLDERING FOOTPRINT* PACKAGE OUTLINE = Specific Device Code Date Code STYLE 1: PIN 1. CATHODE (POLARITY BAND) 2. ANODE 1.80 0.48 2 STYLE 2 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. BOTTOM VIEW 2X M b 0.08 1 M 2X DATE 28 SEP 2010 2X STYLE 2: NO POLARITY 0.40 DIMENSION: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON11524D SOD−523 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOD−923 CASE 514AB ISSUE D STYLE 1 DATE 03 SEP 2020 STYLE 2 SCALE 8:1 D −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. 5. DIMENSION L WILL NOT EXCEED 0.30mm. −Y− E 1 2X b 0.08 X Y 2 TOP VIEW c HE SIDE VIEW 2X 2X BOTTOM VIEW PACKAGE OUTLINE XM XM STYLE 1 STYLE 2 X M SOLDERING FOOTPRINT* = Specific Device Code = Date Code *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. 1.20 2X INCHES MIN NOM MAX 0.013 0.015 0.016 0.006 0.008 0.010 0.003 0.005 0.007 0.030 0.031 0.033 0.022 0.024 0.026 0.037 0.039 0.041 0.007 REF 0.002 0.004 0.006 GENERIC MARKING DIAGRAM* L L2 2X 0.36 MILLIMETERS MIN NOM MAX 0.34 0.37 0.40 0.15 0.20 0.25 0.07 0.12 0.17 0.75 0.80 0.85 0.55 0.60 0.65 0.95 1.00 1.05 0.19 REF 0.05 0.10 0.15 DIM A b c D E HE L L2 A 0.25 STYLE 1: PIN 1. CATHODE (POLARITY BAND) 2. ANODE STYLE 2: NO POLARITY DIMENSIONS: MILLIMETERS See Application Note AND8455/D for more mounting details *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON23284D Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. SOD−923, 1.0x0.6x0.37, MAX HEIGHT 0.40 PAGE 1 OF 1 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative