KA2803BDTF

KA2803 Earth Leakage Detector Description The KA2803 is designed for use in earth leakage circuit interrupters, for operation directly off the AC line in breakers. The input of the differential amplifier is connected to the secondary coil of Zero Current Transformer (ZCT). The amplified output of differential amplifier is integrated at external capacitor to gain adequate time delay. The level comparator generates a high level when earth leakage current is greater than the fixed level. 8 Features • • • • • • • • • • www.onsemi.com Low Power Consumption: 5 mW, 100 V/200 V Built-in Voltage Regulator High-gain Differential Amplifier 0.4 mA Output Current Pulse to Trigger SCRs Low External Part Count SOP Package, High Packing Density High Noise Immunity, Large Surge Margin Super Temperature Characteristic of Input Sensitivity Wide Operating Temperature Range: TA=−25°C to +80°C for KA2803B and KA2803BDTF TA = −25°C to +100°C for KA2803CDTF Operation from 12 V to 20 V Input 1 SOIC8 CASE 751EB PDIP−8 CASE 626−05 MARKING DIAGRAM $Y&Z&2&K KA2803X Functions $Y &Z &2 &K KA2803B or KA2803X • Differential Amplifier • Level Comparator • Latch Circuit $Y&Z&2&K KA2803B = ON Semiconductor Logo = Assembly Plant Code = Data Code (Year & Week) = Lot = Specific Device Code X = B or C ORDERING INFORMATION See detailed ordering and shipping information on page 10 of this data sheet. © Semiconductor Components Industries, LLC, 2016 June, 2019 − Rev. 6 1 Publication Order Number: KA2803/D KA2803 BLOCK DIAGRAM Figure 1. Block Diagram PIN CONFIGURATION VR 1 8 VCC VI 2 7 OS GND 33 6 3 NR OD 4 5 SC Figure 2. Pin Assignment PIN DESCRIPTION Pin No. Name Description 1 VR Non inverting input for current sensing amplifier 2 VI Inverting Input for current sensing amplifier 3 GND 4 OD Output of current sensing amplifier 5 SC Input of latch circuit 6 NR Noise absorption 7 OS Gate drive for external SCR 8 VCC Ground Power supply input for KA2803 circuitry www.onsemi.com 2 KA2803 APPLICATION CIRCUITS Figure 3. Full-wave Application Circuit Figure 4. Half-wave Application Circuit APPLICATION INFORMATION (Refer to full-wave application circuit in Figure 3) (KA2803). The range of RP is from several hundred W to several kW. Capacitor C1 is for the noise canceller and a standard value of C1 is 0.047 mF. Capacitor C2 is also a noise canceller capacitance, but it is not usually used. When high noise is present, a 0.047 mF capacitor may be connected between Pins 6 and 7. The amplified signal finally appears at the Pin 7 with pulse signal through the internal latch circuit of the KA2803. This signal drives the gate of the external SCR, which energizes the trip coil, which opens the circuit breaker. The trip time of the breaker is determined by capacitor C3 and the mechanism breaker. This capacitor should be selected under 1 mF to satisfy the required trip time. The full-wave bridge supplies power to the KA2803 during both the positive and negative half cycles of the line voltage. This allows the hot and neutral lines to be interchanged. Figure 3 shows the KA2803 connected in a typical leakage current detector system. The power is applied to the VCC terminal (Pin 8) directly from the power line. The resistor RS and capacitor CS are chosen so that Pin 8 voltage is at least 12 V. The value of CS is recommended above 1 mF. If the leakage current is at the load, it is detected by the Zero Current Transformer (ZCT). The output voltage signal of ZCT is amplified by the differential amplifier of the KA2803 internal circuit and appears as a half-cycle sine wave signal referred to input signal at the output of the amplifier. The amplifier closed-loop gain is fixed about 1000 times with internal feedback resistor to compensate for Zero Current Transformer (ZCT) variations. The resistor RL should be selected so that the breaker satisfies the required sensing current. The protection resistor RP is not usually used when high current is injected at the breaker; this resistor should be used to protect the earth leakage detector IC www.onsemi.com 3 KA2803 ABSOLUTE MAXIMUM RATINGS Symbol Min. Parameter Max. Unit VCC Supply Voltage 20 V ICC Supply Current 8 mA PD Power Dissipation 300 mW TL Lead Temperature, Soldering 10 Seconds 260 °C TA Operation Temperature Range for KA2803B and KA2803BDTF −25 80 °C Operation Temperature Range for KA2803CDTF −25 +100 °C Storage Temperature Range −65 +150 °C TSTG Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. RECOMMENDED OPERATING CONDITIONS (For KA2803B and KA2803BDTF, TA = −25°C to 80°C unless otherwise noted. For KA2803CDTF, TA = −25°C to +100°C unless otherwise noted.) Symbol ICC Parameter Supply Current 1 Conditions VCC = 12V, VR = OPEN, VI = 2 V Test Circuit TA = −25°C Min. Typ. Figure 5 TA = +25°C 300 400 TA = +100°C VT IO(D) IO Max. Units 580 mA 530 480 Trip Voltage VCC = 16 V, VR = 2 V~2.02 V, VI = 2 V TA = +25°C Figure 6 14 16 18 mV (ms) Differential Amplifier Current Current 1 VCC = 16 V, VR~VI = 30 mV, VOD = 1.2 V TA = +25°C Figure 8 −12 −20 −30 mA Differential Amplifier Current Current 2 VCC = 16 V, VOD = 0.8 V,VR, VI Short = VP TA = +25°C Figure 9 17 27 37 Output Current VSC = 1.4 V, VOS = 0.8 V, VCC = 16.0 V TA= −25°C Figure 10 200 400 800 TA= +25°C 200 400 800 TA= +100°C 100 300 600 mA VSCON Latch-On Voltage VCC = 16 V Figure 11 0.7 1.0 1.4 V ISCON Latch Input Current VCC = 16 V Figure 12 −13 −7 −1 mA IOSL Output Low Current VCC = 12 V, VOSL = 0.2 V Figure 13 200 800 1400 mA VIDC Differential Input Clamp Voltage VCC = 16 V, IIDC = 100 mA Figure 14 0.4 1.2 2.0 V VSM Maximum Current Voltage ISM = 7 mA Figure 15 20 24 28 V IS2 Supply Current 2 VCC = 12.0 V, VOSL = 0.6 V Figure 16 200 400 900 mA Latch-Off Supply Voltage VOS = 12.0 V Figure 17 7 8 9 V Figure 18 2 3 4 ms VSOFF VSC = 1.8 V IIDC = 100.0 mA tON Response Time VCC = 16 V, VR−VI = 0.3 V, 1 V < VX < 5 V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 1. Guaranteed by design, not tested in production. www.onsemi.com 4 KA2803 TEST CIRCUITS 0.047 mF 0.047 mF Figure 5. Supply Current 1 Figure 6. Trip Voltage 0.047 mF Figure 7. VPN1 for VP Measurement Figure 8. Differential Amplifier Output Current 1 0.047 mF Figure 9. Differential Amplifier Output Current 2 Figure 10. Output Current www.onsemi.com 5 KA2803 TEST CIRCUITS (Continued) 0.047 mF 0.047 mF Figure 11. Latch-On Voltage Figure 12. Latch Input Current 0.047 mF 0.047 mF Figure 13. Output Low Current Figure 14. Differential Input Clamp Voltage 0.047 mF 0.047 mF Figure 15. Maximum Current Voltage Figure 16. Supply Current 2 0.047 mF 0.047 mF 0.047 mF Figure 17. Latch-Off Supply Voltage Figure 18. Response Time www.onsemi.com 6 KA2803 TYPICAL PERFORMANCE CHARACTERISTICS Figure 19. Supply Current Figure 20. Differential Amplifier Output Current (VR − VI = 30 mV, VOD = 1.2 V) Figure 21. Differential Amplifier Output Current (VR, VI = VP, VOD = 0.8 V) Figure 22. Output Current Figure 23. Output Low Current Figure 24. VCC Voltage vs. Supply Current 1 www.onsemi.com 7 KA2803 TYPICAL PERFORMANCE CHARACTERISTICS (Continued) Figure 25. Differential Amplifier Output Current 1 Figure 26. Differential Amplifier Output Figure 27. Latch Input Current Figure 28. Output Low Current Figure 29. Output Current Figure 30. VCC Voltage vs. Supply Current 2 www.onsemi.com 8 KA2803 TYPICAL PERFORMANCE CHARACTERISTICS (Continued) Figure 31. Differential Input Clamp Voltage Figure 32. Latch−Off Supply Voltage Figure 33. Latch−On Input Voltage Figure 34. Maximum Supply Figure 35. Trip and Output Figure 36. Output Response Time www.onsemi.com 9 KA2803 ORDERING INFORMATION Part Number Operating Temperature Range Package Shipping† KA2803CDTF −25 to +100°C 8-lead, Small Outline Package (SOP) 3,000 / Tape& Reel KA2803B −25 to 80°C 8-lead, Plastic Dual Inline Package (PDIP) 3,000 / Tube KA2703BDTF −25 to 80°C 8-lead, Small Outline Package (SOP) 3,000 / Tape& Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 10 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS PDIP−8 CASE 626−05 ISSUE P DATE 22 APR 2015 SCALE 1:1 D A E H 8 5 E1 1 4 NOTE 8 b2 c B END VIEW TOP VIEW WITH LEADS CONSTRAINED NOTE 5 A2 A e/2 NOTE 3 L SEATING PLANE A1 C D1 M e 8X SIDE VIEW b 0.010 eB END VIEW M C A M B M NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACKAGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3. 4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE NOT TO EXCEED 0.10 INCH. 5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR TO DATUM C. 6. DIMENSION eB IS MEASURED AT THE LEAD TIPS WITH THE LEADS UNCONSTRAINED. 7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE LEADS, WHERE THE LEADS EXIT THE BODY. 8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE CORNERS). DIM A A1 A2 b b2 C D D1 E E1 e eB L M INCHES MIN MAX −−−− 0.210 0.015 −−−− 0.115 0.195 0.014 0.022 0.060 TYP 0.008 0.014 0.355 0.400 0.005 −−−− 0.300 0.325 0.240 0.280 0.100 BSC −−−− 0.430 0.115 0.150 −−−− 10 ° MILLIMETERS MIN MAX −−− 5.33 0.38 −−− 2.92 4.95 0.35 0.56 1.52 TYP 0.20 0.36 9.02 10.16 0.13 −−− 7.62 8.26 6.10 7.11 2.54 BSC −−− 10.92 2.92 3.81 −−− 10 ° NOTE 6 GENERIC MARKING DIAGRAM* STYLE 1: PIN 1. AC IN 2. DC + IN 3. DC − IN 4. AC IN 5. GROUND 6. OUTPUT 7. AUXILIARY 8. VCC XXXXXXXXX AWL YYWWG XXXX A WL YY WW G = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. DOCUMENT NUMBER: DESCRIPTION: 98ASB42420B PDIP−8 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC8 CASE 751EB ISSUE A DOCUMENT NUMBER: DESCRIPTION: 98AON13735G SOIC8 DATE 24 AUG 2017 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. 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